Today’s digital systems combine a myriad of chips with different voltage configurations.Designers must interface 2.5V processors with 3.3V memories—both RAM and ROM—as wellas 5V buses and multiple peripheral chips. Each chip has specific Power supply needs. CPLDsare ideal for handling the multi-voltage interfacing, but do require forethought to ensure correctoperation.
上传时间： 2013-11-10
上传用户：yy_cn
The CoolRunner-II CPLD is a highly uniform family of fast, low-Power devices. Theunderlying architecture is a traditional CPLD architecture, combining macrocells intofunction blocks interconnected with a global routing matrix, the Xilinx AdvancedInterconnect Matrix (AIM). The function blocks use a PLA configuration that allowsall product terms to be routed and shared among any of the macrocells of the functionblock.
上传时间： 2013-11-03
上传用户：1037540470
The Virtex-4 features, such as the programmable IDELAY and built-in FIFO support, simplifythe bridging of a high-speed, PCI-X core to large amounts of DDR-SDRAM memory. Onechallenge is meeting the PCI-X target initial latency specification. PCI-X Protocol Addendum tothe PCI Local Bus Specification Revision 2.0a ([Ref 6]) dictates that when a target signals adata transfer, "the target must do so within 16 clocks of the assertion of FRAME#." PCItermination transactions, such as Split Response/Complete, are commonly used to meet thelatency specifications. This method adds complexity to the design, as well as additional systemlatency. Another solution is to increase the ratio of the memory frequency to the PCI-X busfrequency. However, this solution increases the required Power and clock resource usage.
上传时间： 2013-11-24
上传用户：18707733937
Xilinx FPGAs require at least two Power supplies: VCCINTfor core circuitry and VCCO for I/O interface. For the latestXilinx FPGAs, including Virtex-II Pro, Virtex-II and Spartan-3, a third auxiliary supply, VCCAUX may be needed. Inmost cases, VCCAUX can share a Power supply with VCCO.The core voltages, VCCINT, for most Xilinx FPGAs, rangefrom 1.2V to 2.5V. Some mature products have 3V, 3.3Vor 5V core voltages. Table 1 shows the core voltagerequirement for most of the FPGA device families. TypicalI/O voltages (VCCO) vary from 1.2V to 3.3V. The auxiliaryvoltage VCCAUX is 2.5V for Virtex-II Pro and Spartan-3, andis 3.3V for Virtex-II.
上传时间： 2013-10-22
上传用户：aeiouetla
Xilinx Next Generation 28 nm FPGA Technology Overview Xilinx has chosen 28 nm high-κ metal gate (HKMG) highperformance,low-Power process technology and combined it with a new unified ASMBL™ architecture to create a new generation of FPGAs that offer lower Power and higher performance. These devices enable unprecedented levels of integration and bandwidth and provide system architects and designers a fully programmable alternative to ASSPs and ASICs.
上传时间： 2013-12-07
上传用户：bruce
WP369可扩展式处理平台-各种嵌入式系统的理想解决方案 ：Delivering unrivaled levels of system performance,flexibility, scalability, and integration to developers,Xilinx's architecture for a new Extensible Processing Platform is optimized for system Power, cost, and size. Based on ARM's dual-core Cortex™-A9 MPCore processors and Xilinx’s 28 nm programmable logic,the Extensible Processing Platform takes a processor-centric approach by defining a comprehensive processor system implemented with standard design methods. This approach provides Software Developers a familiar programming environment within an optimized, full featured,Powerful, yet low-cost, low-Power processing platform.
上传时间： 2013-10-18
上传用户：cursor
印刷电路板（PCB）设计解决方案市场和技术领军企业Mentor Graphics（Mentor Graphics）宣布推出HyperLynx® PI（电源完整性）产品，满足业内高端设计者对于高性能电子产品的需求。HyperLynx PI产品不仅提供简单易学、操作便捷，又精确的分析，让团队成员能够设计可行的电源供应系统；同时缩短设计周期，减少原型生成、重复制造，也相应降低产品成本。随着当今各种高性能/高密度/高脚数集成电路的出现，传输系统的设计越来越需要工程师与布局设计人员的紧密合作，以确保能够透过众多PCB电源与接地结构，为IC提供纯净、充足的电力。配合先前推出的HyperLynx信号完整性（SI）分析和确认产品组件，Mentor Graphics目前为用户提供的高性能电子产品设计堪称业内最全面最具实用性的解决方案。“我们拥有非常高端的用户，受到高性能集成电路多重电压等级和电源要求的驱使，需要在一个单一的PCB中设计30余套电力供应结构。”Mentor Graphics副总裁兼系统设计事业部总经理Henry Potts表示。“上述结构的设计需要快速而准 确的直流压降(DC Power Drop)和电源杂讯(Power Noise)分析。拥有了精确的分析信息，电源与接地层结构和解藕电容数(de-coupling capacitor number)以及位置都可以决定，得以避免过于保守的设计和高昂的产品成本。”
上传时间： 2013-10-31
上传用户：ljd123456
PCB LAYOUT 術語解釋(TERMS)1. COMPONENT SIDE(零件面、正面)︰大多數零件放置之面。2. SOLDER SIDE(焊錫面、反面)。3. SOLDER MASK(止焊膜面)︰通常指Solder Mask Open 之意。4. TOP PAD︰在零件面上所設計之零件腳PAD，不管是否鑽孔、電鍍。5. BOTTOM PAD：在銲錫面上所設計之零件腳PAD，不管是否鑽孔、電鍍。6. POSITIVE LAYER：單、雙層板之各層線路；多層板之上、下兩層線路及內層走線皆屬之。7. NEGATIVE LAYER：通常指多層板之電源層。8. INNER PAD：多層板之POSITIVE LAYER 內層PAD。9. ANTI-PAD：多層板之NEGATIVE LAYER 上所使用之絕緣範圍，不與零件腳相接。10. THERMAL PAD：多層板內NEGATIVE LAYER 上必須零件腳時所使用之PAD，一般稱為散熱孔或導通孔。11. PAD (銲墊)：除了SMD PAD 外，其他PAD 之TOP PAD、BOTTOM PAD 及INNER PAD 之形狀大小皆應相同。12. Moat : 不同信號的 Power& GND plane 之間的分隔線13. Grid : 佈線時的走線格點2. Test Point : ATE 測試點供工廠ICT 測試治具使用ICT 測試點 LAYOUT 注意事項:PCB 的每條TRACE 都要有一個作為測試用之TEST PAD(測試點)，其原則如下：1. 一般測試點大小均為30-35mil，元件分布較密時，測試點最小可至30mil.測試點與元件PAD 的距離最小為40mil。2. 測試點與測試點間的間距最小為50-75mil，一般使用75mil。密度高時可使用50mil,3. 測試點必須均勻分佈於PCB 上，避免測試時造成板面受力不均。4. 多層板必須透過貫穿孔(VIA)將測試點留於錫爐著錫面上(Solder Side)。5. 測試點必需放至於Bottom Layer6. 輸出test point report(.asc 檔案Powerpcb v3.5)供廠商分析可測率7. 測試點設置處:Setuppadsstacks
上传时间： 2013-11-17
上传用户：cjf0304
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch Power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
上传时间： 2013-11-16
上传用户：萍水相逢
|Introduction Basic Concept Tips to layout Power circuit Type of Power circuit Basic Concept Maximum Current calculation Resistance of Copper ideal Power supply & noise Capacitor & Inductor Power consumption Function of Power circuit
上传时间： 2013-12-10
上传用户：JIEWENYU
