The need to develop reliable microelecTronic devices capable of operating at high
speeds with complex functionality requires a better understanding of the factors
that govern the thermal performance of elecTronics. With an increased demand
on system reliability and performance combined with miniaturization of the
devices, thermal consideration has become a crucial factor in the design of elec-
Tronic packages, from chip to system levels.
标签：
Telecommunications
Management
Equipment
Thermal
of
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2020-06-01
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