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书籍 Thermal+Management+of+Telecommunications+Equipment

The need to develop reliable microelectronic devices capable of operating at high speeds with complex functionality requires a better understanding of the factors that govern the thermal performance of electronics. With an increased demand on system reliability and performance combined with miniatur ...
https://www.eeworm.com/dl/522164.html
下载: 1
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书籍 Wireless+Communication+Circuits+and+Systems

This book is concerned with integrated circuits and systems for wireless and mobile communications. Circuit techniques and implementation of reconfigurable low-voltage and low-power single-chip CMOS transceivers for multiband and multi- mode universal wireless communications are the focus of the boo ...
https://www.eeworm.com/dl/522206.html
下载: 1
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书籍 Electrostatic Discharge Protection

Electrostatic discharge (ESD) is one of the most prevalent threats to the reliability of electronic components. It is an event in which a finite amount of charge is trans- ferred from one object (i.e., human body) to another (i.e., microchip). This process can result in a very high current passing t ...
https://www.eeworm.com/dl/522246.html
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论文 ESD_protection_for_RF_and_AMS_ICs

This paper reviews key factors to practical ESD protection design for RF and analog/mixed-signal (AMS) ICs, including general challenges emerging, ESD-RFIC interactions, RF ESD design optimization and prediction, RF ESD design characterization, ESD-RFIC co-design technique, etc. Practical design exa ...
https://www.eeworm.com/dl/522259.html
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书籍 Basic ESD Design Guidelines

ESD is a crucial factor for integrated circuits and influences their quality and reliability. Today increasingly sensitive processes with deep sub micron structures are developed. The integration of more and more functionality on a single chip and saving of chip area is required. Integrated circuits ...
https://www.eeworm.com/dl/522265.html
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书籍 Power+Electronic+Modules+Design+Manufacture

A power semiconductor module is basically a power circuit of different materials assembled together using hybrid technology, such as semiconduc- tor chip attachment, wire bonding, encapsulation, etc. The materials involved cover a wide range from insulators, conductors, and semiconduc- tors to organ ...
https://www.eeworm.com/dl/522342.html
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书籍 Wireless Identification

We are in the era of ubiquitous computing in which the use and development of Radio Frequency Iden- tification (RFID) is becoming more widespread. RFID systems have three main components: readers, tags, and database. An RFID tag is composed of a small microchip, limited logical functionality, and an ...
https://www.eeworm.com/dl/522404.html
下载: 1
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手册 MAX1447

MAX1447  3.5- and 4.5-Digit, Single-Chip ADCs with LED Drivers
https://www.eeworm.com/dl/523031.html
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技术资料 永嘉原厂技术支持：LCD液晶驱动芯片兼用HT16C22 LQFP52/48

深圳市永嘉微电科技有限公司，原厂直销！原装现货更有优势！工程服务，技术支持，让您的生产高枕无忧！量大价优，保证原装。您有量，我有价！ 联系人：许先生               联系手机：188 9858 2398 （微信）    &n ...
https://www.eeworm.com/dl/742585.html
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电路图 SOP28封装的LCD液晶驱动显示芯片VK1072B

产品型号：VK1072B 产品品牌：VINKA/永嘉微电 封装形式: SOP28 联 系 人：沈经理 联 系 QQ：288 521 8966  联系手机：13554744703 提供专业工程服务，用芯服务客户-F03 概述：VK1072B 是一个18×4的LCD驱动器，可软件配置使其适用于各种LCD应用，仅用3条信号线便可控制LCD驱动器，也可通过指令使其进入 ...
https://www.eeworm.com/dl/742724.html
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