UJA1079TW-LIN核的系统基础芯片简介
1.1 概述恩智浦半导体推出其第二代车载网络LIN核的系统基础芯片(SBC)UJA1079TW产品,实现了性能、功耗以及电子控制单元(ECU)成本的优化,惠及车身控制模块、车内温度控制、座椅控制、电动...
1.1 概述恩智浦半导体推出其第二代车载网络LIN核的系统基础芯片(SBC)UJA1079TW产品,实现了性能、功耗以及电子控制单元(ECU)成本的优化,惠及车身控制模块、车内温度控制、座椅控制、电动...
概述恩智浦半导体推出其第二代车载网络CAN/LIN核的系统基础芯片(SBC)UJA1078TW产品,实现了性能、功耗以及电子控制单元(ECU)成本的优化,惠及车身控制模块、车内温度控制、座椅控制、电动...
恩智浦半导体推出其第二代车载网络CAN核的系统基础芯片(SBC)UJA1076TW产品,实现了性能、功耗以及电子控制单元(ECU)成本的优化,惠及车身控制模块、车内温度控制、座椅控制、电动助力转向(E...
The LPC1850/30/20/10 are ARM Cortex-M3 based microcontrollers for embeddedapplications. The ARM Cort...
The LPC4350/30/20/10 are ARM Cortex-M4 based microcontrollers for embeddedapplications. The ARM Cort...
中文版详情浏览:http://www.elecfans.com/emb/fpga/20130715324029.html Xilinx UltraScale:The Next-Gene...
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor...
Design techniques for electronic systems areconstantly changing. In industries at the heart of the...
According to CIBC World Markets, Equity Research, theFlat Panel Display (FPD) industry ha...
Xilinx Next Generation 28 nm FPGA Technology Overview Xilinx has chosen 28 nm high-κ metal ...