高通(Qualcomm)蓝牙芯片QCC5151_硬件设计详细指导书（官方内部培训手册）共52页其内容是针对硬件设计、部分重要元器件选择(ESD，Filter）及走线注意事项的详细说明。2 Power management 2.1 SMPS 2.1.1 Components specification 2.1.2 Input power supply selection 2.1.3 Minimize SMPS EMI emissions 2.1.4 Internal LDOs and digital core decoupling 2.1.5 Powering external components 2.2 Charger 2.2.1 Charger connections.2.2.2 General charger operation2.2.3 Temperature measurement during charging 2.3 SYS_CTRL 3 Bluetooth radio3.1 RF PSU component choice 3.2 RF band-pass filter3.3 Layout (天线 走线的注意事项)4 Audio4.1 Audio bypass capacitors 4.2 Earphone speaker output4.3 Line/Mic input 4.4 Headphone output optimizition5 LED pads 5.1 LED driver 5.2 Digital/Button input 5.3 Analog input5.4 Disabled 6 Reset pin (Reset#)7 QSPIinterface 8 USB interfaces 8.1 USB device port8.1.1 USB connections8.1.2 Layout notes8.1.3 USB charger detection
上传时间： 2022-01-24
上传用户：XuVshu
高通蓝牙芯片QCC5051详细规格书共有117页，开发人员必备手册 支持蓝牙标准 5.2 ->Quad-core processor architecture ->High-performance programmable Bluetooth stereo audio Soc ->Low power modes to extend battery life. ->Flexible flash programmable platform. ->For wired/wirelss stereo heradsets/headphones application. ->For Qualcomm TrueWirless stereo earbuds application.主要特点如下
上传时间： 2022-01-24
上传用户：shjgzh
高通qualcommon蓝牙芯片QCC3056详细规格书共有112页，开发人员必备手册 支持蓝牙标准5.2 ->Quad-core processor architecture ->High-performance programmable Bluetooth mono audio Soc ->Low power modes to extend battery life. ->For Qualcomm TrueWirless stereo earbuds application.主要特点如下。
上传时间： 2022-01-24
上传用户：zhanglei193
Demo 程序中，HID 和 Audio 单独运行都不会有问题，把 HID 和 Audio 整合在一起，同进传送数据时，会出现Audio 不能传送数据的情况。
上传时间： 2022-02-22
上传用户：aben
CPCI_E标准规范 CompactPCI® Express SpecificationThe documents in this section may be useful for reference when reading the specification. The revision listed for each document is the latest revision at the time this specification was published. Newer revisions of these documents may exist, so refer to the newest revision. Many of these documents are referenced throughout this specification. Refer to the newest revision of the document unless a specific revision is referenced. • PCI Express Base Specification 3.0. PCI Special Interest Group (PCI-SIG). • PCI Express Card Electromechanical (CEM) Specification 3.0. PCI Special Interest Group (PCI-SIG). • PCI Express to PCI/PCI-X Bridge Specification, Rev. 1.0. PCI Special Interest Group (PCI-SIG). • PCI Express Jitter White Paper. PCI Special Interest Group (PCI-SIG). • PCIe Rj Dj BER White Paper. PCI Special Interest Group (PCI-SIG). • PHY Electrical Test Specification for PCI Express Architecture. PCI Special Interest Group (PCI SIG). • System Management Bus (SMBus) Specification, Version 2.0. Smart Battery System Implementer’
标签： CPCIE
上传时间： 2022-02-23
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SCB10H series pressure elements are high performance absolute pressure sensors. The sensors are based on Murata's proven capacitive 3D-MEMS technology. They enable exceptional possibility for OEM customers to integrate pressure measurement function in an optimal way into their products. SCB10H series elements can be designed to match the application specific pressure range. It is a bare capacitive sensor element that enables optimized application specific package and electronics design.
标签： 传感器
上传时间： 2022-03-03
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USB音频方案,USB声卡方案1. 描述ATE1133是一颗包含音频编解码器、HIFI级单麦克风输入和立体声耳机输出解决方案。内部集成多个模块，包括高速&全速USB Host/Device收发器(PHY)，ARM??Cortex?-M4?32-bit?MCU内核主频96MHZ，16bit ADC采样率：48、96KHZ、16bit DAC采样率：48、96KHZ，支持标准安卓耳机线控按键控制，支持美标CTIA带耳机插拔检测。它非常适用于USB C型桌面拓展坞、数据音频HUB、视频会议、Type-c耳机、C型音频转接头、USB话务耳机、USB车载AUX音频线等应用。此外还支持上位机Windows PC端软件界面在线调试仿真和更新片内flash闪存。2.特点·符合USB 2.0全速运行·符合USB AUDIO & HID设备类规范·支持Headset模式·支持Microphone模式·支持Speaker模式·支持硬件设置三种模式切换·支持左右声道平衡·麦克风Audio-ADC参数： 采样率：48、96KHZ 位宽：16Bit THD+N=0.005% SNR≥98 Bias电压：3V·立体声耳机输出Audio-DAC参数： 采样率：48、96KHZ 位宽：16Bit THD+N=0.003%(RL=32Ω) RL输出摆幅=1.6V 直驱16/32Ω耳机，最大功率35mW·内置低功耗ARM核心，全速运行功耗=3.3V@18ma，功耗0.06mW·支持线控耳机模式：上一曲、下一曲、播放/暂停、点按音量加减、长按音量连续加减·芯片单电源供电：3.3~5V-MAX·32针脚QFN32 4X4 封装
上传时间： 2022-03-22
上传用户：shjgzh
高通(Qualcomm)蓝牙芯片QCC5144_硬件设计详细指导书（官方内部培训手册）其内容是针对硬件设计、部分重要元器件选择(ESD，Filter）及走线注意事项的详细说明。2 Power management 2.1 SMPS 2.1.1 Components specification 2.1.2 Input power supply selection 92.1.3 Minimize SMPS EMI emissions 2.1.4 Internal LDOs and digital core decoupling 2.1.5 Powering external components 2.2 Charger 2.2.1 Charger connections.2.2.2 General charger operation2.2.3 Temperature measurement during charging 2.3 SYS_CTRL 3 Bluetooth radio3.1 RF PSU component choice 3.2 RF band-pass filter3.3 Layout (天线 走线的注意事项)4 Audio4.1 Audio bypass capacitors 4.2 Earphone speaker output4.3 Line/Mic input 4.4 Headphone output optimizition5 LED pads 5.1 LED driver 5.2 Digital/Button input 5.3 Analog input5.4 Disabled 6 Reset pin (Reset#)7 USB interfaces7.1 USB device port7.1.1 USB device port7.1.2 Layout notes 7.1.3 USB charger detectionA QCC5144 VFBGA example schematic and BOM B Recommended SMPS components specificationB.1 Inductor specifition B.2 Recommended inductors B.3 SMPS capacitor specifition
上传时间： 2022-04-07
上传用户：默默
高通蓝牙芯片QCC5144 详细规格手册datasheet （共99页）含各个接口说明，应用原理图等信息。 QualcommTrueWireless™ stereo earbuds (无线双耳） Features（特点） ■ Qualifiedto Bluetooth v5.2 specification （蓝牙协议标准5.2） ■ 120 MHz Qualcomm ® Kalimba ™ audio DSP （120MHz 的音频DSP处理器） ■ 32 MHz/80MHz Developer Processor for applications ■ Firmware Processor for system ■ Flexible QSPI flash programmable platform （可编程的QSPI外挂存储器） ■ High-performance 24‑bit audio interface （高性能的24位音频接口） ■ Digital and analog microphone interfaces （含 数字 及模拟 MIC接口） ■ Flexible PIO controller and LED pins with PWM support ■ Serial interfaces: UART, Bit Serializer (I²C/SPI), USB 2.0 （支持串口，I2C， SPI，USB 接口） ■ Advanced audio algorithms （高级的音频算法） ■ ActiveNoise Cancellation: （支持ANC 主动降噪功能） Hybrid, Feedforward, and Feedback modes, using Digital or Analog Mics, enabled using license keys available from Qualcomm® ■ Qualcomm ® aptX ™ and aptX HD Audio （支持独特的aptx 功能）
上传时间： 2022-04-07
上传用户：
高通蓝牙芯片QCC3040 详细规格手册datasheet （共96页）QualcommTrueWireless™ stereo earbuds (无线双耳）Features（特点）■ Qualifiedto Bluetooth v5.2 specification （蓝牙协议标准5.2）■ 120 MHz Qualcomm ® Kalimba ™ audio DSP （120MHz 的音频DSP处理器）■ 32 MHz Developer Processor for applications （32MH的 应用处理器）■ Firmware Processor for system■ Flexible QSPI flash programmable platform （可编程的QSPI外挂存储器）■ High-performance 24‑bit audio interface （高性能的24位音频接口）■ Digital and analog microphone interfaces （含 数字 及模拟 MIC接口）■ Flexible PIO controller and LED pins with PWM support■ Serial interfaces: UART, Bit Serializer (I²C/SPI), USB 2.0 （支持串口，I2C， SPI，USB 接口）■ Advanced audio algorithms （高级的音频算法）■ ActiveNoise Cancellation: （支持ANC 主动降噪功能）Hybrid, Feedforward, and Feedback modes, using Digitalor Analog Mics, enabled using license keys available from Qualcomm®■ Qualcomm ® aptX ™ and aptX HD Audio （支持独特的aptx 功能）
上传时间： 2022-04-09
上传用户：slq1234567890
