企业存储的市场细分：芯片存储（SOLID State Disk ）I/O瓶颈的根本解决方案
上传时间： 2013-12-24
上传用户：
SOLID State Voice Recorder Using Flash MSP430
标签： Recorder SOLID Flash State
上传时间： 2015-04-17
上传用户：alan-ee
This white paper describes a collection of standards, conventions, and guidelines for writing SOLID Java code. They are based on sound, proven software engineering principles that lead to code that is easy to understand, to maintain, and to enhance.
标签： conventions collection guidelines describes
上传时间： 2014-12-08
上传用户：hakim
Exceptional C++ shows by example how to go about SOLID software engineering. Along with a lot of other material, this book includes expanded versions of the first 30 issues of the popular Internet C++ feature Guru of the Week (or, in its short form, GotW), a series of self-contained C++ engineering problems and solutions that illustrate specific design and coding techniques.
标签： Exceptional engineering software example
上传时间： 2017-06-07
上传用户：yt1993410
SOLID physics electronics
标签： electronics physics SOLID
上传时间： 2017-07-22
上传用户：daoxiang126
Finite element program for mechanical problem. It can solve various problem in SOLID problem
标签： problem mechanical element program
上传时间： 2017-09-19
上传用户：风之骄子
并行总线PATA从设计至今已快20年历史，如今它的缺陷已经严重阻碍了系统性能的进一步提高，已被串行ATA(Serial ATA)即SATA总线所取代。SATA作为新一代磁盘接口总线，采用点对点方式进行数据传输，内置数据/命令校验单元，支持热插拔，具有150MB/s(SATA1.0)或300MB/s(SATA2.0)的传输速度。目前SATA已在存储领域广泛应用，但国内尚无独立研发的面向FPGA的SATAIP CORE，在这样的条件下设计面向FPGA应用的SATA IP CORE具有重要的意义。 本论文对协议进行了详细的分析，建立了SATA IP CORE的层次结构，将设备端SATA IP CORE划分成应用层、传输层、链路层和物理层；介绍了实现该IPCORE所选择的开发工具、开发语言和所选用的芯片；在此基础上着重阐述协议IP CORE的设计，并对各个部分的设计予以分别阐述，并编码实现；最后进行综合和测试。 采用FPGA集成硬核RocketIo MGT(RocketIo Multi-Gigabit Transceiver)实现了1.5Gbps的串行传输链路；设计满足协议需求、适合FPGA设计的并行结构，实现了多状态机的协同工作：在高速设计中，使用了流水线方法进行并行设计，以提高速度，考虑到系统不同部分复杂度的不同，设计采用部分流水线结构；采用在线逻辑分析仪Chipscope pro与SATA总线分析仪进行片上调试与测试，使得调试工作方便快捷、测试数据准确；严格按照SATA1.0a协议实现了SATA设备端IP CORE的设计。 最终测试数据表明，本论文设计的基于FPGA的SATA IP CORE满足协议需求。设计中的SATA IP CORE具有使用方便、集成度高、成本低等优点，在固态电子硬盘SSD(SOLID-State Disk)开发中应用本设计，将使开发变得方便快捷，更能够适应市场需求。
上传时间： 2013-06-21
上传用户：xzt
The latest generation of Texas Instruments (TI) boardmountedpower modules utilizes a pin interconnect technologythat improves surface-mount manufacturability.These modules are produced as a double-sided surfacemount(DSSMT) subassembly, yielding a case-less constructionwith subcomponents located on both sides of theprinted circuit board (PCB). Products produced in theDSSMT outline use the latest high-efficiency topologiesand magnetic-component packaging. This providescustomers with a high-efficiency, ready-to-use switchingpower module in a compact, space-saving package. Bothnonisolated point-of-load (POL) switching regulators andthe isolated dc/dc converter modules are being producedin the DSSMT outline.TI’s plug-in power product line offers power modules inboth through-hole and surface-mount packages. The surfacemountmodules produced in the DSSMT outline use aSOLID copper interconnect with an integral solder ball fortheir
上传时间： 2013-10-10
上传用户：1184599859
Agilent AN 154 S-Parameter Design Application Note S参数的设计与应用 The need for new high-frequency, SOLID-state circuitdesign techniques has been recognized both by microwaveengineers and circuit designers. These engineersare being asked to design SOLID state circuitsthat will operate at higher and higher frequencies.The development of microwave transistors andAgilent Technologies’ network analysis instrumentationsystems that permit complete network characterizationin the microwave frequency rangehave greatly assisted these engineers in their work.The Agilent Microwave Division’s lab staff hasdeveloped a high frequency circuit design seminarto assist their counterparts in R&D labs throughoutthe world. This seminar has been presentedin a number of locations in the United States andEurope.From the experience gained in presenting this originalseminar, we have developed a four-part videotape, S-Parameter Design Seminar. While the technologyof high frequency circuit design is everchanging, the concepts upon which this technologyhas been built are relatively invariant.The content of the S-Parameter Design Seminar isas follows:
标签： S参数
上传时间： 2013-12-19
上传用户：aa54
OFELI is an object oriented library of C++ classes for development of finite element codes. Its main features are : * Various storage schemes of matrices (dense, sparse, skyline). * Direct methods of solution of linear systems of equations as well as various combinations of iterative solvers and preconditioners. * Shape functions of most "popular" finite elements * Element arrays of most popular problems (Heat Transfer, Fluid Flow, SOLID Mechanics, Electromagnetics, ...).
标签： development oriented classes element
上传时间： 2015-03-03
上传用户：kbnswdifs
