The advent of modern wireless devices, such as smart phones and MID 1 terminals, has revolutionized the way people think of personal connectivity. Such devices encompass multiple applications ranging from voice and video to high-speed data transfer via wireless networks. The voracious appetite of twenty-first century users for supporting more wireless applications on a single device is ever increasing. These devices employ multiple radios and modems that cover multiple frequency bands and multiple standards with a manifold of wireless applications often running simultaneously.
标签： Architectures Wireless Receiver Design and
上传时间： 2020-06-01
上传用户：shancjb
Mobile radio communications are evolving from pure telephony systems to multimedia platforms offering a variety of services ranging from simple file transfers and audio and video streaming, to interactive applications and positioning tasks. Naturally, these services have different constraints concerning data rate, delay, and reliability (quality-of-service (QoS)). Hence, future mobile radio systems have to provide a large flexibility and scal- ability to match these heterogeneous requirements.
标签： Communications Wireless Channels MIMO over
上传时间： 2020-06-01
上传用户：shancjb
Wireless Mesh Networks (WMN) are believed to be a highly promising technology and will play an increasingly important role in future generation wireless mobile networks. WMN is characterized by dynamic self-organization, self-configuration and self-healing to enable quick deployment, easy maintenance, low cost, high scalability and reliable services, as well as enhancing network capacity, connect- ivity and resilience.
标签： Networking Wireless Mesh
上传时间： 2020-06-01
上传用户：shancjb
Electrostatic discharge (ESD) is one of the most prevalent threats to the reliability of electronic components. It is an event in which a finite amount of charge is trans- ferred from one object (i.e., human body) to another (i.e., microchip). This process can result in a very high current passing through the microchip within a very short period of time, and, hence, more than 35% of chip damages can be attributed to an ESD-related event. As such, designing on-chip ESD structures to protect integrated circuits against the ESD stresses is a high priority in the semiconductor industry.
标签： Electrostatic Protection Discharge
上传时间： 2020-06-05
上传用户：shancjb
The goal of this book is to introduce the simulation methods necessary to describe the behaviour of semiconductor devices during an electrostatic discharge (ESD). The challenge of this task is the correct description of semiconductor devices under very high current density and high temperature transients. As it stands, the book can be no more than a snapshot and a summary of the research in this field during the past few years. The authors hope that the book will provide the basis for further development of simulation methods at this current frontier of device physics.
标签： Development Protection ESD
上传时间： 2020-06-05
上传用户：shancjb
The challenges associated with the design and implementation of Electro- static Discharge (ESD) protection circuits become increasingly complex as technology is scaled well into nano-metric regime. One must understand the behavior of semiconductor devices under very high current densities, high temperature transients in order to surmount the nano-meter ESD challenge. As a consequence, the quest for suitable ESD solution in a given technology must start from the device level. Traditional approaches of ESD design may not be adequate as the ESD damages occur at successively lower voltages in nano-metric dimensions.
标签： Protection Circuit Device Design ESD and
上传时间： 2020-06-05
上传用户：shancjb
This book on electrostatic discharge phenomena is essentially a translation and update ofa Swedish edition from 1992. The book is intended for people working with electronic circuits and equipments, in application and development. All personnel should be aware of the ESD-hazards, especially those responsible for quality. ESD-prevention is a part of TQM (Total Quality Management). The book is also usable for courses on the subject.
标签： Electronics Scourge ESD The of
上传时间： 2020-06-05
上传用户：shancjb
Guideline Suggestion for High-Speed I/O ESD Protection
标签： ESD_Suggestion_for_HighSpeed_IO_K er
上传时间： 2020-06-05
上传用户：shancjb
ESD is a crucial factor for integrated circuits and influences their quality and reliability. Today increasingly sensitive processes with deep sub micron structures are developed. The integration of more and more functionality on a single chip and saving of chip area is required. Integrated circuits become more susceptible to ESD/EOS related damages. However, the requirements on ESD robustness especially for automotive applications are increasing. ESD failures are very often the reason for redesigns. Much research has been conducted by semiconductor manufacturers on ESD robust design.
标签： Guidelines Design Basic ESD
上传时间： 2020-06-05
上传用户：shancjb
The planarization technology of Chemical-Mechanical-Polishing (CMP), used for the manufacturing of multi- level metal interconnects for high-density Integrated Circuits (IC), is also readily adaptable as an enabling technology in MicroElectroMechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining. CMP not only eases the design and manufacturability of MEMS devices by eliminating several photolithographic and film issues generated by severe topography, but also enables far greater flexibility with process complexity and associated designs. T
标签： mechanical polishing Chemical
上传时间： 2020-06-06
上传用户：shancjb
