#include "iostream" using namespace std; class Matrix { private: double** A; //矩阵A double *b; //向量b public: int size; Matrix(int ); ~Matrix(); friend double* Dooli(Matrix& ); void Input(); void Disp(); }; Matrix::Matrix(int x) { size=x; //为向量b分配空间并初始化为0 b=new double [x]; for(int j=0;j<x;j++) b[j]=0; //为向量A分配空间并初始化为0 A=new double* [x]; for(int i=0;i<x;i++) A[i]=new double [x]; for(int m=0;m<x;m++) for(int n=0;n<x;n++) A[m][n]=0; } Matrix::~Matrix() { cout<<"正在析构中~~~~"<<endl; delete b; for(int i=0;i<size;i++) delete A[i]; delete A; } void Matrix::Disp() { for(int i=0;i<size;i++) { for(int j=0;j<size;j++) cout<<A[i][j]<<" "; cout<<endl; } } void Matrix::Input() { cout<<"请输入A:"<<endl; for(int i=0;i<size;i++) for(int j=0;j<size;j++){ cout<<"第"<<i+1<<"行"<<"第"<<j+1<<"列:"<<endl; cin>>A[i][j]; } cout<<"请输入b:"<<endl; for(int j=0;j<size;j++){ cout<<"第"<<j+1<<"个:"<<endl; cin>>b[j]; } } double* Dooli(Matrix& A) { double *Xn=new double [A.size]; Matrix L(A.size),U(A.size); //分别求得U，L的第一行与第一列 for(int i=0;i<A.size;i++) U.A[0][i]=A.A[0][i]; for(int j=1;j<A.size;j++) L.A[j][0]=A.A[j][0]/U.A[0][0]; //分别求得U，L的第r行，第r列 double temp1=0,temp2=0; for(int r=1;r<A.size;r++){ //U for(int i=r;i<A.size;i++){ for(int k=0;k<r-1;k++) temp1=temp1+L.A[r][k]*U.A[k][i]; U.A[r][i]=A.A[r][i]-temp1; } //L for(int i=r+1;i<A.size;i++){ for(int k=0;k<r-1;k++) temp2=temp2+L.A[i][k]*U.A[k][r]; L.A[i][r]=(A.A[i][r]-temp2)/U.A[r][r]; } } cout<<"计算U得:"<<endl; U.Disp(); cout<<"计算L的:"<<endl; L.Disp(); double *Y=new double [A.size]; Y[0]=A.b[0]; for(int i=1;i<A.size;i++ ){ double temp3=0; for(int k=0;k<i-1;k++) temp3=temp3+L.A[i][k]*Y[k]; Y[i]=A.b[i]-temp3; } Xn[A.size-1]=Y[A.size-1]/U.A[A.size-1][A.size-1]; for(int i=A.size-1;i>=0;i--){ double temp4=0; for(int k=i+1;k<A.size;k++) temp4=temp4+U.A[i][k]*Xn[k]; Xn[i]=(Y[i]-temp4)/U.A[i][i]; } return Xn; } int main() { Matrix B(4); B.Input(); double *X; X=Dooli(B); cout<<"~~~~解得:"<<endl; for(int i=0;i<B.size;i++) cout<<"X["<<i<<"]:"<<X[i]<<" "; cout<<endl<<"呵呵呵呵呵"; return 0; }
标签： 道理特分解法
上传时间： 2018-05-20
上传用户：Aa123456789
# include<stdio.h> # include<math.h> # define N 3 main(){ float NF2(float *x,float *y); float A[N][N]={{10,-1,-2},{-1,10,-2},{-1,-1,5}}; float b[N]={7.2,8.3,4.2},sum=0; float x[N]= {0,0,0},y[N]={0},x0[N]={}; int i,j,n=0; for(i=0;i<N;i++) { x[i]=x0[i]; } for(n=0;;n++){ //计算下一个值 for(i=0;i<N;i++){ sum=0; for(j=0;j<N;j++){ if(j!=i){ sum=sum+A[i][j]*x[j]; } } y[i]=(1/A[i][i])*(b[i]-sum); //sum=0; } //判断误差大小 if(NF2(x,y)>0.01){ for(i=0;i<N;i++){ x[i]=y[i]; } } else break; } printf("经过%d次雅可比迭代解出方程组的解：\n",n+1); for(i=0;i<N;i++){ printf("%f ",y[i]); } } //求两个向量差的二范数函数 float NF2(float *x,float *y){ int i; float z,sum1=0; for(i=0;i<N;i++){ sum1=sum1+pow(y[i]-x[i],2); } z=sqrt(sum1); return z; }
上传时间： 2019-10-13
上传用户：大萌萌撒
高通(Qualcomm)蓝牙芯片QCC5144_硬件设计详细指导书（官方内部培训手册）其内容是针对硬件设计、部分重要元器件选择(ESD，Filter）及走线注意事项的详细说明。2 Power management 2.1 SMPS 2.1.1 Components specification 2.1.2 Input power supply selection 92.1.3 Minimize SMPS EMI emissions 2.1.4 Internal LDOs and digital core decoupling 2.1.5 Powering external components 2.2 Charger 2.2.1 Charger connections.2.2.2 General charger operation2.2.3 Temperature measurement during charging 2.3 SYS_CTRL 3 Bluetooth radio3.1 RF PSU component choice 3.2 RF band-pass filter3.3 Layout (天线 走线的注意事项)4 Audio4.1 Audio bypass capacitors 4.2 Earphone speaker output4.3 Line/Mic input 4.4 Headphone output optimizition5 LED pads 5.1 LED driver 5.2 Digital/Button input 5.3 Analog input5.4 Disabled 6 Reset pin (Reset#)7 USB interfaces7.1 USB device port7.1.1 USB device port7.1.2 Layout notes 7.1.3 USB charger detectionA QCC5144 VFBGA example schematic and BOM B Recommended SMPS components specificationB.1 Inductor specifition B.2 Recommended inductors B.3 SMPS capacitor specifition
上传时间： 2022-04-07
上传用户：默默
STM32 F1系列 MCU ATIUM AD集成库 原理图库 PCB 3D封装库文件,STM32F1XXXXX全系列原理图+PCB封装库文件，共209个器件型号，CSV text has been written to file : STM32 F1.csvLibrary Component Count : 209Name Description----------------------------------------------------------------------------------------------------STM32F100C4T6B STM32 ARM-based 32-bit MCU Value Line with 16 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, TraySTM32F100C4T7B STM32 ARM-based 32-bit MCU Value Line with 16 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +105癈 Temperature, 48-Pin LQFP, TraySTM32F100C6T6B STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, TraySTM32F100C6T6BTR STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, Tape and ReelSTM32F100C6T7B STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +105癈 Temperature, 48-Pin LQFP, TraySTM32F100C8T6B STM32 ARM-based 32-bit MCU Value Line with 64 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, TraySTM32F100C8T6BTR STM32 ARM-based 32-bit MCU Value Line with 64 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, Tape and ReelSTM32F100CBT6B STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, TraySTM32F100CBT7B STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +105癈 Temperature, 48-Pin LQFP, TraySTM32F100R4H6B STM32 ARM-based 32-bit MCU Value Line with 16 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, TraySTM32F100R4T6B STM32 ARM-based 32-bit MCU Value Line with 16 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100R4T6BTR STM32 ARM-based 32-bit MCU Value Line with 16 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, Tape and ReelSTM32F100R6H6B STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, TraySTM32F100R6T6 STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100R6T6B STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100R6T6BTR STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, Tape and ReelSTM32F100R8H6B STM32 ARM-based 32-bit MCU Value Line with 64 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, TraySTM32F100R8T6B STM32 ARM-based 32-bit MCU Value Line with 64 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100R8T6BTR STM32 ARM-based 32-bit MCU Value Line with 64 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, Tape and ReelSTM32F100RBH6B STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, TraySTM32F100RBH6BTR STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, Tape and ReelSTM32F100RBT6B STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100RBT6BTR STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, Tape and ReelSTM32F100RCT6B STM32 ARM-based 32-bit MCU Value Line with 256 kB Flash, 24 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100RDT6 STM32 ARM-based 32-bit MCU Value Line with 384 kB Flash, 32 kB Internal RAM, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100RDT6B STM32 ARM-based 32-bit MCU Value Line with 384 kB Flash, 32 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100RET6 STM32 ARM-based 32-bit MCU Value Line with 512 kB Flash, 32 kB Internal RAM, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100RET6B STM32 ARM-based 32-bit MCU Value Line with 512 kB Flash, 32 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-
上传时间： 2022-04-30
上传用户：jiabin
#include<iom16v.h> #include<macros.h> #define uint unsigned int #define uchar unsigned char uint a,b,c,d=0; void delay(c) { for for(a=0;a<c;a++) for(b=0;b<12;b++); }; uchar tab[]={ 0xc0,0xf9,0xa4,0xb0,0x99,0x92,0x82,0xf8,0x80,0x90,
上传时间： 2013-10-21
上传用户：13788529953
常用PIC系列产品特性一览表 器件 存储器 类型 字数 EEPROM 数据 存储器 RAM I/O 引脚数 ADC （-Bit） 比较 器 运 放 定时器/WDT 串行接口 最高 速度 MHz 封装 PDIP /SOIC ICSP CCP / ECCP 输出电流 (per I/O) 振荡器 频率 (MHz) 参考 电压 VREF LCD PWM 堆栈 深度 High Voltage Wakeup On Change PIC16C432 OTP 2048x14 128 12 2 1-8bit/1-WDT 20 20 √ 25 mA 4 0 0 PIC16C433 OTP 2048x14 128 6 4/8 1-8bit/1-WDT 10 18 √ 25 mA 0 0 PIC16C505 OTP 1024x12 72 12 1-8bit/1-WDT 20 14 √ 25 mA 4 0 0 PIC16C54 OTP 512x12 25 12 1-8bit/1-WDT 20 18/20 20 mA 0 0 PIC16C54A OTP 512x12 25 12 1-8bit/1-WDT 20 18/20 20 mA 0 0 PIC16C54C OTP 512x12 25 12 1-8bit/1-WDT 40 18/20 20 mA 0 0 PIC16C55 OTP 512x12 24 20 1-8bit/1-WDT 20 28 20 mA 0 0 PIC16C554 OTP 512x14 80 13 1-8bit/1-WDT 20 18/20 √ 25 mA 0 0 PIC16C558 OTP 2048x14 128 13 1-8bit/1-WDT 20 18/20 √ 25 mA 0 0 PIC16C55A OTP 512x12 24 20 1-8bit/1-WDT 40 28 20 mA 0 0 PIC16C56 OTP 1024x12 25 12 1-8bit/1-WDT 20 18/20 20 mA 0 0 PIC16C56A OTP 1024x12 25 12 1-8bit/1-WDT 40 18/20 20 mA 0 0 PIC16C57 OTP 2048x12 72 20 1-8bit/1-WDT 20 28 20 mA 0 0 PIC16C57C OTP 2048x12 72 20 1-8bit/1-WDT 40 28 20 mA 0 0 PIC16C58B OTP 2048x12 73 12 1-8bit/1-WDT 40 18/20 20 mA 0 0 PIC16C620 OTP 512x14 80 13 2 1-8bit/1-WDT 20 18/20 √ 25 mA √ 0 0 PIC16C620A OTP 512x14 96 13 2 1-8bit/1-WDT 40 18/20 √ 25 mA √ 0 0 PIC16C621 OTP 1024x14 80 13 2 1-8bit/1-WDT 20 18/20 √ 25 mA √ 0 0 PIC16C621A OTP 1024x14 96 13 2 1-8bit/1-WDT 40 18/20 √ 25 mA √ 0 0 PIC16C622 OTP 2048x14 128 13 2 1-8bit/1-WDT 20 18/20 √ 25 mA √ 0 0 PIC16C622A OTP 2048x14 128 13 2 1-8bit/1-WDT 40 18/20/40 √ 25 mA √ 0 0 PIC16C62A OTP 2048x14 128 22 2-8bit/1-16bit/1-WDT I²C/ SPI 20 28/ √ 1 25 mA 1 0 0 PIC16C62B OTP 2048x14 128 22 2-8bit/1-16bit/1-WDT I²C /SPI 20 28 √ 1 25 mA 1 0 0 PIC16C63 OTP 4096x14 192 22 2-8bit/1-16bit/1-WDT USART/I²C /SPI 20 28 √ 2 25 mA 2 0 0 PIC16C63A OTP 4096x14 192 22 2-8bit/1-16bit/1-WDT USART/I²C/SPI 20 28 √ 2 25 mA 2 0 0 PIC16C642 OTP 4096x14 176 22 2 1-8bit/1-WDT 20 28 √ 25 mA √ 0 0 PIC16C64A OTP 2048x14 128 33 2-8bit/1-16bit/1-WDT I²C /SPI 20 40/44 √ 1 25 mA 1 0 0 PIC16C65A OTP 4096x14 192 33 2-8bit/1-16bit/1-WDT USART/I²C/SPI 20 40/44 √ 2 25 mA 2 0 0 PIC16C65B OTP 4096x14 192 33 2-8bit/1-16bit/1-WDT USART/I²C/SPI 20 40/44 √ 2 25 mA 2 0 0 PIC16C66 OTP 8192x14 368 22 2-8bit/1-16bit/1-WDT USART/I²C/SPI 20 28 √ 2 25 mA 2 0 0 PIC16C662 OTP 4096x14 176 33 2 1-8bit/1-WDT 20 40/44 √ 25 mA √ 0 0 PIC16C67 OTP 8192x14 368 33 2-8bit/1-16bit/1-WDT USART/I²C /SPI 20 40/44 √ 2 25 mA 2 0 0 PIC16C71 OTP 1024x14 36 13 4/8 1-8bit/1-WDT 20 18 √ 25 mA 0 0 PIC16C710 OTP 512x14 36 13 4/8 1-8bit/1-WDT 20 18/20 √ 25 mA 0 0 PIC16C711 OTP 1024x14 68 13 4/8 1-8bit/1-WDT 20 18/20 √ 25 mA
上传时间： 2013-10-12
上传用户：xjy441694216
摘要: 串行传输技术具有更高的传输速率和更低的设计成本, 已成为业界首选, 被广泛应用于高速通信领域。提出了一种新的高速串行传输接口的设计方案, 改进了Aurora 协议数据帧格式定义的弊端, 并采用高速串行收发器Rocket I/O, 实现数据率为2.5 Gbps的高速串行传输。关键词: 高速串行传输; Rocket I/O; Aurora 协议 为促使FPGA 芯片与串行传输技术更好地结合以满足市场需求, Xilinx 公司适时推出了内嵌高速串行收发器RocketI/O 的Virtex II Pro 系列FPGA 和可升级的小型链路层协议———Aurora 协议。Rocket I/O支持从622 Mbps 至3.125 Gbps的全双工传输速率, 还具有8 B/10 B 编解码、时钟生成及恢复等功能, 可以理想地适用于芯片之间或背板的高速串行数据传输。Aurora 协议是为专有上层协议或行业标准的上层协议提供透明接口的第一款串行互连协议, 可用于高速线性通路之间的点到点串行数据传输, 同时其可扩展的带宽, 为系统设计人员提供了所需要的灵活性[4]。但该协议帧格式的定义存在弊端,会导致系统资源的浪费。本文提出的设计方案可以改进Aurora 协议的固有缺陷,提高系统性能, 实现数据率为2.5 Gbps 的高速串行传输, 具有良好的可行性和广阔的应用前景。
上传时间： 2013-11-06
上传用户：smallfish
概要2 个对称的600MHz 高性能Blackfin 内核328K Bytes 片内存储器每个 Blackfin 内核包括:2 个16 位MAC，2 个40 位ALU，4 个8 位视频ALU，以及1 个40 位移位器RISC 式寄存器和指令模型，编程简单，编译环境友好先进的调试、跟踪和性能监视内核电压 0.8V-1.2V，片内调压器可调兼容 3.3V 及2.5V I/O256 引脚Mini-BGA 和297 引脚PBGA 两种封装外设两个并行输入/输出外围接口单元，支持ITU-R 656 视频数据格式，可与ADI 的模拟前端ADC 无缝连接2 个双通道全双工同步串行接口，支持8 个立体声I2S 通道2 个16 通道DMA 控制器和1 个内部存储器DMA 控制器SPI 兼容端口12 个通用32-bit 定时/计数器，支持PWMSPI 兼容端口支持 IrDA 的UART2 个“看门狗”定时器48 个可编程标志引脚1x-63x 倍频的片内PLL
上传时间： 2013-11-06
上传用户：YUANQINHUI
摘要: 串行传输技术具有更高的传输速率和更低的设计成本, 已成为业界首选, 被广泛应用于高速通信领域。提出了一种新的高速串行传输接口的设计方案, 改进了Aurora 协议数据帧格式定义的弊端, 并采用高速串行收发器Rocket I/O, 实现数据率为2.5 Gbps的高速串行传输。关键词: 高速串行传输; Rocket I/O; Aurora 协议 为促使FPGA 芯片与串行传输技术更好地结合以满足市场需求, Xilinx 公司适时推出了内嵌高速串行收发器RocketI/O 的Virtex II Pro 系列FPGA 和可升级的小型链路层协议———Aurora 协议。Rocket I/O支持从622 Mbps 至3.125 Gbps的全双工传输速率, 还具有8 B/10 B 编解码、时钟生成及恢复等功能, 可以理想地适用于芯片之间或背板的高速串行数据传输。Aurora 协议是为专有上层协议或行业标准的上层协议提供透明接口的第一款串行互连协议, 可用于高速线性通路之间的点到点串行数据传输, 同时其可扩展的带宽, 为系统设计人员提供了所需要的灵活性[4]。但该协议帧格式的定义存在弊端,会导致系统资源的浪费。本文提出的设计方案可以改进Aurora 协议的固有缺陷,提高系统性能, 实现数据率为2.5 Gbps 的高速串行传输, 具有良好的可行性和广阔的应用前景。
上传时间： 2013-10-13
上传用户：lml1234lml
数字运算，判断一个数是否接近素数 A Niven number is a number such that the sum of its digits divides itself. For example, 111 is a Niven number because the sum of its digits is 3, which divides 111. We can also specify a number in another base b, and a number in base b is a Niven number if the sum of its digits divides its value. Given b (2 <= b <= 10) and a number in base b, determine whether it is a Niven number or not. Input Each line of input contains the base b, followed by a string of digits representing a positive integer in that base. There are no leading zeroes. The input is terminated by a line consisting of 0 alone. Output For each case, print "yes" on a line if the given number is a Niven number, and "no" otherwise. Sample Input 10 111 2 110 10 123 6 1000 8 2314 0 Sample Output yes yes no yes no
上传时间： 2015-05-21
上传用户：daguda
