USB TO RS232串口驱动，芯片HL-340
上传时间： 2013-06-23
上传用户：royzhangsz
This is a document for CYCLONE Develop Kits type LJ-FN300 FPGANIOS. Wish this would help you to find what kits can be select to use.
标签： FPGANIOS document CYCLONE Develop
上传时间： 2013-08-16
上传用户：563686540
This brief introduce a kind of the framework construction to materialize the system. And an example was given with the discussion on the performence.
标签： construction materialize introduce framework
上传时间： 2013-08-17
上传用户：ysystc699
fpga this will help you to improve you ability
上传时间： 2013-08-19
上传用户：417313137
An intruction to FPGA design
标签： intruction design FPGA An
上传时间： 2013-08-24
上传用户：时代将军
it describe how to develop the field programmable gate array
标签： programmable describe develop array
上传时间： 2013-08-28
上传用户：zhaoq123
Interface 8051 to Coolrunner CPLD(Xilinx App)
标签： Coolrunner Interface Xilinx 8051
上传时间： 2013-09-05
上传用户：bcjtao
power pcb To protel 软件
上传时间： 2013-09-11
上传用户：sunshine1402
gerber-to-protel is a pdf file ,which is used for convert bmp to pcb.
标签： gerber-to-protel file is
上传时间： 2013-09-18
上传用户：liuxinyu2016
This document was developed under the Standard Hardware and Reliability Program (SHARP) TechnologyIndependent Representation of Electronic Products (TIREP) project. It is intended for use by VHSIC HardwareDescription Language (VHDL) design engineers and is offered as guidance for the development of VHDL modelswhich are compliant with the VHDL Data Item Description (DID DI-EGDS-80811) and which can be providedto manufacturing engineering personnel for the development of production data and the subsequent productionof hardware. Most VHDL modeling performed to date has been concentrated at either the component level orat the conceptual system level. The assembly and sub-assembly levels have been largely disregarded. Under theSHARP TIREP project, an attempt has been made to help close this gap. The TIREP models are based upon lowcomplexity Standard Electronic Modules (SEM) of the format A configuration. Although these modules are quitesimple, it is felt that the lessons learned offer guidance which can readily be applied to a wide range of assemblytypes and complexities.
上传时间： 2014-12-23
上传用户：xinhaoshan2016
