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找到约 13 项符合 Packaged 的查询结果

技术资料 Thermal Characterization of Packaged Semiconductor Devices

Thermal Characterization of Packaged Semiconductor Devices:With the continuing industry trends towar
https://www.eeworm.com/dl/900792.html
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技术资料 安装笔记四扁平封装无铅包装

Various ON Semiconductor components are packaged in an advanced Quad Flat–pack No–Lead Package (QFN)
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技术资料 板级应用笔记的DFN和QFN封装

Various ON Semiconductor components are packaged in an advanced Dual or Quad Flat−Pack No&#872
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技术资料 安装说明NIS6111无铅封装

Various ON Semiconductor components are packaged in an advanced Quad Flat−Pack No−Lead P
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技术资料 SA8025锁相环频率合成器性能简介 设计实例及常见问题的解答

The SA8025 is a 3V, 1.8GHz, SSOP 20-pin packaged fractional-Nphase locked-loop (PLL) frequency s
https://www.eeworm.com/dl/921531.html
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软件设计/软件工程 The paper presents the CORDIC Algorithm, which has been implemented as an virtual component (IP core

The paper presents the CORDIC Algorithm, which has been implemented as an virtual component (IP core) in a VHDL simulation environment. The core is packaged as a soft (VHDL) macro and it implements all transcenden-tal functions. Analysis of the accuracy of the algorithms implemented shows that the C ...
https://www.eeworm.com/dl/684/260272.html
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资料/手册 LM621无刷电机换向器

General Description The LM621 is a bipolar IC designed for commutation of brushless DC motors. The part is compatible with both three- and four-phase motors. It can directly drive the power switching devices used to drive the motor. The LM621 provides an adjustable dead-time circuit to eliminate ``s ...
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技术资料 LM621无刷电机换向器

General Description The LM621 is a bipolar IC designed for commutation of brushless DC motors. The part is compatible with both three- and four-phase motors. It can directly drive the power switching devices used to drive the motor. The LM621 provides an adjustable dead-time circuit to eliminate ``s ...
https://www.eeworm.com/dl/885274.html
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技术资料 HM62256B Series

The Hitachi HM62256B Series is a CMOS static RAM organized 32,768-word ´ 8-bit. It realizes higher performance and low power consumption by employing 0.8 mm Hi-CMOS process technology. The device, packaged in 8 ´ 14 mm TSOP, 8 ´ 13.4 mm TSOP with thickness of 1.2 mm, 450 mil SOP (foot print pitch ...
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电源技术 雪崩光电二极管的偏置电压和电流检测电路

  Avalanche photodiodes (APDs) are widely utilized in laserbased fiberoptic systems to convert optical data intoelectrical form. The APD is usually packaged with a signalconditioning amplifier in a small module. An APD receivermodule and attendant circuitry appears in Figure 1. TheAPD modul ...
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