《器件封装用户向导》赛灵思产品封装资料
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic pa...
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic pa...
This application note describes how to implement the Bus LVDS (BLVDS) interface in the supported Altera ® device families for high-performance mul...
Xilinx FPGAs require at least two power supplies: VCCINTfor core circuitry and VCCO for I/O interface. For the latestXilinx FPGAs, includin...
The Xilinx Zynq-7000 Extensible Processing Platform (EPP) redefines the possibilities for embedded systems, giving system and software architects an...
SRAM-based FPGAs are non-volatile devices. Upon powerup, They are required to be programmed from an external source. This procedure allows anyone to...