现代的电子设计和芯片制造技术正在飞速发展,电子产品的复杂度、时钟和总线频率等等都呈快速上升趋势,但系统的电压却不断在减小,所有的这一切加上产品投放市场的时间要求给设计师带来了前所未有的巨大压力。要想保证产品的一次性成功就必须能预见设计中可能出现的各种问题,并及时给出合理的解决方案,对于高速的数字电路来说,最令人头大的莫过于如何确保瞬时跳变的数字信号通过较长的一段传输线,还能完整地被接收,并保证良好的电磁兼容性,这就是目前颇受关注的信号完整性(SI)问题。本章就是围绕信号完整性的问题,让大家对高速电路有个基本的认识,并介绍一些相关的基本概念。 第一章 高速数字电路概述.....................................................................................51.1 何为高速电路...............................................................................................51.2 高速带来的问题及设计流程剖析...............................................................61.3 相关的一些基本概念...................................................................................8第二章 传输线理论...............................................................................................122.1 分布式系统和集总电路.............................................................................122.2 传输线的RLCG 模型和电报方程...............................................................132.3 传输线的特征阻抗.....................................................................................142.3.1 特性阻抗的本质.................................................................................142.3.2 特征阻抗相关计算.............................................................................152.3.3 特性阻抗对信号完整性的影响.........................................................172.4 传输线电报方程及推导.............................................................................182.5 趋肤效应和集束效应.................................................................................232.6 信号的反射.................................................................................................252.6.1 反射机理和电报方程.........................................................................252.6.2 反射导致信号的失真问题.................................................................302.6.2.1 过冲和下冲.....................................................................................302.6.2.2 振荡:.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分线的匹配.................................................................................392.6.3.4 多负载的匹配.................................................................................41第三章 串扰的分析...............................................................................................423.1 串扰的基本概念.........................................................................................423.2 前向串扰和后向串扰.................................................................................433.3 后向串扰的反射.........................................................................................463.4 后向串扰的饱和.........................................................................................463.5 共模和差模电流对串扰的影响.................................................................483.6 连接器的串扰问题.....................................................................................513.7 串扰的具体计算.........................................................................................543.8 避免串扰的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的产生..................................................................................................614.2.1 电压瞬变.............................................................................................614.2.2 信号的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 电场屏蔽.........................................................................................654.3.1.2 磁场屏蔽.........................................................................................674.3.1.3 电磁场屏蔽.....................................................................................674.3.1.4 电磁屏蔽体和屏蔽效率.................................................................684.3.2 滤波.....................................................................................................714.3.2.1 去耦电容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 设计中的EMI.......................................................................................754.4.1 传输线RLC 参数和EMI ........................................................................764.4.2 叠层设计抑制EMI ..............................................................................774.4.3 电容和接地过孔对回流的作用.........................................................784.4.4 布局和走线规则.................................................................................79第五章 电源完整性理论基础...............................................................................825.1 电源噪声的起因及危害.............................................................................825.2 电源阻抗设计.............................................................................................855.3 同步开关噪声分析.....................................................................................875.3.1 芯片内部开关噪声.............................................................................885.3.2 芯片外部开关噪声.............................................................................895.3.3 等效电感衡量SSN ..............................................................................905.4 旁路电容的特性和应用.............................................................................925.4.1 电容的频率特性.................................................................................935.4.3 电容的介质和封装影响.....................................................................955.4.3 电容并联特性及反谐振.....................................................................955.4.4 如何选择电容.....................................................................................975.4.5 电容的摆放及Layout ........................................................................99第六章 系统时序.................................................................................................1006.1 普通时序系统...........................................................................................1006.1.1 时序参数的确定...............................................................................1016.1.2 时序约束条件...................................................................................1066.2 源同步时序系统.......................................................................................1086.2.1 源同步系统的基本结构...................................................................1096.2.2 源同步时序要求...............................................................................110第七章 IBIS 模型................................................................................................1137.1 IBIS 模型的由来...................................................................................... 1137.2 IBIS 与SPICE 的比较.............................................................................. 1137.3 IBIS 模型的构成...................................................................................... 1157.4 建立IBIS 模型......................................................................................... 1187.4 使用IBIS 模型......................................................................................... 1197.5 IBIS 相关工具及链接..............................................................................120第八章 高速设计理论在实际中的运用.............................................................1228.1 叠层设计方案...........................................................................................1228.2 过孔对信号传输的影响...........................................................................1278.3 一般布局规则...........................................................................................1298.4 接地技术...................................................................................................1308.5 PCB 走线策略............................................................................................134
标签: 信号完整性
上传时间: 2014-05-15
上传用户:dudu1210004
第一部分 信号完整性知识基础.................................................................................5第一章 高速数字电路概述.....................................................................................51.1 何为高速电路...............................................................................................51.2 高速带来的问题及设计流程剖析...............................................................61.3 相关的一些基本概念...................................................................................8第二章 传输线理论...............................................................................................122.1 分布式系统和集总电路.............................................................................122.2 传输线的RLCG 模型和电报方程...............................................................132.3 传输线的特征阻抗.....................................................................................142.3.1 特性阻抗的本质.................................................................................142.3.2 特征阻抗相关计算.............................................................................152.3.3 特性阻抗对信号完整性的影响.........................................................172.4 传输线电报方程及推导.............................................................................182.5 趋肤效应和集束效应.................................................................................232.6 信号的反射.................................................................................................252.6.1 反射机理和电报方程.........................................................................252.6.2 反射导致信号的失真问题.................................................................302.6.2.1 过冲和下冲.....................................................................................302.6.2.2 振荡:.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分线的匹配.................................................................................392.6.3.4 多负载的匹配.................................................................................41第三章 串扰的分析...............................................................................................423.1 串扰的基本概念.........................................................................................423.2 前向串扰和后向串扰.................................................................................433.3 后向串扰的反射.........................................................................................463.4 后向串扰的饱和.........................................................................................463.5 共模和差模电流对串扰的影响.................................................................483.6 连接器的串扰问题.....................................................................................513.7 串扰的具体计算.........................................................................................543.8 避免串扰的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的产生..................................................................................................614.2.1 电压瞬变.............................................................................................614.2.2 信号的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 电场屏蔽.........................................................................................654.3.1.2 磁场屏蔽.........................................................................................674.3.1.3 电磁场屏蔽.....................................................................................674.3.1.4 电磁屏蔽体和屏蔽效率.................................................................684.3.2 滤波.....................................................................................................714.3.2.1 去耦电容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 设计中的EMI.......................................................................................754.4.1 传输线RLC 参数和EMI ........................................................................764.4.2 叠层设计抑制EMI ..............................................................................774.4.3 电容和接地过孔对回流的作用.........................................................784.4.4 布局和走线规则.................................................................................79第五章 电源完整性理论基础...............................................................................825.1 电源噪声的起因及危害.............................................................................825.2 电源阻抗设计.............................................................................................855.3 同步开关噪声分析.....................................................................................875.3.1 芯片内部开关噪声.............................................................................885.3.2 芯片外部开关噪声.............................................................................895.3.3 等效电感衡量SSN ..............................................................................905.4 旁路电容的特性和应用.............................................................................925.4.1 电容的频率特性.................................................................................935.4.3 电容的介质和封装影响.....................................................................955.4.3 电容并联特性及反谐振.....................................................................955.4.4 如何选择电容.....................................................................................975.4.5 电容的摆放及Layout ........................................................................99第六章 系统时序.................................................................................................1006.1 普通时序系统...........................................................................................1006.1.1 时序参数的确定...............................................................................1016.1.2 时序约束条件...................................................................................1063.2 高速设计的问题.......................................................................................2093.3 SPECCTRAQuest SI Expert 的组件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系统......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自动布线器.......................................................2303.4 高速设计的大致流程...............................................................................2303.4.1 拓扑结构的探索...............................................................................2313.4.2 空间解决方案的探索.......................................................................2313.4.3 使用拓扑模板驱动设计...................................................................2313.4.4 时序驱动布局...................................................................................2323.4.5 以约束条件驱动设计.......................................................................2323.4.6 设计后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的进阶运用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括:................................2344.2 图形化的拓扑结构探索...........................................................................2344.3 全面的信号完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 设计前和设计的拓扑结构提取.......................................................2354.6 仿真设置顾问...........................................................................................2354.7 改变设计的管理.......................................................................................2354.8 关键技术特点...........................................................................................2364.8.1 拓扑结构探索...................................................................................2364.8.2 SigWave 波形显示器........................................................................2364.8.3 集成化的在线分析(Integration and In-process Analysis) .236第五章 部分特殊的运用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信号的仿真.......................................................................................2435.3 眼图模式的使用.......................................................................................249第四部分:HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 进行前仿真.......................................................................2511.1 用LineSim 进行仿真工作的基本方法...................................................2511.2 处理信号完整性原理图的具体问题.......................................................2591.3 在LineSim 中如何对传输线进行设置...................................................2601.4 在LineSim 中模拟IC 元件.....................................................................2631.5 在LineSim 中进行串扰仿真...................................................................268第二章 使用BOARDSIM 进行后仿真......................................................................2732.1 用BOARDSIM 进行后仿真工作的基本方法...................................................2732.2 BoardSim 的进一步介绍..........................................................................2922.3 BoardSim 中的串扰仿真..........................................................................309
上传时间: 2014-04-18
上传用户:wpt
+12V、0.5A单片开关稳压电源,其输出功率为6W。当输入交流电压在110~260V范围内变化时,电压调整率Sv≤1%。当负载电流大幅度变化时,负载调整率SI=5%~7%。
上传时间: 2014-12-24
上传用户:han_zh
本设计是以STC89C52RC芯片为核心,利用Keil UV4编写软件和STC_ISP烧写软件,设计出一个八音盒。八音盒主要由五大模块构成,包括单片机最小系统、4*4矩阵键盘、蜂鸣器发生电路和4位数码管显示电路。有8个按键对应8首曲目播放按钮,另外8个按键对应do、re、mi、fa、so、la、si、do’八中音调。本设计主要使用单片机的内部定时器0和中断产生不同频率的方波和延时驱动蜂鸣器,并采取行列反转扫描法识别键盘键值。由于使用的是实验箱已经固化的电路,本设计主要从软件设计上加以优化,以使蜂鸣器产生的音乐更纯净。最终实现的基础功能是任意播放8首单片机内已存曲目,发挥部分是另外实现8个可演奏的琴键,使八音盒具有放音和简单演奏的两重功能,并辅以数码管显示当前播放曲目号,经过优化和调试,音色较好,琴键发音比较纯正,初步达到设计要求。
上传时间: 2013-11-18
上传用户:450976175
量测/测试所面临之问题 此测试验证上,要使用NI公司之LAB VIEW及DAQ CARD来取代AUDIO PRECISION及其所附软体ATS。首先需克服硬体解析度上的差异,再来是FFT(FAST FOURIER TRANSFORM,快速传立业转换)演算未予的撰写,这将会影响MULTI-TONE讯号上PEAK值的侦测。另外,以RS-232为I/O介面,并呼叫客户所提供之DLL档来与DUT内的IC沟通,但因LAB VIEW无法直接呼叫其STRUCTURE,故需用VC++再编译一层新的DLL来供LAB VIEW使用。
上传时间: 2013-12-13
上传用户:longlong12345678
要搞清楚单片机与PLC的异同,首先得明确什幺是单片机,什幺是PLC。对此,我们简要回顾一下计算机的发展历程也许有帮助,按计算机专家的原始定义,计算机系统由五大部分--即控制单元(CU)、算术运算单元(ALU)、存储器(Memory)、输入设备(Input)、输出设备(Output)组成。早期计算机(晶体管的或集成电路的,不包括电子管的)的CU或ALU由一块甚至多块电路板组成,CU和ALU是分离的,随着集成度的提高,CU和ALU合在一块就组成了中央处理单元(CPU),接着将CPU集成到单块集成电路中就产生MPU或MCU,出现了如Intel4004、8008、8080,8085、8086、8088、Z80等MPU。此后,MPU的发展产生了两条分支,一支往高性能、高速度、大容量方向发展,典型芯片如:Intel80186、286、386、486、586、P2、P3、P4等,速度从4.7MHz到现在的3.2GHz。另一支则往多功能方向发展,将存储器(ROM、PROM、EPROM、EEPROM、FLASHROM、SRAM等)、输入/出接口(Timer/Counter、PWM、ADC/DAC、UART、IIC、SPI、RTC、PCA、FPGA等)全部集成在一块集成电路中而成为SOC。依愚之见,这就是当今广泛应用的单片计算机,简称单片机。这一分支可谓品种繁多,位宽从8位到32位,引脚数从6个到几百个,工作频率从几十KHz到几百MHz,体系结构既有CISC也有RISC,数不胜数。常用的有MCS-51系列、MCS-96系列、PIC系列、AVR系列、ARM7/9系列、TMS320系列、MSP430系列、MOTOROLA众多的单片机等等。
上传时间: 2013-10-16
上传用户:jjj0202
PROTEUS VSM在单片机系统仿真中的应用::介绍了单片机系统仿真工具PROTEUS VSM 及其在单片机系统仿真中的应用,给出了具体的应用实例,详细地介绍了PROTEUS VSM 与Keil uVision3的接口方法。关键词:单片机;Keil uVision3;仿真;外围器件;PROTEUS VSM; Abstract:This paper introduces the simulation tool for M CU system —PROTEUS VSM , and presents the application ofPROTEUS VSM in MCU system simulation through an applicable example.The way of interfacing PROTEUS VSM to Keil uVision3is also presented in details.Keywords:MCU ;Keil uVision3;simulation;peripheral devices;PROTEUS VSM ;
上传时间: 2013-11-16
上传用户:chenxichenyue
The CAT25128 is a 128−Kb Serial CMOS EEPROM device internally organized as 16Kx8 bits. This features a 64−byte page write buffer and supports the Serial Peripheral Interface (SPI) protocol. The device is enabled through a Chip Select (CS) input. In addition, the required bus signals are clock input (SCK), data input (SI) and data output (SO) lines. The HOLD input may be used to pause any serial communication with the CAT25128 device. The device featuressoftware and hardware write protection, including partial as well as full array protection.
上传时间: 2013-11-15
上传用户:fklinran
串行下载线的原理图 SI Prog - Serial Interface for PonyProg
上传时间: 2013-11-09
上传用户:zhishenglu
将正数n插入一个已整序的字数组的正确位置。算法: 将数组中数逐个与N比较,Si为指针若N<Ki,则Ki下移一个单元若NKi,则插在Ki的下一个单元,并结束临界条件:若NKn,则插入Kn的下一个单元若N<K1,则K1~Kn后移一个单元, N插在第一个单元循环控制:计数控制元素个数=((字末地址-字首地址) / 2) +1 字数 = (字节末地址-字节首地址) +1 字节数地址边界控制结束地址为ARRAY_HEAD特征值控制: 表示结束条件的值
上传时间: 2013-12-26
上传用户:haiya2000