Thermal+Management+of+Telecommunications+Equipment
The need to develop reliable microelectronic devices capable of operating at high speeds with complex functionality requires a better understanding of...
Packages技术资料
📦 资源总数：80
💻 源代码：10000
探索电子封装技术的前沿，我们的packages资源库汇集了61个精选项目，涵盖从基础到高级的各种封装解决方案。深入了解SMT、BGA、QFN等主流封装形式的特点与优势，掌握其在消费电子、汽车电子及工业控制领域的广泛应用。无论是初学者还是资深工程师，这里都是您提升技能、解决实际问题的理想之地。立即访问，开启您的专业成长之旅！
🔥 Packages热门资料
查看全部80个资源 »MEMS惯性传感器的焊接指南
Abstract: Standard PCB design and mounting processes can adversely influence MEMS inertial sensors.This application note contains guidelines for the...
NORTi3 is a realtime multitasking operating system conforming to the micro-ITRON 3.0 specification.
NORTi3 is a realtime multitasking operating system conforming to the micro-ITRON 3.0 specification. NORTi3 is divided into two packages: NORTi3 Stand...
The 1.4 release of Java 2 Standard edition brings a load of new features - and the potential for fru
The 1.4 release of Java 2 Standard edition brings a load of new features - and the potential for frustration. Fret not, our new 4th edition has answer...
富士通单片机MB902420系列 CAN Project: CAN0 will work as a simple Repeater. Received data will appear at P
富士通单片机MB902420系列 CAN Project: CAN0 will work as a simple Repeater. Received data will appear at Port P47..P40 (UserLEDs of FlashCan100P) and will...
💻 Packages源代码
查看更多 »📂 Packages资料分类