目录 目录 1 快捷键 2 常用元件及封装 7 创建自己的集成库 12 板层介绍 14 过孔 15 生成BOM清单 16 顶层原理图: 16 生成PCB 17 包地 18 电路板设计规则 18 PCB设计注意事项 20 画板心得 22 DRC 规则英文对照 22 一、Error Reporting 中英文对照 22 A ： Violations Associated with Buses 有关总线电气错误的各类型（共 12 项） 22 B ：Violations Associated Components 有关元件符号电气错误（共 20 项） 22 C ： violations associated with Document 相关的文档电气错误（共 10 项） 23 D ： violations associated with nets 有关网络电气错误（共 19 项） 23 E ： Violations associated with others 有关原理图的各种类型的错误 (3 项 ) 24 二、 Comparator 规则比较 24 A ： Differences associated with components 原理图和 PCB 上有关的不同 ( 共 16 项 ) 24 B ： Differences associated with nets 原理图和 PCB 上有关网络不同（共 6 项） 25 C ： Differences associated with parameters 原理图和 PCB 上有关的参数不同（共 3 项） 25 Violations Associated withBuses栏 —总线电气错误类型 25 Violations Associated with Components栏 ——元件电气错误类型 26 Violations Associated with Documents栏 —文档电气连接错误类型 27 Violations Associated with Nets栏 ——网络电气连接错误类型 27 Violations Associated with Parameters栏 ——参数错误类型 28
上传时间： 2013-11-21
上传用户：旭521
Trademarks and service marks of Cadence Design Systems, Inc. (Cadence) contained in this Document are attributed to Cadence with the appropriate symbol.
上传时间： 2013-10-14
上传用户：chukeey
This application note provides a functional description of VHDL source code for a N x N DigitalCrosspoint Switch. The code is designed with eight inputs and eight outputs in order to targetthe 128-macrocell CoolRunner™-II CPLD device but can be easily expanded to target higherdensity devices. To obtain the VHDL source code described in this Document, go to sectionVHDL Code, page 5 for instructions.
标签： CoolRunner-II XAPP CPLD 380
上传时间： 2013-10-26
上传用户：kiklkook
This Document was developed under the Standard Hardware and Reliability Program (SHARP) TechnologyIndependent Representation of Electronic Products (TIREP) project. It is intended for use by VHSIC HardwareDescription Language (VHDL) design engineers and is offered as guidance for the development of VHDL modelswhich are compliant with the VHDL Data Item Description (DID DI-EGDS-80811) and which can be providedto manufacturing engineering personnel for the development of production data and the subsequent productionof hardware. Most VHDL modeling performed to date has been concentrated at either the component level orat the conceptual system level. The assembly and sub-assembly levels have been largely disregarded. Under theSHARP TIREP project, an attempt has been made to help close this gap. The TIREP models are based upon lowcomplexity Standard Electronic Modules (SEM) of the format A configuration. Although these modules are quitesimple, it is felt that the lessons learned offer guidance which can readily be applied to a wide range of assemblytypes and complexities.
上传时间： 2013-11-20
上传用户：pzw421125
Silicon Motion, Inc. has made best efforts to ensure that the information contained in this Document is accurate andreliable. However, the information is subject to change without notice. No responsibility is assumed by SiliconMotion, Inc. for the use of this information, nor for infringements of patents or other rights of third parties.Copyright NoticeCopyright 2002, Silicon Motion, Inc. All rights reserved. No part of this publication may be reproduced, photocopied,or transmitted in any form, without the prior written consent of Silicon Motion, Inc. Silicon Motion, Inc. reserves theright to make changes to the product specification without reservation and without notice to our users
标签： GUIDELINES LAYOUT 320 PCB
上传时间： 2013-10-10
上传用户：manga135
This Document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this Document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This Document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The Document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上传时间： 2014-01-24
上传用户：s363994250
Abstract: As industrial control systems (ICSs) have become increasingly connected and use more off-the-shelfcomponents, new vulnerabilities to cyber attacks have emerged. This tutorial looks at three types of ICSs:programmable logic controllers (PLCs), supervisory control and data acquisition (SCADA) systems, anddistributed control systems (DCSs), and then discusses security issues and remedies. This Document alsoexplains the benefits and limitations of two cryptographic solutions (digital signatures and encryption) andelaborates on the reasons for using security ICs in an ICS to support cryptography.
上传时间： 2013-10-09
上传用户：woshinimiaoye
Abstract: This application note explains how to design an intelligent lighting controller that senses and measures the ambient lightlevel with an ambient light sensor (ALS). Equipped with a real-time clock (RTC), the controller also knows when to turn lighting on oroff at specified times. The system presented in this Document can be used to control all luminaires that are mains-supply operated.Controller software is also provided in hex format.
上传时间： 2013-11-18
上传用户：AbuGe
Accurate measurement of the third order intercept pointfor low distortion IC products such as the LT5514 requirescertain precautions to be observed in the test setup andtesting procedure. The LT5514 linearity performance ishigh enough to push the test equipment and test set-up totheir limits. A method for accurate measurement of thirdorder intermodulation products, IM3, with standard testequipment is outlined below.It is also important to correctly interpret the LT5514specification with respect to ROUT, and the impact ofdemo-board transmission-line termination loss whenevaluating the linearity performance, as explained in theLT5514 Datasheet and in Note 1 of this Document.
上传时间： 2013-11-14
上传用户：l254587896
使用lm算法对二维圆数据进行拟和，其中test_circle用于生成测试数据 fit2dcircle用于拟和 Document.doc对算法原理进行详细说明 程序使用bcc5.60编译通过
上传时间： 2015-01-08
上传用户：253189838
