PCB Design Considerations and Guidelines for 0.4mm and 0.5mm WLPs
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution....
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution....
C8051FXXX PCB design notes...
多远程二极管温度传感器-Design Considerations for pc thermal management Multiple RDTS (remote diode temperature ...
The main objective of this book is to present all the relevant informationrequired for RF and micr...
RF circuit design theory and application(射频电路设计)...
Trademarks: Trademarks and service marks of Cadence Design Systems, Inc. (Cadence) contained in...
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution....
In this paper, we discuss efficient coding and design styles using verilog. This can beim...
本程序集是Allen I. Holub所写的《Compiler Design in C》一书的附随软件,其中有作者自己编写的词法分析和语法分析工具LeX,occs和LLama,该软件包还包括一个显示C...
《3D Engine Design》的随书源代码,包含完整的3D引擎的源代码...