摘要: 串行传输技术具有更高的传输速率和更低的设计成本, 已成为业界首选, 被广泛应用于高速通信领域。提出了一种新的高速串行传输接口的设计方案, 改进了Aurora 协议数据帧格式定义的弊端, 并采用高速串行收发器Rocket I/O, 实现数据率为2.5 Gbps的高速串行传输。关键词: 高速串行传输; Rocket I/O; Aurora 协议 为促使FPGA 芯片与串行传输技术更好地结合以满足市场需求, Xilinx 公司适时推出了内嵌高速串行收发器RocketI/O 的Virtex II Pro 系列FPGA 和可升级的小型链路层协议———Aurora 协议。Rocket I/O支持从622 Mbps 至3.125 Gbps的全双工传输速率, 还具有8 B/10 B 编解码、时钟生成及恢复等功能, 可以理想地适用于芯片之间或背板的高速串行数据传输。Aurora 协议是为专有上层协议或行业标准的上层协议提供透明接口的第一款串行互连协议, 可用于高速线性通路之间的点到点串行数据传输, 同时其可扩展的带宽, 为系统设计人员提供了所需要的灵活性[4]。但该协议帧格式的定义存在弊端,会导致系统资源的浪费。本文提出的设计方案可以改进Aurora 协议的固有缺陷,提高系统性能, 实现数据率为2.5 Gbps 的高速串行传输, 具有良好的可行性和广阔的应用前景。
上传时间： 2013-11-06
上传用户：smallfish
多远程二极管温度传感器-Design Considerations for pc thermal management Multiple RDTS (remote diode temperature sensing) provides the most accurate method of sensing an IC’s junction temperature. It overcomes thermal gradient and placement issues encountered when trying to place external sensors. PCB component count decreases when using a device that provides multiple inputs.Better temperature sensing improves product performance and reliability. Disk drive data integrity suffers at elevated temperatures. IBM published an article stating that a 5°C rise in operating temperature causes a 15% increase in the drive’s failure rate. The overall performance of a system can be improved by providing a more accurate temperature measurement of the most critical devices allowing them to run just a few degrees hotter.The LM83 directly senses its own temperature and the temperature of three external PN junctions. One is dedicated to the CPU of choice, the other two go to other parts of your system that need thermal monitoring such as the disk drive or graphics chip. The SMBus-compatible LM83 supports SMBus timeout and logic levels. The LM83 has two interrupt outputs; one for user-programmable limits and WATCHDOG capability (INT), the other is a Critical Temperature Alarm output (T_CRIT_A) for system power supply shutdown.
标签： Considerat Design 远程 二极管
上传时间： 2014-12-21
上传用户：ljd123456
With the Altera Nios II embedded processor, you as the system designercan accelerate time-critical software algorithms by adding custominstructions to the Nios II processor instruction set. Using custominstructions, you can reduce a complex sequence of standard instructionsto a single instruction implemented in hardware. You can use this featurefor a variety of applications, for example, to optimize software innerloops for digital signal processing (DSP), packet header processing, andcomputation-intensive applications. The Nios II configuration wizard,part of the Quartus® II software’s SOPC Builder, provides a graphicaluser interface (GUI) used to add up to 256 custom instructions to theNios II processor
上传时间： 2013-11-07
上传用户：swing
Abstract: This application note illustrates the flexibility of the MAX7060 ASK/FSK transmitter. While the currently available evaluationkit (EV kit) has been optimized for the device's use in a specific frequency band (i.e., 288MHz to 390MHz), this document addresseshow the EV kit circuitry can be modified for improved operation at 433.92MHz, a frequency commonly used in Europe. Twoalternative match and filter configurations are presented: one for optimizing drain efficiency, the other for achieving higher transmitpower. Features and capabilities of earlier Maxim industrial, scientific, and medical radio-frequency (ISM-RF) transmitters areprovided, allowing comparison of the MAX7060 to its predecessors. Several design guidelines and cautions for using the MAX7060are discussed.
上传时间： 2013-11-14
上传用户：swaylong
Agilent AN 154 S-Parameter Design Application Note S参数的设计与应用 The need for new high-frequency, solid-state circuitdesign techniques has been recognized both by microwaveengineers and circuit designers. These engineersare being asked to design solid state circuitsthat will operate at higher and higher frequencies.The development of microwave transistors andAgilent Technologies’ network analysis instrumentationsystems that permit complete network characterizationin the microwave frequency rangehave greatly assisted these engineers in their work.The Agilent Microwave Division’s lab staff hasdeveloped a high frequency circuit design seminarto assist their counterparts in R&D labs throughoutthe world. This seminar has been presentedin a number of locations in the United States andEurope.From the experience gained in presenting this originalseminar, we have developed a four-part videotape, S-Parameter Design Seminar. While the technologyof high frequency circuit design is everchanging, the concepts upon which this technologyhas been built are relatively invariant.The content of the S-Parameter Design Seminar isas follows:
标签： S参数
上传时间： 2013-12-19
上传用户：aa54
Nios II定制指令用户指南：With the Altera Nios II embedded processor, you as the system designer can accelerate time-critical software algorithms by adding custom instructions to the Nios II processor instruction set. Using custom instructions, you can reduce a complex sequence of standard instructions to a single instruction implemented in hardware. You can use this feature for a variety of applications, for example, to optimize software inner loops for digital signal processing (DSP), packet header processing, and computation-intensive applications. The Nios II configuration wizard,part of the Quartus® II software’s SOPC Builder, provides a graphical user interface (GUI) used to add up to 256 custom instructions to the Nios II processor. The custom instruction logic connects directly to the Nios II arithmetic logic unit (ALU) as shown in Figure 1–1.
上传时间： 2013-10-12
上传用户：kang1923
Most designers wish to utilize as much of a device as possible in order to enhance the overallproduct performance, or extend a feature set. As a design grows, inevitably it will exceed thearchitectural limitations of the device. Exactly why a design does not fit can sometimes bedifficult to determine. Programmable logic devices can be configured in almost an infinitenumber of ways. The same design may fit when you use certain implementation switches, andfail to fit when using other switches. This application note attempts to clarify the CPLD softwareimplementation (CPLDFit) options, as well as discuss implementation tips in CoolRunnerTM-IIdesigns in order to maximize CPLD utilization.
上传时间： 2014-01-11
上传用户：a471778
摘要: 串行传输技术具有更高的传输速率和更低的设计成本, 已成为业界首选, 被广泛应用于高速通信领域。提出了一种新的高速串行传输接口的设计方案, 改进了Aurora 协议数据帧格式定义的弊端, 并采用高速串行收发器Rocket I/O, 实现数据率为2.5 Gbps的高速串行传输。关键词: 高速串行传输; Rocket I/O; Aurora 协议 为促使FPGA 芯片与串行传输技术更好地结合以满足市场需求, Xilinx 公司适时推出了内嵌高速串行收发器RocketI/O 的Virtex II Pro 系列FPGA 和可升级的小型链路层协议———Aurora 协议。Rocket I/O支持从622 Mbps 至3.125 Gbps的全双工传输速率, 还具有8 B/10 B 编解码、时钟生成及恢复等功能, 可以理想地适用于芯片之间或背板的高速串行数据传输。Aurora 协议是为专有上层协议或行业标准的上层协议提供透明接口的第一款串行互连协议, 可用于高速线性通路之间的点到点串行数据传输, 同时其可扩展的带宽, 为系统设计人员提供了所需要的灵活性[4]。但该协议帧格式的定义存在弊端,会导致系统资源的浪费。本文提出的设计方案可以改进Aurora 协议的固有缺陷,提高系统性能, 实现数据率为2.5 Gbps 的高速串行传输, 具有良好的可行性和广阔的应用前景。
上传时间： 2013-10-13
上传用户：lml1234lml
There are many manufacturers of dot matrix LCD modules. However, most of these displaysare similar. They all have on-board controllers and drivers capable of displaying alpha numericsand a wide variety of other symbols (including Japanese "Katakana" characters). The internaloperation of LCD controller devices is determined by signals sent from a central processing unit(in this case, a CoolRunner-II CPLD).
标签： CoolRunner-II XAPP 904 LCD
上传时间： 2013-12-17
上传用户：haiya2000
MemCheck Driver Memory Tool The MemCheck code is designed to provide Windows NT/2K/XP driver developers with a tool to help in the detection of the following memory handling issues: Buffer overrun Buffer corruption Buffer use after buffer release Double buffer releases
标签： MemCheck designed Windows develop
上传时间： 2014-12-05
上传用户：weiwolkt
