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  • QtEmbedded实例教程

    友善之臂的QtEmbedded实例教程 第一章 LINUX 图形用户界面 GUI 介绍.....................................................................................1 1.1  常用 GUI 介绍...................................................................................................................1 1.2  关于 Qt...............................................................................................................................2 1.3 Qt/Embedded  简介.............................................................................................................4 1.4 Qtopia 介绍.........................................................................................................................4 第二章 QT的安装..........................................................................................................................6 2.1 Qt X11 的安装....................................................................................................................6 2.2 Qt/Embedded 安装..............................................................................................................9 2.3 Qtopia 编译.......................................................................................................................11 第三章 QT的编程........................................................................................................................12 实验一 “Hello word! ”Qt初探............................................................................................12 实验二  创建一个窗口并添加按钮.......................................................................................17 实验三  对象间通信:Signal  和 Slot  机制........................................................................20 实验四  菜单和快捷键...........................................................................................................29 实验五  工具条和状态栏.......................................................................................................38 实验六  鼠标和键盘事件.......................................................................................................48 实验七  对话框.......................................................................................................................63 实验八 Qt 中的绘图..............................................................................................................75 实验九 Qt 中的多线程编程..................................................................................................85 实验十 Qt 中的网络编程......................................................................................................97 第四章 QT常用工具的介绍...................................................................................................... 111 4.1 Qt 设计器(Qt Designer)............................................................................................ 111 4.2 Tmake..............................................................................................................................113 4.3 Qvfb ................................................................................................................................114  

    标签: QtEmbedded 教程

    上传时间: 2013-12-21

    上传用户:laozhanshi111

  • 信号完整性知识基础(pdf)

    现代的电子设计和芯片制造技术正在飞速发展,电子产品的复杂度、时钟和总线频率等等都呈快速上升趋势,但系统的电压却不断在减小,所有的这一切加上产品投放市场的时间要求给设计师带来了前所未有的巨大压力。要想保证产品的一次性成功就必须能预见设计中可能出现的各种问题,并及时给出合理的解决方案,对于高速的数字电路来说,最令人头大的莫过于如何确保瞬时跳变的数字信号通过较长的一段传输线,还能完整地被接收,并保证良好的电磁兼容性,这就是目前颇受关注的信号完整性(SI)问题。本章就是围绕信号完整性的问题,让大家对高速电路有个基本的认识,并介绍一些相关的基本概念。 第一章 高速数字电路概述.....................................................................................51.1 何为高速电路...............................................................................................51.2 高速带来的问题及设计流程剖析...............................................................61.3 相关的一些基本概念...................................................................................8第二章 传输线理论...............................................................................................122.1 分布式系统和集总电路.............................................................................122.2 传输线的RLCG 模型和电报方程...............................................................132.3 传输线的特征阻抗.....................................................................................142.3.1 特性阻抗的本质.................................................................................142.3.2 特征阻抗相关计算.............................................................................152.3.3 特性阻抗对信号完整性的影响.........................................................172.4 传输线电报方程及推导.............................................................................182.5 趋肤效应和集束效应.................................................................................232.6 信号的反射.................................................................................................252.6.1 反射机理和电报方程.........................................................................252.6.2 反射导致信号的失真问题.................................................................302.6.2.1 过冲和下冲.....................................................................................302.6.2.2 振荡:.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分线的匹配.................................................................................392.6.3.4 多负载的匹配.................................................................................41第三章 串扰的分析...............................................................................................423.1 串扰的基本概念.........................................................................................423.2 前向串扰和后向串扰.................................................................................433.3 后向串扰的反射.........................................................................................463.4 后向串扰的饱和.........................................................................................463.5 共模和差模电流对串扰的影响.................................................................483.6 连接器的串扰问题.....................................................................................513.7 串扰的具体计算.........................................................................................543.8 避免串扰的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的产生..................................................................................................614.2.1 电压瞬变.............................................................................................614.2.2 信号的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 电场屏蔽.........................................................................................654.3.1.2 磁场屏蔽.........................................................................................674.3.1.3 电磁场屏蔽.....................................................................................674.3.1.4 电磁屏蔽体和屏蔽效率.................................................................684.3.2 滤波.....................................................................................................714.3.2.1 去耦电容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 设计中的EMI.......................................................................................754.4.1 传输线RLC 参数和EMI ........................................................................764.4.2 叠层设计抑制EMI ..............................................................................774.4.3 电容和接地过孔对回流的作用.........................................................784.4.4 布局和走线规则.................................................................................79第五章 电源完整性理论基础...............................................................................825.1 电源噪声的起因及危害.............................................................................825.2 电源阻抗设计.............................................................................................855.3 同步开关噪声分析.....................................................................................875.3.1 芯片内部开关噪声.............................................................................885.3.2 芯片外部开关噪声.............................................................................895.3.3 等效电感衡量SSN ..............................................................................905.4 旁路电容的特性和应用.............................................................................925.4.1 电容的频率特性.................................................................................935.4.3 电容的介质和封装影响.....................................................................955.4.3 电容并联特性及反谐振.....................................................................955.4.4 如何选择电容.....................................................................................975.4.5 电容的摆放及Layout ........................................................................99第六章 系统时序.................................................................................................1006.1 普通时序系统...........................................................................................1006.1.1 时序参数的确定...............................................................................1016.1.2 时序约束条件...................................................................................1066.2 源同步时序系统.......................................................................................1086.2.1 源同步系统的基本结构...................................................................1096.2.2 源同步时序要求...............................................................................110第七章 IBIS 模型................................................................................................1137.1 IBIS 模型的由来...................................................................................... 1137.2 IBIS 与SPICE 的比较.............................................................................. 1137.3 IBIS 模型的构成...................................................................................... 1157.4 建立IBIS 模型......................................................................................... 1187.4 使用IBIS 模型......................................................................................... 1197.5 IBIS 相关工具及链接..............................................................................120第八章 高速设计理论在实际中的运用.............................................................1228.1 叠层设计方案...........................................................................................1228.2 过孔对信号传输的影响...........................................................................1278.3 一般布局规则...........................................................................................1298.4 接地技术...................................................................................................1308.5 PCB 走线策略............................................................................................134

    标签: 信号完整性

    上传时间: 2013-11-01

    上传用户:xitai

  • 高速PCB基础理论及内存仿真技术(经典推荐)

    第一部分 信号完整性知识基础.................................................................................5第一章 高速数字电路概述.....................................................................................51.1 何为高速电路...............................................................................................51.2 高速带来的问题及设计流程剖析...............................................................61.3 相关的一些基本概念...................................................................................8第二章 传输线理论...............................................................................................122.1 分布式系统和集总电路.............................................................................122.2 传输线的RLCG 模型和电报方程...............................................................132.3 传输线的特征阻抗.....................................................................................142.3.1 特性阻抗的本质.................................................................................142.3.2 特征阻抗相关计算.............................................................................152.3.3 特性阻抗对信号完整性的影响.........................................................172.4 传输线电报方程及推导.............................................................................182.5 趋肤效应和集束效应.................................................................................232.6 信号的反射.................................................................................................252.6.1 反射机理和电报方程.........................................................................252.6.2 反射导致信号的失真问题.................................................................302.6.2.1 过冲和下冲.....................................................................................302.6.2.2 振荡:.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分线的匹配.................................................................................392.6.3.4 多负载的匹配.................................................................................41第三章 串扰的分析...............................................................................................423.1 串扰的基本概念.........................................................................................423.2 前向串扰和后向串扰.................................................................................433.3 后向串扰的反射.........................................................................................463.4 后向串扰的饱和.........................................................................................463.5 共模和差模电流对串扰的影响.................................................................483.6 连接器的串扰问题.....................................................................................513.7 串扰的具体计算.........................................................................................543.8 避免串扰的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的产生..................................................................................................614.2.1 电压瞬变.............................................................................................614.2.2 信号的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 电场屏蔽.........................................................................................654.3.1.2 磁场屏蔽.........................................................................................674.3.1.3 电磁场屏蔽.....................................................................................674.3.1.4 电磁屏蔽体和屏蔽效率.................................................................684.3.2 滤波.....................................................................................................714.3.2.1 去耦电容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 设计中的EMI.......................................................................................754.4.1 传输线RLC 参数和EMI ........................................................................764.4.2 叠层设计抑制EMI ..............................................................................774.4.3 电容和接地过孔对回流的作用.........................................................784.4.4 布局和走线规则.................................................................................79第五章 电源完整性理论基础...............................................................................825.1 电源噪声的起因及危害.............................................................................825.2 电源阻抗设计.............................................................................................855.3 同步开关噪声分析.....................................................................................875.3.1 芯片内部开关噪声.............................................................................885.3.2 芯片外部开关噪声.............................................................................895.3.3 等效电感衡量SSN ..............................................................................905.4 旁路电容的特性和应用.............................................................................925.4.1 电容的频率特性.................................................................................935.4.3 电容的介质和封装影响.....................................................................955.4.3 电容并联特性及反谐振.....................................................................955.4.4 如何选择电容.....................................................................................975.4.5 电容的摆放及Layout ........................................................................99第六章 系统时序.................................................................................................1006.1 普通时序系统...........................................................................................1006.1.1 时序参数的确定...............................................................................1016.1.2 时序约束条件...................................................................................1063.2 高速设计的问题.......................................................................................2093.3 SPECCTRAQuest SI Expert 的组件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系统......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自动布线器.......................................................2303.4 高速设计的大致流程...............................................................................2303.4.1 拓扑结构的探索...............................................................................2313.4.2 空间解决方案的探索.......................................................................2313.4.3 使用拓扑模板驱动设计...................................................................2313.4.4 时序驱动布局...................................................................................2323.4.5 以约束条件驱动设计.......................................................................2323.4.6 设计后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的进阶运用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括:................................2344.2 图形化的拓扑结构探索...........................................................................2344.3 全面的信号完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 设计前和设计的拓扑结构提取.......................................................2354.6 仿真设置顾问...........................................................................................2354.7 改变设计的管理.......................................................................................2354.8 关键技术特点...........................................................................................2364.8.1 拓扑结构探索...................................................................................2364.8.2 SigWave 波形显示器........................................................................2364.8.3 集成化的在线分析(Integration and In-process Analysis) .236第五章 部分特殊的运用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信号的仿真.......................................................................................2435.3 眼图模式的使用.......................................................................................249第四部分:HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 进行前仿真.......................................................................2511.1 用LineSim 进行仿真工作的基本方法...................................................2511.2 处理信号完整性原理图的具体问题.......................................................2591.3 在LineSim 中如何对传输线进行设置...................................................2601.4 在LineSim 中模拟IC 元件.....................................................................2631.5 在LineSim 中进行串扰仿真...................................................................268第二章 使用BOARDSIM 进行后仿真......................................................................2732.1 用BOARDSIM 进行后仿真工作的基本方法...................................................2732.2 BoardSim 的进一步介绍..........................................................................2922.3 BoardSim 中的串扰仿真..........................................................................309

    标签: PCB 内存 仿真技术

    上传时间: 2013-11-07

    上传用户:aa7821634

  • 双氯芬酸钠贴片的制备及体外释放、透皮吸收测定

    [摘要] 目的:制备双氯芬酸钠贴片,研究其体外释放、透皮吸收性能。方法:制备以聚丙烯酸酯为骨架的双氯芬酸钠贴片,以蛇皮为模型,采用改进Franz扩散池考察药物经皮渗透性能,并按中国药典方法考察了贴片的体外释放性能。结果:双氯芬酸钠贴片体外释放速率为21.98μg·cm-2·h-1/2,体外透皮速率为17.97μg·cm-2·h-1/2。结论:双氯芬酸钠贴片释放度曲线及24h累计渗透量均符合Higuchi方程,是一种新颖的缓释型外用制剂。[关键词] 双氯芬酸钠;释放度;体外渗透

    标签: 贴片 测定

    上传时间: 2013-10-24

    上传用户:Artemis

  • 在实际应用中

    在实际应用中,编程者往往喜欢程序能自动生成word说明文档,说明程序运行的状况或运行的结果;或者程序能提取数据库的内容生成word表格,使用户能方便的查看和修改,打印。但是VC++中调用word的确不容易,特别是对word中各种函数的使用,本文以作者的工作经验详细介绍一下如何调用word和进行word表格的填写,有同样需求的编友也可查看一下MSDN中的Automation Microsoft Office 97 and Microsoft office 2000。

    标签: 实际应用

    上传时间: 2015-04-10

    上传用户:zhangjinzj

  • 计算所汉语词法分析系统ICTCLAS介绍 词是最小的能够独立活动的有意义的语言成分。 但汉语是以字为基本的书写单位

    计算所汉语词法分析系统ICTCLAS介绍 词是最小的能够独立活动的有意义的语言成分。 但汉语是以字为基本的书写单位,词语之间没有明显的区分标记,因此,中文词语分析是中文信息处理的基础与关键。为此,我们中国科学院计算技术研究所在多年研究基础上,耗时一年研制出了汉语词法分析系统ICTCLAS(Institute of Computing Technology, Chinese Lexical Analysis System),该系统的功能有:中文分词;词性标注;未登录词识别。分词正确率高达97%以上,未登录词识别召回率均高于90%,其中中国人名的识别召回率接近98%处理速度为31.5Kbytes/s。ICTCLAS的特色还在于:可以根据需要输出多个高概率结果,有多种输出格式,支持北大词性标注集,973专家组给出的词性标注集合。该系统得到了专家的好评,并有多篇论文在国内外发表。 计算所汉语词法分析系统ICTCLAS同时还提供一套完整的动态连接库ICTCLAS.dll和相应的概率词典,开发者可以完全忽略汉语词法分析,直接在自己的系统中调用ICTCLAS,ICTCLAS可以根据需要输出多个高概率的结果,输出格式也可以定制,开发者在分词和词性标注的基础上继续上层开发。

    标签: ICTCLAS 汉语 计算

    上传时间: 2014-01-02

    上传用户:15736969615

  • IP Hacker的OOB炸弹源程序 好不好

    IP Hacker的OOB炸弹源程序 好不好,你自己去说了,虽然是老炸弹了,但很经典,完整的源代码你未必看到过哦,我这可是真真的酷东东,完全Windows版本的源程序,从IP Hacker里抽取出来的,所有没打补丁的Windws 95/97/和Windows NT 3.51/4.0都有这漏洞哦!发一个命令过去就把系统搞蓝屏了,你还从没写过这类东西的话,就赶快去安装一台Windws 95实验一下吧!呵呵,保证有成就感 ;)

    标签: Hacker OOB IP 源程序

    上传时间: 2013-12-25

    上传用户:cursor

  • (转载)改进内存方面的问题

    (转载)改进内存方面的问题,防止出现内存溢出等错误,注册算法更稳定, 现在可以运行于windows95/97/98/2000,windowsNT中

    标签: 内存 方面

    上传时间: 2013-12-10

    上传用户:星仔

  • 0-1整数规划有很广泛的应用背景

    0-1整数规划有很广泛的应用背景,比如指派问题,背包问题等等,实际上TSP问题也是一个0-1问题,当然这些问题都是NP问题,对于规模较大的问题用穷举法是没有办法在可接受的时间内求得最优解的,本程序只不过是一个练习,得意之处是用递归法把所有解都排列出来。另:胡运权所著的《运筹学基础及应用(第三版)》第97页的例3,我用本程序求解得到的结果是:最优解是x*=(1,0, 0, 0, 0),最优值是f(x*)=8,但书求得最优解是x*=(1,0, 1, 0, 0),最优值是f(x*)=4,是不是书中写错了,请大家验证。以下是源程序,大家可以任意使用无版权问题,另外,如果大家有大规模的0-1规划的问题也希望提供给我,谢谢。变量个数至少是3个

    标签: 整数 背景

    上传时间: 2014-01-15

    上传用户:gdgzhym

  • Excel导入导出:This TscExcelExport component is an advanced, powerfull but easy component to export all r

    Excel导入导出:This TscExcelExport component is an advanced, powerfull but easy component to export all records of a dataset from Delphi to MS Excel (97, 2000, XP or 2003). Many features are provided to change the layout, to add totals, to create groups,

    标签: component TscExcelExport powerfull advanced

    上传时间: 2014-01-16

    上传用户:Divine