Thermal considerations for advanced logic families (Futurebus+, ABT and MULTIBYTE)
Thermal characteristics of integrated circuitpackages have been and increasingly will bea ma...
Thermal characteristics of integrated circuitpackages have been and increasingly will bea ma...
资料->【E】光盘论文->【E1】斯坦福博士论文->96 calgary PhD Accuracy and Reliability of Various DGPS Approaches.pdf...
·Radio-Frequency and Microwave Communication Circuits:Analysis and Designby: Devendra K. MisraDescri...
A CMOS low-voltage downconversion mixer is presented. With 1.69-GHz local oscillator signal input an...
2009 Designing and implementing an intelligent Bluetooth-enabled robot car,2009 Designing and implem...
资料->【E】光盘论文->【E1】斯坦福博士论文->04 Ohio PhD Global Positioning System Interference and Satellite Anomalo.p...
资料->【E】光盘论文->【E1】斯坦福博士论文->01 Queensland PhD Modelling and Simulation of GPS Multipath Propagation.pd...
·Radio-Frequency and Microwave Communication Circuits:Analysis and Designby: Devendra K. MisraDescri...
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