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pol

  • 用无网格法计算VAN DE pol 振子

    用无网格法计算VAN DE pol 振子

    标签: VAN pol DE 网格

    上传时间: 2017-07-13

    上传用户:wsf950131

  • 新型集成电路简化嵌入式pol DC/DC转换器设计

    0368、新型集成电路简化嵌入式pol DC/DC转换器设计

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    上传时间: 2014-04-09

    上传用户:fengzimili

  • 嵌入式pol DC/DC转换器设计

    0343、嵌入式pol DC/DC转换器设计

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    上传时间: 2014-04-09

    上传用户:myworkpost

  • 利用纤巧型负载点电路来简化电源电压的跟踪和排序

      Multiple-voltage electronics systems often requirecomplex supply voltage tracking or sequencing, whichif not met, can result in system faults or even permanentfailures in the fi eld. The design diffi culties in meetingthese requirements are often compounded in distributedpowerarchitectures where point-of-load (pol) DC/DCconverters or linear regulators are scattered across PCboard space, sometimes on different board planes. Theproblem is that power supply circuitry is often the lastcircuitry to be designed into the board, and it must beshoehorned into whatever little board real estate is left.Often, a simple, drop-in, fl exible solution is needed tomeet these requirements.

    标签: 负载点电路 电源电压 排序

    上传时间: 2013-10-07

    上传用户:15071087253

  • DN385 10A高性能点的负载DC/DC微型模块

      Advancements in board assembly, PCB layout anddigital IC integration have produced a new generationof densely populated, high performance systems. Theboard-mounted point-of-load (pol) DC/DC power suppliesin these systems are subject to the same demandingsize, high power and performance requirements asother subsystems. The rigorous new pol demands aredifficult to meet with traditional controller or regulatorICs, or power modules.

    标签: DC 385 10A DN

    上传时间: 2014-12-24

    上传用户:lbbyxmraon

  • 使用新电源模块改进表面贴装可制造性

    The latest generation of Texas Instruments (TI) boardmountedpower modules utilizes a pin interconnect technologythat improves surface-mount manufacturability.These modules are produced as a double-sided surfacemount(DSSMT) subassembly, yielding a case-less constructionwith subcomponents located on both sides of theprinted circuit board (PCB). Products produced in theDSSMT outline use the latest high-efficiency topologiesand magnetic-component packaging. This providescustomers with a high-efficiency, ready-to-use switchingpower module in a compact, space-saving package. Bothnonisolated point-of-load (pol) switching regulators andthe isolated dc/dc converter modules are being producedin the DSSMT outline.TI’s plug-in power product line offers power modules inboth through-hole and surface-mount packages. The surfacemountmodules produced in the DSSMT outline use asolid copper interconnect with an integral solder ball fortheir

    标签: 电源模块 可制造性 表面贴装

    上传时间: 2013-10-10

    上传用户:1184599859

  • Palm_OS的代码

    Palm_OS的代码,关于pol的源代码。

    标签: Palm_OS 代码

    上传时间: 2015-05-28

    上传用户:huql11633

  • 由于更高的集成度、更快的处理器运行速度以及更小的特征尺寸

    由于更高的集成度、更快的处理器运行速度以及更小的特征尺寸,内核及I/O电压的负载点(pol)处理器电源设计变得越来越具挑战性。处理器技术的发展必须要和pol电源设计技术相匹配。对当今的高性能处理器而言,5年或10年以前使用的电源管理解决方案可能已不再行之有效。因此,当为德州仪器(TI)的DaVinci数字信号处理器(DSP)进行pol电源解决方案设计时,充分了解基本电源技术可以帮助克服许多设计困难。本文以一个基于TI电源管理产品的电源管理参考设计为例,讨论一系列适用于DaVinci处理器的电源去耦、浪涌电流、稳压精度和排序技术。

    标签: 集成 处理器 运行速度 特征

    上传时间: 2014-01-05

    上传用户:363186

  • 单片机元素

    各种 AND                 与门 ANTENNA                 天线 BATTERY                 直流电源 BELL                 铃,钟 BVC                 同轴电缆接插件 BRIDGE 1             整流桥(二极管) BRIDGE 2             整流桥(集成块) BUFFER                 缓冲器 BUZZER                 蜂鸣器 CAP                 电容 CAPACITOR             电容 CAPACITOR pol             有极性电容 CAPVAR                 可调电容 CIRCUIT BREAKER             熔断丝 COAX                 同轴电缆 CON                 插口 CRYSTAL                 晶体振荡器

    标签: 单片机 元素

    上传时间: 2017-04-27

    上传用户:韩亚楠999

  • 全志A20核心板配套开发底板Cadence原理图+ Pads2005格式PCB文件+转换后的AD格式

    全志A20核心板配套开发底板Cadence原理图+ Pads2005格式PCB文件+转换后的AD格式原理图PCB文件:A20_DVK1_BASE_V16_Altium_Designer15.PcbDocA20_DVK1_BASE_V16_BOM_20151015.xlsxA20_DVK1_BASE_V16_Gerber制板文件.rarA20_DVK1_BASE_V16_PADS2005_PCB30.pcbA20_DVK1_BASE_V16_PADS2005_PCB_ASCII.PcbDocA20_DVK1_BASE_V16_PADS9.5.pcba20_dvk1_base_v16_SCH_20151015.pdfA20_DVK1_BASE_V16_元件位置查找图_20151102.pdfA20_DVK1_BASE_V16_原理图_OrCAD16.5.DSNA20_DVK1_BASE_V16_导出到AD格式的原理图和PCBA20_DVK1_BASE_V16_导出到AD格式的原理图和PCB.rarA20_DVK1_BASE_V16_顶层元件编号丝印图_20151102.pdfA20_DVK1_BASE_V16_顶层元件规格丝印图_20151102.pdf主要器件如下:Library Component Count : 58Name                Description----------------------------------------------------------------------------------------------------ANTBATTERY_1BEAD                CAPCAP NP              贴片电容,Y5V,6.3V,2.2uF,+80%-20%,0603CAP NP_2_Dup1       X5RCAP NP_Dup2         0402 1uF X5R 6.3V +/-10%CAP NP_Dup3         0402 1uF X5R 6.3V +/-10%CAPACITOR           CAPACITOR polCON1                CON12               CON3                CON4                CON50               CON6CON6A               CONNECTOR45X4       C_Generic           DB15-VGA_0          DIODE               DIODE DUAL SERIESFM25CL64            FR9886SPGTR         FUSEHOLDER_0        HDMI19_PLUG         HEADER 2            INDUCTOR/SMINDUCTOR_4          C4K-2.5HINDUCTOR_Dup2       INDUCTOR_Dup3       IRM-2638LED_0M93C46_0            MINI USB-B_6        MODULE_CAM_PA0505   PH163539            PLAUSB-AF5P-WSMT_0  PUSHBUTTON_TSKB-2L_0PowerJACK           R1 0805             R1_0805             RES2X4RESISTOR            RESISTOR_Dup1       RESISTOR_Dup2       RESISTOR_V          RJ45_8PGR_Generic           S9013SMD_Dup2       SD_MMC_CARD2_0      TP_5                TestPoint_3TitleBlock_Gongjun  USBPORT2            USB_WIFI_0          XC6204VZ_3          LDO 3.3V 300mA( SOT-25 )rRClamp0524P

    标签: a20 cadence pads

    上传时间: 2021-11-08

    上传用户:nicholas28