视频监控
上传时间： 2013-10-18
上传用户：nairui21
candence速成
标签： Allegro_SPB 16 教材
上传时间： 2013-10-16
上传用户：半熟1994
PZ-ISP程序下载
上传时间： 2013-10-16
上传用户：guobing703
multisim使用指南
上传时间： 2013-10-16
上传用户：yeling1919
视频监控
上传时间： 2013-11-12
上传用户：123312
allegro教程
标签： Cadence_Allegro 基础培训
上传时间： 2013-11-23
上传用户：dapangxie
CAM350安装包
上传时间： 2013-10-29
上传用户：瓦力瓦力hong
Digital cameras have become increasingly popular over the last few years. Digital imagingtechnology has grown to new markets including cellular phones and PDA devices. With thediverse marketplace, a variety of imaging technology must be available. Imaging technologyhas expanded to include both charge-coupled device (CCD) and CMOS image sensors.
标签： CoolRunner-II XAPP CPLD 390
上传时间： 2013-10-16
上传用户：18710733152
VGA 是视频图形阵列（Video Graphics Array）的简称，是IBM 于1987 年提出的一个使用模拟信号的图形显示标准。最初的VGA 标准最大只能支持640*480 分辨率的显示器，而为了适应大屏幕的应用，视频电气标准化组织VESA（Video Electronics StandardsAssociation 的简称）将VGA 标准扩展为SVGA 标准，SVGA 标准能够支持更大的分辨率。人们通常所说的VGA 实际上指的就是VESA 制定的SVGA 标准。(1). VGA 接口VGA 采用15 针的接口，用于显示的接口信号主要有5 个：1 个行同步信号、1 个场同步信号以及3 个颜色信号，接口还包含自测试以及地址码信号，一般由不同的制造商定义，主要用来进行测试及支持其它功能。
上传时间： 2013-11-11
上传用户：咔乐坞
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
上传时间： 2013-11-16
上传用户：萍水相逢
