面向微机电系统组装与封装的微操作装备关键技术
对微机电系统(Micro electro mechanical systems,MEMS)组装与封装工艺的特点进行了总结分析,给出了MEMS组装与封装设备的研究现状。针对MEMS产业发展的特点,分析了...
对微机电系统(Micro electro mechanical systems,MEMS)组装与封装工艺的特点进行了总结分析,给出了MEMS组装与封装设备的研究现状。针对MEMS产业发展的特点,分析了...
1、拷贝注册机到 安装目录如:c:\IAR Systems\Embedded Workbench 6.5\avr应该将 Cracker 放置在avr的上层目录。这里应该是C:\IAR Systems\...
// 学生管理.cpp : Defines the entry point for the application. // #include "stdafx.h" #include "resourc...
// 学生管理.cpp : Defines the entry point for the application. // #include "stdafx.h" #include "resourc...
A major societal challenge for the decades to come will be the delivery of effective medical service...
Lithium–sulfur (Li–S) batteries with high energy density and long cycle life are considered to be on...
power system blockset 官方教程...
DESCRIPTION The Texas Instruments MSP430 family of ultra-low-power microcontrollers consists of seve...
AEC-Q100 qualified • 12 V and 24 V battery systems compliance • 3.3 V and 5 V logic compatible I/O •...
Description The L9352B is an integrated quad low-side power switch to drive inductive loads like val...