粮食安全一直是人民生活重点关注的话题，在粮食的储备过程中，对粮食的温湿度以及虫害等的监测是保持粮食安全的重要措施。文中设计了一个通过采用Sub-G Hz频段和CDMA技术进行融合的粮情监测系统，系统将物联网与互联网联合起来，将采集到的数据通过CDMA网络传输到远端的PC上，然后通过上位机对数据分析后进行相应的处理，从而实现对粮食远程的监测与控制。该系统具有传输距离远、成本低和低功耗等特点，具有良好的应用前景。
上传时间： 2013-12-24
上传用户：taiyang250072
A Computer-On-Module, or COM, is a Module with all components necessary for a bootable host computer, packaged as a super component. A COM requires a Carrier Board to bring out I/O and to power up. COMs are used to build single board computer solutions and offer OEMs fast time-to-market with reduced development cost. Like integrated circuits, they provide OEMs with significant freedom in meeting form-fit-function requirements. For all these reasons the COM methodology has gained much popularity with OEMs in the embedded industry. COM Express® is an open industry standard for Computer-On-Modules. It is designed to be future proof and to provide a smooth transition path from legacy parallel interfaces to LVDS (Low Voltage Differential Signaling) interfaces. These include the PCI bus and parallel ATA on the one hand and PCI Express and Serial ATA on the other hand.
上传时间： 2013-11-05
上传用户：Wwill
The NCV7356 is a physical layer device for a single wire data linkcapable of operating with various Carrier Sense Multiple Accesswith Collision Resolution (CSMA/CR) protocols such as the BoschController Area Network (CAN) version 2.0. This serial data linknetwork is intended for use in applications where high data rate is notrequired and a lower data rate can achieve cost reductions in both thephysical media components and in the microprocessor and/ordedicated logic devices which use the network.The network shall be able to operate in either the normal data ratemode or a high-speed data download mode for assembly line andservice data transfer operations. The high-speed mode is onlyintended to be operational when the bus is attached to an off-boardservice node. This node shall provide temporary bus electrical loadswhich facilitate higher speed operation. Such temporary loads shouldbe removed when not performing download operations.The bit rate for normal communications is typically 33 kbit/s, forhigh-speed transmissions like described above a typical bit rate of83 kbit/s is recommended. The NCV7356 features undervoltagelockout, timeout for faulty blocked input signals, output blankingtime in case of bus ringing and a very low sleep mode current.
上传时间： 2013-10-24
上传用户：s蓝莓汁
The CC1101 is a low-cost sub- 1 GHztransceiver designed for very low-powerwireless applications. The circuit is mainlyintended for the ISM (Industrial, Scientific andMedical) and SRD (Short Range Device)frequency bands at 315, 433, 868, and 915MHz, but can easily be programmed foroperation at other frequencies in the 300-348MHz, 387-464 MHz and 779-928 MHz bands.CC1101 is an improved and code compatibleversion of the CC1100 RF transceiver. Themain improvements on the CC1101 include:
上传时间： 2013-11-12
上传用户：363186
混合左右手材料的两个通带分别出现在2.5 GHz和6 GHz处。通过仿真获得S11、S21和色散曲线,从理论上验证了左手特性的存在。具有双左手频带的左手材料将在未来四频器件中得到广泛应用。
上传时间： 2013-11-07
上传用户：lbbyxmoran
基本的编辑工具(GENERAL EDITING FACILITIES) 对象放置(Object Placement) ISIS支持多种类型的对象，每一类型对象的具体作用和功能将在下一章给出。虽然类型不同，但放置对象的基本步骤都是一样的。 放置对象的步骤如下(To place an object:) 1.根据对象的类别在工具箱选择相应模式的图标(mode icon)。 2. Select the sub-mode icon for the specific type of object. 2、根据对象的具体类型选择子模式图标(sub-mode icon)。 3、如果对象类型是元件、端点、管脚、图形、符号或标记，从选择器里(selector)选择你想要的对象的名字。对于元件、端点、管脚和符号，可能首先需要从库中调出。 4、如果对象是有方向的，将会在预览窗口显示出来，你可以通过点击旋转和镜象图标来调整对象的朝向。 5、最后，指向编辑窗口并点击鼠标左键放置对象。对于不同的对象，确切的步骤可能略有不同，但你会发现和其它的图形编辑软件是类似的，而且很直观。 选中对象(Tagging an Object) 用鼠标指向对象并点击右键可以选中该对象。该操作选中对象并使其高亮显示，然后可以进行编辑。
上传时间： 2013-10-29
上传用户：avensy
This document was developed under the Standard Hardware and Reliability Program (SHARP) TechnologyIndependent Representation of Electronic Products (TIREP) project. It is intended for use by VHSIC HardwareDescription Language (VHDL) design engineers and is offered as guidance for the development of VHDL modelswhich are compliant with the VHDL Data Item Description (DID DI-EGDS-80811) and which can be providedto manufacturing engineering personnel for the development of production data and the subsequent productionof hardware. Most VHDL modeling performed to date has been concentrated at either the component level orat the conceptual system level. The assembly and sub-assembly levels have been largely disregarded. Under theSHARP TIREP project, an attempt has been made to help close this gap. The TIREP models are based upon lowcomplexity Standard Electronic Modules (SEM) of the format A configuration. Although these modules are quitesimple, it is felt that the lessons learned offer guidance which can readily be applied to a wide range of assemblytypes and complexities.
上传时间： 2013-11-20
上传用户：pzw421125
为了在CDMA系统中更好地应用QDPSK数字调制方式，在分析四相相对移相（QDPSK)信号调制解调原理的基础上，设计了一种QDPSK调制解调电路，它包括串并转换、差分编码、四相载波产生和选相、相干解调、差分译码和并串转换电路。在MAX+PLUSⅡ软件平台上，进行了编译和波形仿真。综合后下载到复杂可编程逻辑器件EPM7128SLC84-15中，测试结果表明，调制电路能正确选相，解调电路输出数据与QDPSK调制输入数据完全一致，达到了预期的设计要求。 Abstract: In order to realize the better application of digital modulation mode QDPSK in the CDMA system， a sort of QDPSK modulation-demodulation circuit was designed based on the analysis of QDPSK signal modulation-demodulation principles. It included serial/parallel conversion circuit, differential encoding circuit, four-phase carrier wave produced and phase chosen circuit, coherent demodulation circuit, difference decoding circuit and parallel/serial conversion circuit. And it was compiled and simulated on the MAX+PLUSⅡ software platform,and downloaded into the CPLD of EPM7128SLC84-15.The test result shows that the modulation circuit can exactly choose the phase，and the output data of the demodulator circuit is the same as the input data of the QDPSK modulate. The circuit achieves the prospective requirement of the design.
上传时间： 2013-10-28
上传用户：jyycc
半導體的產品很多，應用的場合非常廣泛，圖一是常見的幾種半導體元件外型。半導體元件一般是以接腳形式或外型來劃分類別，圖一中不同類別的英文縮寫名稱原文為 PDID：Plastic Dual Inline Package SOP：Small Outline Package SOJ：Small Outline J-Lead Package PLCC：Plastic Leaded Chip Carrier QFP：Quad Flat Package PGA：Pin Grid Array BGA：Ball Grid Array 雖然半導體元件的外型種類很多，在電路板上常用的組裝方式有二種，一種是插入電路板的銲孔或腳座，如PDIP、PGA，另一種是貼附在電路板表面的銲墊上，如SOP、SOJ、PLCC、QFP、BGA。 從半導體元件的外觀，只看到從包覆的膠體或陶瓷中伸出的接腳，而半導體元件真正的的核心，是包覆在膠體或陶瓷內一片非常小的晶片，透過伸出的接腳與外部做資訊傳輸。圖二是一片EPROM元件，從上方的玻璃窗可看到內部的晶片，圖三是以顯微鏡將內部的晶片放大，可以看到晶片以多條銲線連接四周的接腳，這些接腳向外延伸並穿出膠體，成為晶片與外界通訊的道路。請注意圖三中有一條銲線從中斷裂，那是使用不當引發過電流而燒毀，致使晶片失去功能，這也是一般晶片遭到損毀而失效的原因之一。 圖四是常見的LED，也就是發光二極體，其內部也是一顆晶片，圖五是以顯微鏡正視LED的頂端，可從透明的膠體中隱約的看到一片方型的晶片及一條金色的銲線，若以LED二支接腳的極性來做分別，晶片是貼附在負極的腳上，經由銲線連接正極的腳。當LED通過正向電流時，晶片會發光而使LED發亮，如圖六所示。 半導體元件的製作分成兩段的製造程序，前一段是先製造元件的核心─晶片，稱為晶圓製造；後一段是將晶中片加以封裝成最後產品，稱為IC封裝製程，又可細分成晶圓切割、黏晶、銲線、封膠、印字、剪切成型等加工步驟，在本章節中將簡介這兩段的製造程序。
上传时间： 2013-11-04
上传用户：372825274
ACPR (adjacent channel power ratio), AltCPR (alternatechannel power ratio), and noise are important performancemetrics for digital communication systems thatuse, for example, WCDMA (wideband code division multipleaccess) modulation. ACPR and AltCPR are bothmeasures of spectral regrowth. The power in the WCDMAcarrier is measured using a 5MHz measurement bandwidth;see Figure 1. In the case of ACPR, the total powerin a 3.84MHz bandwidth centered at 5MHz (the carrierspacing) away from the center of the outermost carrier ismeasured and compared to the carrier power. The resultis expressed in dBc. For AltCPR, the procedure is thesame, except we center the measurement 10MHz awayfrom the center of the outermost carrier.
上传时间： 2013-11-02
上传用户：maricle
