PCB Design Considerations and Guidelines for 0.4mm and 0.5mm WLPs
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit b...
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit b...
怎样使用Nios II处理器来构建多处理器系统 Chapter 1. Creating Multiprocessor Nios II Systems Introduction to Nios II Multiprocessor Systems . . . . . . . . . . . . . ....
The exacting technological demands created byincreasing bandwidth requirements have given riseto significant advances in FPGA technology thatenable ...
This application note covers the design considerations of a system using the performance features of the LogiCORE™ IP Advanced eXtensible Int...
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from ...