第一部分 信号完整性知识基础.................................................................................5第一章 高速数字电路概述.....................................................................................51.1 何为高速电路...............................................................................................51.2 高速带来的问题及设计流程剖析...............................................................61.3 相关的一些基本概念...................................................................................8第二章 传输线理论...............................................................................................122.1 分布式系统和集总电路.............................................................................122.2 传输线的RLCG 模型和电报方程...............................................................132.3 传输线的特征阻抗.....................................................................................142.3.1 特性阻抗的本质.................................................................................142.3.2 特征阻抗相关计算.............................................................................152.3.3 特性阻抗对信号完整性的影响.........................................................172.4 传输线电报方程及推导.............................................................................182.5 趋肤效应和集束效应.................................................................................232.6 信号的反射.................................................................................................252.6.1 反射机理和电报方程.........................................................................252.6.2 反射导致信号的失真问题.................................................................302.6.2.1 过冲和下冲.....................................................................................302.6.2.2 振荡：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分线的匹配.................................................................................392.6.3.4 多负载的匹配.................................................................................41第三章 串扰的分析...............................................................................................423.1 串扰的基本概念.........................................................................................423.2 前向串扰和后向串扰.................................................................................433.3 后向串扰的反射.........................................................................................463.4 后向串扰的饱和.........................................................................................463.5 共模和差模电流对串扰的影响.................................................................483.6 连接器的串扰问题.....................................................................................513.7 串扰的具体计算.........................................................................................543.8 避免串扰的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的产生..................................................................................................614.2.1 电压瞬变.............................................................................................614.2.2 信号的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 电场屏蔽.........................................................................................654.3.1.2 磁场屏蔽.........................................................................................674.3.1.3 电磁场屏蔽.....................................................................................674.3.1.4 电磁屏蔽体和屏蔽效率.................................................................684.3.2 滤波.....................................................................................................714.3.2.1 去耦电容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 设计中的EMI.......................................................................................754.4.1 传输线RLC 参数和EMI ........................................................................764.4.2 叠层设计抑制EMI ..............................................................................774.4.3 电容和接地过孔对回流的作用.........................................................784.4.4 布局和走线规则.................................................................................79第五章 电源完整性理论基础...............................................................................825.1 电源噪声的起因及危害.............................................................................825.2 电源阻抗设计.............................................................................................855.3 同步开关噪声分析.....................................................................................875.3.1 芯片内部开关噪声.............................................................................885.3.2 芯片外部开关噪声.............................................................................895.3.3 等效电感衡量SSN ..............................................................................905.4 旁路电容的特性和应用.............................................................................925.4.1 电容的频率特性.................................................................................935.4.3 电容的介质和封装影响.....................................................................955.4.3 电容并联特性及反谐振.....................................................................955.4.4 如何选择电容.....................................................................................975.4.5 电容的摆放及Layout ........................................................................99第六章 系统时序.................................................................................................1006.1 普通时序系统...........................................................................................1006.1.1 时序参数的确定...............................................................................1016.1.2 时序约束条件...................................................................................1063.2 高速设计的问题.......................................................................................2093.3 SPECCTRAQuest SI Expert 的组件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系统......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自动布线器.......................................................2303.4 高速设计的大致流程...............................................................................2303.4.1 拓扑结构的探索...............................................................................2313.4.2 空间解决方案的探索.......................................................................2313.4.3 使用拓扑模板驱动设计...................................................................2313.4.4 时序驱动布局...................................................................................2323.4.5 以约束条件驱动设计.......................................................................2323.4.6 设计后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的进阶运用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 图形化的拓扑结构探索...........................................................................2344.3 全面的信号完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 设计前和设计的拓扑结构提取.......................................................2354.6 仿真设置顾问...........................................................................................2354.7 改变设计的管理.......................................................................................2354.8 关键技术特点...........................................................................................2364.8.1 拓扑结构探索...................................................................................2364.8.2 SigWave 波形显示器........................................................................2364.8.3 集成化的在线分析(Integration and In-process Analysis) .236第五章 部分特殊的运用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信号的仿真.......................................................................................2435.3 眼图模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 进行前仿真.......................................................................2511.1 用LineSim 进行仿真工作的基本方法...................................................2511.2 处理信号完整性原理图的具体问题.......................................................2591.3 在LineSim 中如何对传输线进行设置...................................................2601.4 在LineSim 中模拟IC 元件.....................................................................2631.5 在LineSim 中进行串扰仿真...................................................................268第二章 使用BOARDSIM 进行后仿真......................................................................2732.1 用BOARDSIM 进行后仿真工作的基本方法...................................................2732.2 BoardSim 的进一步介绍..........................................................................2922.3 BoardSim 中的串扰仿真..........................................................................309
上传时间： 2013-11-07
上传用户：aa7821634
题目：利用条件运算符的嵌套来完成此题：学习成绩>=90分的同学用A表示，60-89分之间的用B表示，60分以下的用C表示。 1.程序分析：(a>b)?a:b这是条件运算符的基本例子。
上传时间： 2015-01-08
上传用户：lifangyuan12
源代码\用动态规划算法计算序列关系个数 用关系"<"和"="将3个数a，b，c依次序排列时，有13种不同的序列关系： a=b=c,a=b<c,a<b=v,a<b<c,a<c<b a=c<b,b<a=c,b<a<c,b<c<a,b=c<a c<a=b,c<a<b,c<b<a 若要将n个数依序列，设计一个动态规划算法，计算出有多少种不同的序列关系， 要求算法只占用O(n),只耗时O(n*n).
上传时间： 2013-12-26
上传用户：siguazgb
The government of a small but important country has decided that the alphabet needs to be streamlined and reordered. Uppercase letters will be eliminated. They will issue a royal decree in the form of a String of B and A characters. The first character in the decree specifies whether a must come ( B )Before b in the new alphabet or ( A )After b . The second character determines the relative placement of b and c , etc. So, for example, "BAA" means that a must come Before b , b must come After c , and c must come After d . Any letters beyond these requirements are to be excluded, so if the decree specifies k comparisons then the new alphabet will contain the first k+1 lowercase letters of the current alphabet. Create a class Alphabet that contains the method choices that takes the decree as input and returns the number of possible new alphabets that conform to the decree. If more than 1,000,000,000 are possible, return -1. Definition
标签： government streamline important alphabet
上传时间： 2015-06-09
上传用户：weixiao99
电力系统在台稳定计算式电力系统不正常运行方式的一种计算。它的任务是已知电力系统某一正常运行状态和受到某种扰动，计算电力系统所有发电机能否同步运行 1运行说明： 请输入初始功率S0，形如a+bi 请输入无限大系统母线电压V0 请输入系统等值电抗矩阵B 矩阵B有以下元素组成的行矩阵 1正常运行时的系统直轴等值电抗Xd 2故障运行时的系统直轴等值电抗X d 3故障切除后的系统直轴等值电抗 请输入惯性时间常数Tj 请输入时段数N 请输入哪个时段发生故障Ni 请输入每时段间隔的时间dt
上传时间： 2015-06-13
上传用户：it男一枚
上下文无关文法（Context-Free Grammar, CFG）是一个4元组G=(V, T, S, P)，其中，V和T是不相交的有限集，S∈V，P是一组有限的产生式规则集，形如A→α，其中A∈V，且α∈(V∪T)*。V的元素称为非终结符，T的元素称为终结符，S是一个特殊的非终结符，称为文法开始符。 设G=(V, T, S, P)是一个CFG，则G产生的语言是所有可由G产生的字符串组成的集合，即L(G)={x∈T* | Sx}。一个语言L是上下文无关语言（Context-Free Language, CFL），当且仅当存在一个CFG G，使得L=L(G)。 *⇒ 例如，设文法G：S→AB A→aA|a B→bB|b 则L(G)={a^nb^m | n,m>=1} 其中非终结符都是大写字母，开始符都是S，终结符都是小写字母。
标签： Context-Free Grammar CFG
上传时间： 2013-12-10
上传用户：gaojiao1999
一:需求分析 1. 问题描述 魔王总是使用自己的一种非常精练而抽象的语言讲话,没人能听懂,但他的语言是可逐步解释成人能听懂的语言,因为他的语言是由以下两种形式的规则由人的语言逐步抽象上去的: ----------------------------------------------------------- (1) a---> (B1)(B2)....(Bm) (2)[(op1)(p2)...(pn)]---->[o(pn)][o(p(n-1))].....[o(p1)o] ----------------------------------------------------------- 在这两种形式中,从左到右均表示解释.试写一个魔王语言的解释系统,把 他的话解释成人能听得懂的话. 2. 基本要求: 用下述两条具体规则和上述规则形式(2)实现.设大写字母表示魔王语言的词汇 小写字母表示人的语言的词汇 希腊字母表示可以用大写字母或小写字母代换的变量.魔王语言可含人的词汇. (1) B --> tAdA (2) A --> sae 3. 测试数据: B(ehnxgz)B 解释成 tsaedsaeezegexenehetsaedsae若将小写字母与汉字建立下表所示的对应关系,则魔王说的话是:"天上一只鹅地上一只鹅鹅追鹅赶鹅下鹅蛋鹅恨鹅天上一只鹅地上一只鹅". | t | d | s | a | e | z | g | x | n | h | | 天 | 地 | 上 | 一只| 鹅 | 追 | 赶 | 下 | 蛋 | 恨 |
上传时间： 2014-12-02
上传用户：jkhjkh1982
We have a group of N items (represented by integers from 1 to N), and we know that there is some total order defined for these items. You may assume that no two elements will be equal (for all a, b: a<b or b<a). However, it is expensive to compare two items. Your task is to make a number of comparisons, and then output the sorted order. The cost of determining if a < b is given by the bth integer of element a of costs (space delimited), which is the same as the ath integer of element b. Naturally, you will be judged on the total cost of the comparisons you make before outputting the sorted order. If your order is incorrect, you will receive a 0. Otherwise, your score will be opt/cost, where opt is the best cost anyone has achieved and cost is the total cost of the comparisons you make (so your score for a test case will be between 0 and 1). Your score for the problem will simply be the sum of your scores for the individual test cases.
标签： represented integers group items
上传时间： 2016-01-17
上传用户：jeffery
The XML Toolbox converts MATLAB data types (such as double, char, struct, complex, sparse, logical) of any level of nesting to XML format and vice versa. For example, >> project.name = MyProject >> project.id = 1234 >> project.param.a = 3.1415 >> project.param.b = 42 becomes with str=xml_format(project, off ) "<project> <name>MyProject</name> <id>1234</id> <param> <a>3.1415</a> <b>42</b> </param> </project>" On the other hand, if an XML string XStr is given, this can be converted easily to a MATLAB data type or structure V with the command V=xml_parse(XStr).
标签： converts Toolbox complex logical
上传时间： 2016-02-12
上传用户：a673761058
汉诺塔！！！ Simulate the movement of the Towers of Hanoi puzzle Bonus is possible for using animation eg. if n = 2 A→B A→C B→C if n = 3 A→C A→B C→B A→C B→A B→C A→C
标签： the animation Simulate movement
上传时间： 2017-02-11
上传用户：waizhang
