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COUPLING

  • 交叉耦合控制(cross-COUPLING control)對誤差的影響

    交叉耦合控制(cross-COUPLING control)對誤差的影響

    标签: cross-COUPLING control 交叉耦合 控制

    上传时间: 2013-12-25

    上传用户:rishian

  • COUPLING OF TRANSIENT ELECTROMAGNETIC FIELD TO UNSHIELDED CABLE (over a ground plane)

    COUPLING OF TRANSIENT ELECTROMAGNETIC FIELD TO UNSHIELDED CABLE (over a ground plane)

    标签: ELECTROMAGNETIC UNSHIELDED TRANSIENT COUPLING

    上传时间: 2013-12-19

    上传用户:lingzhichao

  • 电源完整性分析应对高端PCB系统设计挑战

    印刷电路板(PCB)设计解决方案市场和技术领军企业Mentor Graphics(Mentor Graphics)宣布推出HyperLynx® PI(电源完整性)产品,满足业内高端设计者对于高性能电子产品的需求。HyperLynx PI产品不仅提供简单易学、操作便捷,又精确的分析,让团队成员能够设计可行的电源供应系统;同时缩短设计周期,减少原型生成、重复制造,也相应降低产品成本。随着当今各种高性能/高密度/高脚数集成电路的出现,传输系统的设计越来越需要工程师与布局设计人员的紧密合作,以确保能够透过众多PCB电源与接地结构,为IC提供纯净、充足的电力。配合先前推出的HyperLynx信号完整性(SI)分析和确认产品组件,Mentor Graphics目前为用户提供的高性能电子产品设计堪称业内最全面最具实用性的解决方案。“我们拥有非常高端的用户,受到高性能集成电路多重电压等级和电源要求的驱使,需要在一个单一的PCB中设计30余套电力供应结构。”Mentor Graphics副总裁兼系统设计事业部总经理Henry Potts表示。“上述结构的设计需要快速而准 确的直流压降(DC Power Drop)和电源杂讯(Power Noise)分析。拥有了精确的分析信息,电源与接地层结构和解藕电容数(de-COUPLING capacitor number)以及位置都可以决定,得以避免过于保守的设计和高昂的产品成本。”

    标签: PCB 电源完整性 高端

    上传时间: 2013-11-18

    上传用户:362279997

  • pci e PCB设计规范

    This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC COUPLING capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.  

    标签: pci PCB 设计规范

    上传时间: 2013-10-15

    上传用户:busterman

  • 电源完整性分析应对高端PCB系统设计挑战

    印刷电路板(PCB)设计解决方案市场和技术领军企业Mentor Graphics(Mentor Graphics)宣布推出HyperLynx® PI(电源完整性)产品,满足业内高端设计者对于高性能电子产品的需求。HyperLynx PI产品不仅提供简单易学、操作便捷,又精确的分析,让团队成员能够设计可行的电源供应系统;同时缩短设计周期,减少原型生成、重复制造,也相应降低产品成本。随着当今各种高性能/高密度/高脚数集成电路的出现,传输系统的设计越来越需要工程师与布局设计人员的紧密合作,以确保能够透过众多PCB电源与接地结构,为IC提供纯净、充足的电力。配合先前推出的HyperLynx信号完整性(SI)分析和确认产品组件,Mentor Graphics目前为用户提供的高性能电子产品设计堪称业内最全面最具实用性的解决方案。“我们拥有非常高端的用户,受到高性能集成电路多重电压等级和电源要求的驱使,需要在一个单一的PCB中设计30余套电力供应结构。”Mentor Graphics副总裁兼系统设计事业部总经理Henry Potts表示。“上述结构的设计需要快速而准 确的直流压降(DC Power Drop)和电源杂讯(Power Noise)分析。拥有了精确的分析信息,电源与接地层结构和解藕电容数(de-COUPLING capacitor number)以及位置都可以决定,得以避免过于保守的设计和高昂的产品成本。”

    标签: PCB 电源完整性 高端

    上传时间: 2013-10-31

    上传用户:ljd123456

  • pci e PCB设计规范

    This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC COUPLING capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.  

    标签: pci PCB 设计规范

    上传时间: 2014-01-24

    上传用户:s363994250

  • A system simulation environment in Matlab/Simulink of RFID is constructed in this paper. Special at

    A system simulation environment in Matlab/Simulink of RFID is constructed in this paper. Special attention is emphasized on the analog/RF circuit.Negative effects are concerned in the system model,such as phase noise of the local oscillator,TX-RX COUPLING,reflection of the environment, AWGN noise,DC offset,I/Q mismatch,etc.Performance of the whole system can be evaluated by changing the coding method,parameters of building blocks,and operation distance.Finally,some simulation results are presented in this paper.

    标签: environment constructed simulation Simulink

    上传时间: 2014-01-09

    上传用户:zhangliming420

  • Interference+Mitigation+Techniques

    This research work aims at eliminating the off-chip RF SAW filters from fre- quency division duplexed (FDD) receivers. In the first approach, a monolithic passive RF filter was constructed using on-chip capacitors and bondwire inductors. The bond- wire characteristics were studied in details and the effect of mutual inductive COUPLING between the bondwires on the filter performance was analyzed. Based on that, a bond- wire configuration was proposed to improve the frequency response of the filter. The filter was implemented in 0.18 µm CMOS process for WCDMA applications.

    标签: Interference Mitigation Techniques

    上传时间: 2020-05-27

    上传用户:shancjb

  • Computational+RFID

    Sensors are points ofcontact betweenthe material world ofatoms, mass, andenergy and the seemingly immaterial world of information, computation, and cognition. Linking these two domains more tightly yields all sorts of practical benefits, such as improvedinputdevicesforcomputers,moreeffectivemedicaldevices(implantedor worn), more precise agricultural operations, better monitored buildings or bridges, more secure payment systems, and more reliable sensor–actuator control systems. There are many settings in which tighter COUPLING between digital and physical planes can enhance safety, security, performance, and reliability.

    标签: Computational RFID

    上传时间: 2020-06-08

    上传用户:shancjb

  • 音频放大器设计

    This design uses Common-Emitter Amplifier (Class A) with 2N3904 Bipolar Junction Transistor. Use “Voltage Divider Biasing” to reduce the effects of varying β (= ic / ib) (by holding the Base voltage constant)  Base Voltage (Vb) = Vcc * [R2 / (R1 + R2)]  Use COUPLING Capacitors to separate the AC signals from the DC biasing voltage (which only pass AC signals and block any DC component).  Use Bypass Capacitor to maintain the Q-point stability.  To determine the value of each component, first set Q-point close to the center position of the load line. (RL is the resistance of the speaker.)

    标签: 音频放大器设计 电路图 英文

    上传时间: 2020-11-27

    上传用户: