Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package Feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-10-22
上传用户：ztj182002
The C8051F020/1/2/3 devices are fully integrated mixed-signal System-on-a-Chip MCUs with 64 digital I/O pins (C8051F020/2) or 32 digital I/O pins (C8051F021/3). Highlighted Features are listed below; refer to Table 1.1 for specific product Feature selection.
上传时间： 2013-11-08
上传用户：lwq11
With the Altera Nios II embedded processor, you as the system designercan accelerate time-critical software algorithms by adding custominstructions to the Nios II processor instruction set. Using custominstructions, you can reduce a complex sequence of standard instructionsto a single instruction implemented in hardware. You can use this Featurefor a variety of applications, for example, to optimize software innerloops for digital signal processing (DSP), packet header processing, andcomputation-intensive applications. The Nios II configuration wizard,part of the Quartus® II software’s SOPC Builder, provides a graphicaluser interface (GUI) used to add up to 256 custom instructions to theNios II processor
上传时间： 2013-11-06
上传用户：swing
We offer a broad line of high performance low dropout (LDO) linear regulators with fasttransient response, excellent line and load regulation, and very wide input voltage rangefrom 0.9V to 100V. Output currents range from 20mA to 10A, with positive, negative andmultiple output versions available. Many devices offer output voltage operation <0.8V andsome Feature operation as low as 0V, even with a single supply. Most are stable with ceramicoutput capacitors. LDO regulators can be applied in virtually any application.
上传时间： 2013-11-15
上传用户：努力努力再努力
Abstract: This application note helps system designers choose the correct external components for use with the MAX16948 dualremote antenna LDO/switch, thus ensuring that automobile-regulated phantom antenna supply and output-current-monitoring circuitrymeet performance objectives. An electronic calculator is provided that helps specify the critical external components for theMAX16948, thus reducing design time. The calculator also determines the device's analog output voltage, output current-limitthreshold, and output current-sensing accuracies. The calculator includes new automatic Step By Step Feature that assists designerswith component choice. To use the new automatic Feature, click on the Step By Step button relative to the desired section.
上传时间： 2013-11-04
上传用户：lhll918
本软件是关于MAX338, MAX339的英文数据手册：MAX338, MAX339 8通道/双4通道、低泄漏、CMOS模拟多路复用器 The MAX338/MAX339 are monolithic, CMOS analog multiplexers (muxes). The 8-channel MAX338 is designed to connect one of eight inputs to a common output by control of a 3-bit binary address. The dual, 4-channel MAX339 is designed to connect one of four inputs to a common output by control of a 2-bit binary address. Both devices can be used as either a mux or a demux. On-resistance is 400Ω max, and the devices conduct current equally well in both directions. These muxes Feature extremely low off leakages (less than 20pA at +25°C), and extremely low on-channel leakages (less than 50pA at +25°C). The new design offers guaranteed low charge injection (1.5pC typ) and electrostatic discharge (ESD) protection greater than 2000V, per method 3015.7. These improved muxes are pin-compatible upgrades for the industry-standard DG508A and DG509A. For similar Maxim devices with lower leakage and charge injection but higher on-resistance, see the MAX328 and MAX329.
上传时间： 2013-11-12
上传用户：18711024007
Nios II定制指令用户指南：With the Altera Nios II embedded processor, you as the system designer can accelerate time-critical software algorithms by adding custom instructions to the Nios II processor instruction set. Using custom instructions, you can reduce a complex sequence of standard instructions to a single instruction implemented in hardware. You can use this Feature for a variety of applications, for example, to optimize software inner loops for digital signal processing (DSP), packet header processing, and computation-intensive applications. The Nios II configuration wizard,part of the Quartus® II software’s SOPC Builder, provides a graphical user interface (GUI) used to add up to 256 custom instructions to the Nios II processor. The custom instruction logic connects directly to the Nios II arithmetic logic unit (ALU) as shown in Figure 1–1.
上传时间： 2013-10-11
上传用户：kang1923
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package Feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-11-20
上传用户：不懂夜的黑
Most designers wish to utilize as much of a device as possible in order to enhance the overallproduct performance, or extend a Feature set. As a design grows, inevitably it will exceed thearchitectural limitations of the device. Exactly why a design does not fit can sometimes bedifficult to determine. Programmable logic devices can be configured in almost an infinitenumber of ways. The same design may fit when you use certain implementation switches, andfail to fit when using other switches. This application note attempts to clarify the CPLD softwareimplementation (CPLDFit) options, as well as discuss implementation tips in CoolRunnerTM-IIdesigns in order to maximize CPLD utilization.
上传时间： 2014-01-10
上传用户：a471778
这个软件需要你的本机操作的。其他机器是算不出来的！ 就是说 一台电脑只有一个注册码对应！ 这里有个办法： MULTISIM2001安装方法： 一：运行SETUP.EXE安装。在安装时，要重新启动计算机一次。 二：启动后在“开始>程序”中找到STARTUP项，运行后，继续进行安装，安装过程中，第一次要求输入“CODE"码时， 输入“PP-0411-48015-7464-32084"输入后，会提示"VALID SERIAL NUMBER FOR MULTISIM 2001 POWER-PRO." 按确定，又会出现一个“Feature code”框，输入“FC-6424-04180-0044-13881”后， 在弹出的对话框中选择“取消”，一路确定即可完成安装。 三：1.运行VERILOG目录内的SETUP安装 2.运行FPGA目录内的SETUP安装 3.将CRACK目录内的LICMGR.DLL拷贝到WINDOWS系统的SYSTEM 目录内 4.并将VERILOG安装目录内的同名文件删除 5.将SILOS.LIC文件拷到VERILOG安装目录内覆盖原文件，并作如下编辑： 6.将“COMPUTER_NAME”替换为你的机器名 7.将“D:\MULTISIM\VERILOG\PATH_TO_SIMUCAD.EXE”替换为你的 实际安装路径。如此你便可以使用VERILOG了。 四：安装之后，运行MULTISIM2001,会要求输入“RELEASE CODE",不用着急， 记下“SERIAL NUMBER"和“SIGNATURE NUMBER", 使用CRACK目录内的注册器“MULTISIM KEYGEN.EXE" 将刚才记下的两个号码分别填入后， 即可得到"RELEASE CODE", 以后就可以正常使用了。 五：接下来运行 database update目录中的几个文件， 进行数据库合并即可。祝你成功！！ 六：启动MULTISIM2001时候的注册码 1： PP-0411-48015-7464-32084 2： 37506-86380 3:的三个空格 1975 2711 4842 里面包含了：Multisim2001汉化破解版、Multisim.V10.0.1.汉化破解版图解 解压密码：www.pp51.com
上传时间： 2013-11-16
上传用户：天空说我在
