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elecfans.com-双面板布线技巧

  • C8051F330低成本智能单相交流电压表方案(取代传统动圈

    C8051F330低成本智能单相交流电压表方案(取代传统动圈表) 该方案采用的http://www.elecfans.com/soft/33/2010/单片机集成度高,资源丰富。与其它类型的http://www.elecfans.com/soft/33/2010/单片机相比,所需要外加的外围器件最少,是做智能单相电流电压表最理想的一款http://www.elecfans.com/soft/33/2010/单片机。

    标签: C8051F330 单相交流 动圈 电压表

    上传时间: 2013-10-27

    上传用户:z754970244

  • 单片机接口技术(C51版)例程源代码

    单片机接口技术(C51版)例程源代码:文件名基本与教材中的例题序号一致,如"例3-2"的源程序为"Ch3-2"。有些程序在使用前请参阅程序开头的注释,这些注释解释了程序使用方法。欢迎到您提出宝贵意见,可到bbs.elecfans.com留言或就具体问题进行交流。

    标签: C51 单片机接口技术 源代码

    上传时间: 2013-10-18

    上传用户:huang111

  • DS1820 C51 子程序 (一线数据传输)

    //芯片资料请到www.elecfans.com查找 //DS1820 C51 子程序//这里以11.0592M晶体为例,不同的晶体速度可能需要调整延时的时间//sbit DQ =P2^1;//根据实际情况定义端口 typedef unsigned char byte;typedef unsigned int  word; //延时void delay(word useconds){  for(;useconds>0;useconds--);} //复位byte ow_reset(void){  byte presence;  DQ = 0; //pull DQ line low  delay(29); // leave it low for 480us  DQ = 1; // allow line to return high  delay(3); // wait for presence  presence = DQ; // get presence signal  delay(25); // wait for end of timeslot  return(presence); // presence signal returned}     // 0=presence, 1 = no part //从 1-wire 总线上读取一个字节byte read_byte(void){  byte i;  byte value = 0;  for (i=8;i>0;i--)  {    value>>=1;    DQ = 0; // pull DQ low to start timeslot    DQ = 1; // then return high    delay(1);  //for (i=0; i<3; i++);     if(DQ)value|=0x80;    delay(6); // wait for rest of timeslot  }  return(value);} //向 1-WIRE 总线上写一个字节void write_byte(char val){  byte i;  for (i=8; i>0; i--) // writes byte, one bit at a time  {    DQ = 0; // pull DQ low to start timeslot    DQ = val&0x01;    delay(5); // hold value for remainder of timeslot    DQ = 1;    val=val/2;  }  delay(5);} //读取温度char Read_Temperature(void){  union{    byte c[2];    int x;  }temp;   ow_reset();  write_byte(0xCC); // Skip ROM  write_byte(0xBE); // Read Scratch Pad  temp.c[1]=read_byte();  temp.c[0]=read_byte();  ow_reset();  write_byte(0xCC); //Skip ROM  write_byte(0x44); // Start Conversion  return temp.x/2;}

    标签: 1820 C51 DS 程序

    上传时间: 2013-11-03

    上传用户:hongmo

  • 自制单片机实验板(89C51)

    自制89C51单片机实验电路板 学习单片机离不开实验,以往单片机的实验往往依赖于仿真机和单片机学习系统,价格昂贵,初学者很难配备。近年来,随着FLASH型单片机的广泛应用,采用软件模拟加写片验证成为一种经济实用的实验方法,以AT89C51单片机为例,其价格不足¥10RMB,而擦、写次数可以有1000次,一块芯片即可做上千次的实验。目前,流行的单片机开发软件Keil可以免费获得用于学习的EVAL版;编程器价格并不昂贵,专门用于写89C51类芯片的编程器价格更低廉(不足百元),而且编程器也是以后开发单片机所必备的工具;相比之下,用于实验的电路板制作比较麻烦,用万用板搭接,只能做些很简单的电路,稍复杂的电路一般要用到双面板,而业余条件下是很难自制双面板的,而且实验电路板主要是用于学习,学完了,也就没有什么使用价值了,所以很多人希望能够廉价地获得。作者在多年单片机教学(包括从事网络教学)的基础上,开发了一块有较多功能但使用单面板的单片机实验板,适于业余爱好者自制。这块实验板采用89C51为主芯片,板上安装了5位数码管,8个发光二极管,四个按钮开关,一个简单的音响电路,一个用于计数实验的振荡器,At24CXXX类芯片插座,X5045芯片插座,RS232串行接口等。使用这块实验板可以进行流水灯、人机界面程序设计、音响、中断、计数器等基本编程练习,还可以学习I2C接口芯片使用、SPI接口芯片使用、与PC机进行串行通讯等目前较为流行的技术。图1是该实验板的电路原理图,从图中可以看出,该实验板由若干块集成电路和一些阻容元件等组成,下面我们就分别介绍。1、发光二极管接口主芯片(U1)的P1端口接了8个发光二极管,这些发光二极管的负极接到P1端口各引脚,而正极则通过一个排电阻(标号为JP4,阻值为470殴)接到正电源端,这样,这些发光二极管亮的条件就U1的P1口相引的引脚为低电平,即如果P1口某引脚输出为0,相应的灯亮,如果输出为1,相应的灯灭。例:MOV P1,#0FH该行程序将使发光二极管L1-L4熄灭,而L5-L8点亮。2、数码管接口U1的P0口和P2口的部份引脚构成了5位LED数码管驱动电路,这里LED数码管采用了共阳型,共阳型数码管的笔段(即对应abcdefgh)引脚是二极管的负极,所有二极管的正极连在一起,构成公共端,即片选端,对于这种数码管的驱动,要求在片选端提供电流,为此,使用了PNP型三极管作为片选端的驱动,共使用5只三极管,所有三极管的发射极连在一起,接到正电源端,它们的基极则分别连到P2.0⋯P2.4,这样,当P2.0⋯P2.4中某引脚输出是高电平时,三极管不导通,不能给相应位的数码管供电,该位数码管的所有笔段都不亮,反之,如果某引脚是低电平时,三极管导通,可以给相应的数码管供电,该位数码管是否点亮,点亮哪些笔段,取决于这些笔段引脚是高或低电平。从图图1 共阳型数LED显示器.....

    标签: 89C51 单片机实验板

    上传时间: 2013-11-14

    上传用户:dingdingcandy

  • Xilinx UltraScale:新一代架构满足您的新一代架构需求(EN)

      中文版详情浏览:http://www.elecfans.com/emb/fpga/20130715324029.html   Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture    The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications.   The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation.   Some of the UltraScale architecture breakthroughs include:   • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50%    • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability   • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization   • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard    • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets   • Greatly enhanced DSP and packet handling   The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.

    标签: UltraScale Xilinx 架构

    上传时间: 2013-11-13

    上传用户:瓦力瓦力hong

  • hspice 2007下载 download

    解压密码:www.elecfans.com 随着微电子技术的迅速发展以及集成电路规模不断提高,对电路性能的设计 要求越来越严格,这势必对用于大规模集成电路设计的EDA 工具提出越来越高的 要求。自1972 年美国加利福尼亚大学柏克莱分校电机工程和计算机科学系开发 的用于集成电路性能分析的电路模拟程序SPICE(Simulation Program with IC Emphasis)诞生以来,为适应现代微电子工业的发展,各种用于集成电路设计的 电路模拟分析工具不断涌现。HSPICE 是Meta-Software 公司为集成电路设计中 的稳态分析,瞬态分析和频域分析等电路性能的模拟分析而开发的一个商业化通 用电路模拟程序,它在柏克莱的SPICE(1972 年推出),MicroSim公司的PSPICE (1984 年推出)以及其它电路分析软件的基础上,又加入了一些新的功能,经 过不断的改进,目前已被许多公司、大学和研究开发机构广泛应用。HSPICE 可 与许多主要的EDA 设计工具,诸如Candence,Workview 等兼容,能提供许多重要 的针对集成电路性能的电路仿真和设计结果。采用HSPICE 软件可以在直流到高 于100MHz 的微波频率范围内对电路作精确的仿真、分析和优化。在实际应用中, HSPICE能提供关键性的电路模拟和设计方案,并且应用HSPICE进行电路模拟时, 其电路规模仅取决于用户计算机的实际存储器容量。 The HSPICE Integrator Program enables qualified EDA vendors to integrate their products with the de facto standard HSPICE simulator, HSPICE RF simulator, and WaveView Analyzer™. In addition, qualified HSPICE Integrator Program members have access to HSPICE integrator application programming interfaces (APIs). Collaboration between HSPICE Integrator Program members will enable customers to achieve more thorough design verification in a shorter period of time from the improvements offered by inter-company EDA design solutions.

    标签: download hspice 2007

    上传时间: 2013-11-10

    上传用户:123312

  • elecfans.com-电子制作400例

    好好保存哦

    标签: elecfans com 400 电子制作

    上传时间: 2013-11-04

    上传用户:inwins

  • elecfans.com-电子制作400例

    好好保存哦

    标签: elecfans com 400 电子制作

    上传时间: 2013-11-20

    上传用户:wangzeng

  • Xilinx UltraScale:新一代架构满足您的新一代架构需求(EN)

      中文版详情浏览:http://www.elecfans.com/emb/fpga/20130715324029.html   Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture    The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications.   The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation.   Some of the UltraScale architecture breakthroughs include:   • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50%    • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability   • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization   • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard    • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets   • Greatly enhanced DSP and packet handling   The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.

    标签: UltraScale Xilinx 架构

    上传时间: 2013-11-21

    上传用户:wxqman

  • PCB板基础知识

    讲述一些PCB相关的布局原则、布线技巧、布线规则等...

    标签: PCB 基础知识

    上传时间: 2013-10-31

    上传用户:robter