The source code for this package is located in src/gov/nist/sip/proxy. The proxy is a pure JAIN-SIP application: it does not need proprietary nist-sip classes in addition of those defined in JAIN-SIP 1.1, you can substitute the NIST-SIP stack by another JAIN-SIP-1.1 compliant stack and it should interoperate. he proxy can act as presence server and be able to process NOTIFY and SUBSCRIBE requests. If this parameter is disabled, the proxy will simply forward those kind of requests following the appropriate routing decision.
标签： proxy The JAIN-SIP package
上传时间： 2015-11-30
上传用户：ippler8
he source code for this package is located in src/ directory. The JAIN-SIP-SERVICES is a JAIN-SIP application: it does not need proprietary nist-sip classes in addition of those defined in JAIN-SIP 1.1, you can substitute the NIST-SIP stack by another JAIN-SIP-1.1 compliant stack and it should interoperate.
标签： JAIN-SIP-SERVICES directory JAIN-SIP package
上传时间： 2013-12-30
上传用户：caiiicc
ip addr discription , and the ip addr how to located.
标签： addr discription located ip
上传时间： 2016-06-28
上传用户：hustfanenze
6自由度puma机器人仿真程序源码。This is PUMA3d.M, a 3D Matlab Kinematic model of a Puma robot located in the robotics lab of Walla Walla University. The file uses CAD data converted to Matlab using cad2matdemo.m, which is located on the Mathworks central file exchange. ％ ％ This file is still being developed, for the latest version check the ％ Mathworks central file exchange.
标签： robot Kinematic located Matlab
上传时间： 2013-12-23
上传用户：清风冷雨
1. It is located in the root directory - SecurityBuilderDemo.exe. Leave password box blank and click on Security button in order to Add/Remove users and set user rights. Once you entered Security dialog you may select your Supervisor password. 2. Click OK when finished configuring users. Don t forget to disable some features in order to see what happens with GUI elements - menus, and buttons.
标签： SecurityBuilderDemo directory password located
上传时间： 2014-01-23
上传用户：chongcongying
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上传时间： 2013-10-15
上传用户：busterman
The latest generation of Texas Instruments (TI) boardmountedpower modules utilizes a pin interconnect technologythat improves surface-mount manufacturability.These modules are produced as a double-sided surfacemount(DSSMT) subassembly, yielding a case-less constructionwith subcomponents located on both sides of theprinted circuit board (PCB). Products produced in theDSSMT outline use the latest high-efficiency topologiesand magnetic-component packaging. This providescustomers with a high-efficiency, ready-to-use switchingpower module in a compact, space-saving package. Bothnonisolated point-of-load (POL) switching regulators andthe isolated dc/dc converter modules are being producedin the DSSMT outline.TI’s plug-in power product line offers power modules inboth through-hole and surface-mount packages. The surfacemountmodules produced in the DSSMT outline use asolid copper interconnect with an integral solder ball fortheir
上传时间： 2013-10-10
上传用户：1184599859
介绍了一种基于C8051F020单片机的多路压力测量仪。该测量仪选用电阻应变式压力传感器采集压力信号，并经放大电路处理后送入C8051F020单片机，再由C8051F020单片机内部的A/D转换器将采集到的压力信号进行模数转化，然后分别对数据进行存储和显示。该测量仪能测量6路压力信号，并且各测量点都能单独检测和设置。由于采用了C8051F020单片机，简化了硬件电路，增强了抗干扰能力，使得测量仪具有测量精度高，冲击小等特点。 Abstract: A measurement apparatus for multi-channel pressure based on single chip microcomputer is introduced.It can measure 6 channels signal of the pressure，and the pressure measure points can be detection and located individually.The pressure signal sampling is obtained by resistor stress-type pressure sensors，the digital signals of 6 channels are collected through amplifying and adjustment circuit of pressure signals and internal integrated A/D converter of MCU.Finally，and it realizes the function to store and display data separately.C8051F020 was used to made hardware circuit simple，and it also enhanced the anti-interference ability.It features high precision and little impact.
上传时间： 2013-11-16
上传用户：yare
介绍一种基于单片机的多路温度采集及监控系统，能够测量6路温度信号，具有计算机联网功能，各测量点可以单独监控和设置，可根据用户的需求自动控制。测量温度范围为-10 ℃～200 ℃，控制方式采用模拟量调压模式。该系统具有控制精度高、冲击小等特点。 Abstract: A temperature collecting and surveillance-controlling system based on sing-chip microcomputer is introduced. It can measure 6 channel signal of the temperature,and it has a function of network connection.The temperature measure points can be monitored and located, it can be controlled automatic according to user’s demand.The temperature range is -10℃ to 200℃.The model of control is adjustable voltage with simulation. It features high precision and little impact.
上传时间： 2013-10-23
上传用户：bjgaofei
What is New in C51 Version 8.18[Device Support]Added debug support for the NXP P89LPC9408 in the LPC900 EPM Emulator/Programmer.[New Supported Device]Nuvoton W681308 device.[New Supported Device]NXP P89LPC9201, P89LPC9211, P89LPC922A1, P89LPC9241, P89LPC9251, P89LPC9301, P89LPC931A1, P89LPC9331, P89LPC9341, and P89LPC9351 devices.[New Supported Device]SiLabs C8051F500, C8051F501, C8051F504, C8051F505, C8051F506, C8051F507, C8051F508, C8051F509, C8051F510, and C8051F511 devices.[ULINK2 Support]Corrected potential deadlock on ST uPSD targets.[Device Simulation]Corrected simulation of Infineon XC800 MDU.[Device Simulation]Corrected behaviour of EXFn and TOGn on SiLabs C8051F12x/F13x devices.[Device Simulation]Added simulation for Atmel AT89C51RE2, including simulation of second UART.[Cx51 Compiler]Corrected failed initialization on far addresses when the object is located with _at_. 本资料仅供学习评估之用,请勿用于商业用途!请在学习评估24小时内删除.
上传时间： 2013-11-01
上传用户：panpanpan
