利用负阻原理设计了5.9 GHz介质振荡器（DRO），采用HFSS软件对介质谐振块（DR）进行三维仿真，应用Agilent公司的ADS软件对DRO进行了优化设计和非线性分析，用该方法制作的并联反馈式DRO性能良好，输出功率为10 dBm，相位噪声达到-100 dBc/Hz＠10 kHz，-124 dBc/Hz＠100 kHz。
上传时间： 2013-10-10
上传用户：urgdil
Control systems are becoming increasingly dependent on digital processing and so require sensors able to provide direct digital inputs. Sensors based on time measurement, having outputs based on a frequency or phase, have an advantage over conventional analogue sensors in that their outputs can be measured directly in digital systems by pulse counting.
上传时间： 2013-10-08
上传用户：wuyuying
能实现VCO 功能的电路很多，常用的有分立器件构成的振荡器和集成压控振荡器。如串联谐振电容三点式电路、压控晶体振荡器，积分-施密特电路、射级耦合多谐振荡器、变容二极管调谐LC 振荡器和数字门电路等几种。它们之间各有优缺点，下面做简要分析，并选择最合适的方案。
上传时间： 2013-11-06
上传用户：tdyoung
现代的电子设计和芯片制造技术正在飞速发展，电子产品的复杂度、时钟和总线频率等等都呈快速上升趋势，但系统的电压却不断在减小，所有的这一切加上产品投放市场的时间要求给设计师带来了前所未有的巨大压力。要想保证产品的一次性成功就必须能预见设计中可能出现的各种问题，并及时给出合理的解决方案，对于高速的数字电路来说，最令人头大的莫过于如何确保瞬时跳变的数字信号通过较长的一段传输线，还能完整地被接收，并保证良好的电磁兼容性，这就是目前颇受关注的信号完整性（SI）问题。本章就是围绕信号完整性的问题，让大家对高速电路有个基本的认识，并介绍一些相关的基本概念。 第一章 高速数字电路概述.....................................................................................51.1 何为高速电路...............................................................................................51.2 高速带来的问题及设计流程剖析...............................................................61.3 相关的一些基本概念...................................................................................8第二章 传输线理论...............................................................................................122.1 分布式系统和集总电路.............................................................................122.2 传输线的RLCG 模型和电报方程...............................................................132.3 传输线的特征阻抗.....................................................................................142.3.1 特性阻抗的本质.................................................................................142.3.2 特征阻抗相关计算.............................................................................152.3.3 特性阻抗对信号完整性的影响.........................................................172.4 传输线电报方程及推导.............................................................................182.5 趋肤效应和集束效应.................................................................................232.6 信号的反射.................................................................................................252.6.1 反射机理和电报方程.........................................................................252.6.2 反射导致信号的失真问题.................................................................302.6.2.1 过冲和下冲.....................................................................................302.6.2.2 振荡：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分线的匹配.................................................................................392.6.3.4 多负载的匹配.................................................................................41第三章 串扰的分析...............................................................................................423.1 串扰的基本概念.........................................................................................423.2 前向串扰和后向串扰.................................................................................433.3 后向串扰的反射.........................................................................................463.4 后向串扰的饱和.........................................................................................463.5 共模和差模电流对串扰的影响.................................................................483.6 连接器的串扰问题.....................................................................................513.7 串扰的具体计算.........................................................................................543.8 避免串扰的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的产生..................................................................................................614.2.1 电压瞬变.............................................................................................614.2.2 信号的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 电场屏蔽.........................................................................................654.3.1.2 磁场屏蔽.........................................................................................674.3.1.3 电磁场屏蔽.....................................................................................674.3.1.4 电磁屏蔽体和屏蔽效率.................................................................684.3.2 滤波.....................................................................................................714.3.2.1 去耦电容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 设计中的EMI.......................................................................................754.4.1 传输线RLC 参数和EMI ........................................................................764.4.2 叠层设计抑制EMI ..............................................................................774.4.3 电容和接地过孔对回流的作用.........................................................784.4.4 布局和走线规则.................................................................................79第五章 电源完整性理论基础...............................................................................825.1 电源噪声的起因及危害.............................................................................825.2 电源阻抗设计.............................................................................................855.3 同步开关噪声分析.....................................................................................875.3.1 芯片内部开关噪声.............................................................................885.3.2 芯片外部开关噪声.............................................................................895.3.3 等效电感衡量SSN ..............................................................................905.4 旁路电容的特性和应用.............................................................................925.4.1 电容的频率特性.................................................................................935.4.3 电容的介质和封装影响.....................................................................955.4.3 电容并联特性及反谐振.....................................................................955.4.4 如何选择电容.....................................................................................975.4.5 电容的摆放及Layout ........................................................................99第六章 系统时序.................................................................................................1006.1 普通时序系统...........................................................................................1006.1.1 时序参数的确定...............................................................................1016.1.2 时序约束条件...................................................................................1066.2 源同步时序系统.......................................................................................1086.2.1 源同步系统的基本结构...................................................................1096.2.2 源同步时序要求...............................................................................110第七章 IBIS 模型................................................................................................1137.1 IBIS 模型的由来...................................................................................... 1137.2 IBIS 与SPICE 的比较.............................................................................. 1137.3 IBIS 模型的构成...................................................................................... 1157.4 建立IBIS 模型......................................................................................... 1187.4 使用IBIS 模型......................................................................................... 1197.5 IBIS 相关工具及链接..............................................................................120第八章 高速设计理论在实际中的运用.............................................................1228.1 叠层设计方案...........................................................................................1228.2 过孔对信号传输的影响...........................................................................1278.3 一般布局规则...........................................................................................1298.4 接地技术...................................................................................................1308.5 PCB 走线策略............................................................................................134
标签： 信号完整性
上传时间： 2014-05-15
上传用户：dudu1210004
第一部分 信号完整性知识基础.................................................................................5第一章 高速数字电路概述.....................................................................................51.1 何为高速电路...............................................................................................51.2 高速带来的问题及设计流程剖析...............................................................61.3 相关的一些基本概念...................................................................................8第二章 传输线理论...............................................................................................122.1 分布式系统和集总电路.............................................................................122.2 传输线的RLCG 模型和电报方程...............................................................132.3 传输线的特征阻抗.....................................................................................142.3.1 特性阻抗的本质.................................................................................142.3.2 特征阻抗相关计算.............................................................................152.3.3 特性阻抗对信号完整性的影响.........................................................172.4 传输线电报方程及推导.............................................................................182.5 趋肤效应和集束效应.................................................................................232.6 信号的反射.................................................................................................252.6.1 反射机理和电报方程.........................................................................252.6.2 反射导致信号的失真问题.................................................................302.6.2.1 过冲和下冲.....................................................................................302.6.2.2 振荡：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分线的匹配.................................................................................392.6.3.4 多负载的匹配.................................................................................41第三章 串扰的分析...............................................................................................423.1 串扰的基本概念.........................................................................................423.2 前向串扰和后向串扰.................................................................................433.3 后向串扰的反射.........................................................................................463.4 后向串扰的饱和.........................................................................................463.5 共模和差模电流对串扰的影响.................................................................483.6 连接器的串扰问题.....................................................................................513.7 串扰的具体计算.........................................................................................543.8 避免串扰的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的产生..................................................................................................614.2.1 电压瞬变.............................................................................................614.2.2 信号的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 电场屏蔽.........................................................................................654.3.1.2 磁场屏蔽.........................................................................................674.3.1.3 电磁场屏蔽.....................................................................................674.3.1.4 电磁屏蔽体和屏蔽效率.................................................................684.3.2 滤波.....................................................................................................714.3.2.1 去耦电容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 设计中的EMI.......................................................................................754.4.1 传输线RLC 参数和EMI ........................................................................764.4.2 叠层设计抑制EMI ..............................................................................774.4.3 电容和接地过孔对回流的作用.........................................................784.4.4 布局和走线规则.................................................................................79第五章 电源完整性理论基础...............................................................................825.1 电源噪声的起因及危害.............................................................................825.2 电源阻抗设计.............................................................................................855.3 同步开关噪声分析.....................................................................................875.3.1 芯片内部开关噪声.............................................................................885.3.2 芯片外部开关噪声.............................................................................895.3.3 等效电感衡量SSN ..............................................................................905.4 旁路电容的特性和应用.............................................................................925.4.1 电容的频率特性.................................................................................935.4.3 电容的介质和封装影响.....................................................................955.4.3 电容并联特性及反谐振.....................................................................955.4.4 如何选择电容.....................................................................................975.4.5 电容的摆放及Layout ........................................................................99第六章 系统时序.................................................................................................1006.1 普通时序系统...........................................................................................1006.1.1 时序参数的确定...............................................................................1016.1.2 时序约束条件...................................................................................1063.2 高速设计的问题.......................................................................................2093.3 SPECCTRAQuest SI Expert 的组件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系统......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自动布线器.......................................................2303.4 高速设计的大致流程...............................................................................2303.4.1 拓扑结构的探索...............................................................................2313.4.2 空间解决方案的探索.......................................................................2313.4.3 使用拓扑模板驱动设计...................................................................2313.4.4 时序驱动布局...................................................................................2323.4.5 以约束条件驱动设计.......................................................................2323.4.6 设计后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的进阶运用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 图形化的拓扑结构探索...........................................................................2344.3 全面的信号完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 设计前和设计的拓扑结构提取.......................................................2354.6 仿真设置顾问...........................................................................................2354.7 改变设计的管理.......................................................................................2354.8 关键技术特点...........................................................................................2364.8.1 拓扑结构探索...................................................................................2364.8.2 SigWave 波形显示器........................................................................2364.8.3 集成化的在线分析(Integration and In-process Analysis) .236第五章 部分特殊的运用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信号的仿真.......................................................................................2435.3 眼图模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 进行前仿真.......................................................................2511.1 用LineSim 进行仿真工作的基本方法...................................................2511.2 处理信号完整性原理图的具体问题.......................................................2591.3 在LineSim 中如何对传输线进行设置...................................................2601.4 在LineSim 中模拟IC 元件.....................................................................2631.5 在LineSim 中进行串扰仿真...................................................................268第二章 使用BOARDSIM 进行后仿真......................................................................2732.1 用BOARDSIM 进行后仿真工作的基本方法...................................................2732.2 BoardSim 的进一步介绍..........................................................................2922.3 BoardSim 中的串扰仿真..........................................................................309
上传时间： 2014-04-18
上传用户：wpt
时域与频域• 傅立叶变换• 干扰抑制设计– 时钟电路干扰抑制设计– 总线电路干扰抑制设计– 单板电源电路去耦设计– 开关电源干扰抑制设计– 接口电路干扰抑制设计• 抗干扰设计– 看门狗电路抗干扰设计– 面板复位电路抗干扰设计– 面板指示灯抗干扰设计– 接口电路抗干扰设计– 电源电路抗干扰设计– 面板拨码开关电路抗干扰设计
上传时间： 2013-11-23
上传用户：cjl42111
普通的PWM变换器具有结构简洁、控制简单、频率恒定、输出特性好等优点，故广泛应用于社会生活的各个领域中。本文以boost基本电路为基础，采用简单的无源谐振网络，设计实现了开关管的软开关。这种新型的无源软开关解决了输出二极管反向恢复问题，具有结构简单、高频率、高效率、易于控制等优点。该设计可用于以IGBT为开关器件的高压场合。分析了该变换器的工作原理、实现条件、设计谐振网络的参数、并进行了仿真。
上传时间： 2014-12-24
上传用户：ginani
分析了高频整流电路输入电流的谐波特性，并在高频整流电路的基础上进行了改进，分别加入了并联谐振电路和低通滤波器。利用Multisim构建了仿真模型，给出了仿真模型中电路的参数，得到了仿真结果。仿真结果表明，高频整流电路的改进设计方法可有效地抑制电源模块输入电流的谐波
上传时间： 2013-11-09
上传用户：Artemis
LK1628是一种带键盘扫描接口的LED驱动控制专用电路，内部集成有MCU数字接口、数据锁存器、LED驱动、键盘扫描等电路。且在输入端口内置上拉，可在应用方案中省去外部上拉电阻。采用CMOS工艺，VDD供电为5V，超强的输入端口干扰能力，输入端口内置上拉电阻，显示模式：4位×13段—7位×10段，按键扫描：10×2位。辉度调节电路（占空比8级可调），串行接口（CLK,STB,DI/O），振荡方式：内置RC振荡，内置上电复位电路，ESD HBM:﹥8KV，SOP28的封装形式。
上传时间： 2013-10-17
上传用户：YUANQINHUI
传统的全桥开关电源拓扑，最常用于大功率隔离式或脱线电源。虽然它需要多加两个开关元件。但其能输出更大功率，又有较高的效率，且变压器体积比单端方式的都小。开关还有较小的电压及电流应力。全桥变换器还提供固有的变压器磁芯自动复位及平衡。因而可有最大占空比，进一步提高效率，而软开关的全桥，可进一步改善性能提高效率。
上传时间： 2014-07-13
上传用户：Garfield
