semiconductor
共 157 篇文章
semiconductor 相关的电子技术资料，包括技术文档、应用笔记、电路设计、代码示例等，共 157 篇文章，持续更新中。
Datasheet for ST17H26 蓝牙芯片产品详细信息
<p>Legal Disclaimer Lenze Semiconductor reserves the right to make changes without further notice to any products herein to improve reliability, function or design. Lenze Semiconductor disclaims any a
POE技术解析
<p>以太网供电（POE）概述POE（Power Over Ethernet）指的是在现有的以太网 Cat.5布线基础架构不作做何改动的情况下，在为一些基于IP的终端（如IP电话机、无线局域网接入点AP、网络摄像机等）传输数据信号的同时，还能为此类设备提供直流供电的技术。POE技术能在确保现有结构化布线安全的同时保证现有网络的正常运作，最大限度地降低成本。</p><p>POE也被称为基于局域网的供
单板电磁兼容EMC设计
<p>说明：原文（英语）来自Freescale Semiconductor，Inc.的应用文档，作者，T.C.Lun，Applications Engineering，Microcontroller Division，Hong Kong.</p><p>文档分为下列几个部分：PART 1 观EMC PART 2器件的选择及电路的设计</p><p>PART 3印刷电路板layout技术</p><p>附
功率半导体器件基础(Baliga)
<p>功率器件领域的经典著作，值得品读和学习，紧跟时代</p><p>Fundamentals of Power
Semiconductor Devices</p>
DP转HDMI转换原理图
<p>CH7525 is a low-cost, low-power semiconductor device that translates the DisplayPort signal to HDMI/DVI. This innovative DisplayPort receiver with an integrated HDMI Transmitter is specially design
半导体制冷温度控制系统的设计研究
<p>在半导体制冷技术的工作性能及其优缺点研究的基础上,设计了以单片机为核心控制元件,以TEC1-12706为执行元件的半导体制冷温度控制系统。采用高精度分段式PID控制算法配合PWM输出控制的方法实现温度控制;选择数字传感器DS18B20为温度检测元件,还包含1602液晶显示模块、按键调整输入模块和H桥驱动模块等。实际测试表明,该系统结构简单易行,操作方便,工作性能优良,同时针对该系统专门设计的
VCSELs and EELs
<p>InGaAs/AlGaAs semiconductor lasers come in three<br/>types: VCSELs and two types of EELs. The VCSEL, as<br/>its name implies, emits vertically, normal to the plane<br/>of the device, owing to cavit
半导体器件完全指南complete guide to semiconductor devices K
<p>半导体器件完全指南complete guide to semiconductor devices Kwok.k.Ng 科学 翻译版.pdf</p>
nrf52832官方的参考设计包括电路原理图和pcb
<p>该资源是nordic semiconductor的官方给出的nrf52832芯片参考设计电路，里面包括原理图（含天线），和PCB。很实用。</p>
Fundamentals of Semiconductor Manufacturing And Process Control
<p>半导体生产和过程控制的基础 这是一本系统介绍芯片生产工艺基础的好书，叙事严谨，条理清晰，值得一看</p>
芯片制造技术-半导体研磨类技术资料合集“ Semiconductor-半导体基础知识.pdf 半导体
<p>芯片制造技术-半导体研磨类技术资料合集“</p><p>Semiconductor-半导体基础知识.pdf</p><p>半导体-第十六讲-新型封装.ppt</p><p>半导体CMP工艺介绍.ppt</p><p>半导体IC工艺流程.doc</p><p>半导体制造工艺第10章-平-坦-化.ppt</p><p>半导体封装制程及其设备介绍.ppt</p><p>半导体晶圆的生产工艺流程介绍.doc<im
半导体抛光、切片、清洗、研磨资料合集
半导体切片
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芯片封装详细图解.ppt
5.1M2019-10-08 11:29
切片机张刀对切片质量的影响-45所.doc
152KB2019-10-08 11:29
内圆切片机设计.pdf
1.3M2019-10-08 11:29
厚硅片的高速激光切片研究.pdf
931KB2019-10-08 11:29
多晶硅片生产工艺介绍.ppt
7M2019-10-08 11
VIP专区-3000套PLC实例程序
<font color="red">资源包含以下内容：</font><br/>1.2 COMP CHILLER.rar<br/>2.20-COMM-E Adapter Diagnostics.zip<br/>3.3 Phase Motor Startup Logic.zip<br/>4.500编程实例.rar<br/>5.550 OPTICOLOUR MOINITORING TM EDIT.rar
Design for Manufacturability and Statistical
Design for manufacturability and statistical design encompass a number<br />
of activities and areas of study spanning the integrated circuit design and<br />
manufacturing worlds. In the early days o
Power+Electronic+Modules+Design+Manufacture
A power semiconductor module is basically a power circuit of different<br />
materials assembled together using hybrid technology, such as semiconduc-<br />
tor chip attachment, wire bonding, encapsul
Power Electronics Handbook, 3 Edition
There have been many developments in the field of power electronics since<br />
the publication of the second edition, almost five years ago. Devices have<br />
bec
GaN-on-Si+Displace+Si+and+SiC
GaN is an already well implanted semiconductor<br />
technology, widely diffused in the LED optoelectronics<br />
industry. For about 10 years, GaN devices have also been<br />
developed for RF wirele
ESD-Phenomena-and-the-Reliability
As we enter the next millennium, there are clear technological patterns. First, the<br />
electronic industry continues to scale microelectronic structures to achieve faster<br />
devices, new devices
Basic ESD Design Guidelines
ESD is a crucial factor for integrated circuits and influences their quality and reliability.<br />
Today increasingly sensitive processes with deep sub micron structures are developed. The<br />
inte
ESD+Basics
This text, ESD Basics: From Semiconductor Manufacturing to Product Use was initiated on<br />
the need to produce a text that addresses fundamentals of electrostatic discharge from the<br />
manufactu