《器件封装用户向导》赛灵思产品封装资料
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic pa...
packaging技术资料
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💻 源代码：424
探索先进的电子封装技术，掌握从芯片级到系统级的全面解决方案。Packaging不仅关乎保护敏感电子元件，更在于优化性能、提高可靠性与实现小型化设计。本页面汇集22个精选资源，涵盖先进封装材料、3D封装技术及热管理策略等前沿领域，助力您深入了解微电子封装工艺及其在消费电子、汽车电子乃至航空航天中的广泛应用。无论是初学者还是资深工程师，都能在这里找到宝贵的学习资料和技术灵感。
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查看全部22个资源 »Welcome to MS4W, the no fuss installer for setting up MapServer on Microsoft Windows platforms. The
Welcome to MS4W, the no fuss installer for setting up MapServer on Microsoft Windows platforms. The purpose of this package is to allow all levels of ...
Core Java 2 Volume I - Fundamentals, Seventh Edition Completely revised and up-to-date coverage o
Core Java 2 Volume I - Fundamentals, Seventh Edition Completely revised and up-to-date coverage of Generic programming, restrictions and limitat...
The purpose of this chapter is to bring relative newcomers up to speed in writing, compiling, and pa
The purpose of this chapter is to bring relative newcomers up to speed in writing, compiling, and packaging servlets and JSPs. If you have never devel...
DESCRIPTION The DCP0105 family is a series of high efficiency, 5V input isolated DC/DC converters.
DESCRIPTION The DCP0105 family is a series of high efficiency, 5V input isolated DC/DC converters. In addition to 1W nominal galvanically isolated ...
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