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  • SM320 PCB LAYOUT GUIDELINES

    Silicon Motion, Inc. has made best efforts to ensure that the information contained in this document is accurate andreliable. However, the information is subject to change without notice. No responsibility is assumed by SiliconMotion, Inc. for the use of this information, nor for infringements of patents or other rights of third parties.Copyright NoticeCopyright 2002, Silicon Motion, Inc. All rights reserved. No part of this publication may be reproduced, photocopied,or transmitted in any form, without the prior written consent of Silicon Motion, Inc. Silicon Motion, Inc. reserves theright to make changes to the product specification without reservation and without notice to our users

    标签: GUIDELINES LAYOUT 320 PCB

    上传时间: 2013-10-10

    上传用户:manga135

  • pci e PCB设计规范

    This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.  

    标签: pci PCB 设计规范

    上传时间: 2014-01-24

    上传用户:s363994250

  • 智能照明控制器测量环境光线

    Abstract: This application note explains how to design an intelligent lighting controller that senses and measures the ambient lightlevel with an ambient light sensor (ALS). Equipped with a real-time clock (RTC), the controller also knows when to turn lighting on oroff at specified times. The system presented in this document can be used to control all luminaires that are mains-supply operated.Controller software is also provided in hex format.

    标签: 智能照明控制器 测量 环境光线

    上传时间: 2013-11-18

    上传用户:AbuGe

  • XAPP713 -Virtex-4 RocketIO误码率测试器

      The data plane of the reference design consists of a configurable multi-channel XBERT modulethat generates and checks high-speed serial data transmitted and received by the MGTs. Eachchannel in the XBERT module consists of two MGTs (MGTA and MGTB), which physicallyoccupy one MGT tile in the Virtex-4 FPGA. Each MGT has its own pattern checker, but bothMGTs in a channel share the same pattern generator. Each channel can load a differentpattern. The MGT serial rate depends on the reference clock frequency and the internal PMAdivider settings. The reference design can be scaled anywhere from one channel (two MGTs)to twelve channels (twenty-four MGTs).

    标签: RocketIO Virtex XAPP 713

    上传时间: 2013-12-25

    上传用户:jkhjkh1982

  • V-BY-ONE THCV219-220 参考设计

    V-BY-ONE THCV219-220 参考设计

    标签: V-BY-ONE THCV 219 220

    上传时间: 2013-11-16

    上传用户:caoyuanyuan1818

  • V-BY-ONE THCV215-216 参考设计

    V-BY-ONE THCV215-216 参考设计

    标签: V-BY-ONE THCV 215 216

    上传时间: 2013-10-14

    上传用户:ljmwh2000

  • V-BY-ONE THCV213-214 参考设计

    V-BY-ONE THCV213-214 参考设计

    标签: V-BY-ONE THCV 213 214

    上传时间: 2013-11-04

    上传用户:dbs012280

  • V-BY-ONE应用设计

    V-BY-ONE应用设计 THCV217-218 thine LVDS

    标签: V-BY-ONE 应用设计

    上传时间: 2013-10-20

    上传用户:dxxx

  • 谈集成电路的通用接口

    Abstract: How can an interface change a happy face to a sad face? Engineers have happy faces when an interface works properly.Sad faces indicate failure somewhere. Because interfaces between microprocessors and ICs are simple—even easy—they are oftenignored until interface failure causes sad faces all around. In this article, we discuss a common SPI error that can be almostimpossible to find in a large system. Links to interface tutorial information are provided for complete information. Noise as a systemissue and ICs to minimize its effects are also described.

    标签: 集成电路 通用接口

    上传时间: 2013-11-18

    上传用户:zgz317

  • XAPP904 - CoolRunner-II特性LCD模块接口

      There are many manufacturers of dot matrix LCD modules. However, most of these displaysare similar. They all have on-board controllers and drivers capable of displaying alpha numericsand a wide variety of other symbols (including Japanese "Katakana" characters). The internaloperation of LCD controller devices is determined by signals sent from a central processing unit(in this case, a CoolRunner-II CPLD).

    标签: CoolRunner-II XAPP 904 LCD

    上传时间: 2013-12-17

    上传用户:haiya2000