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<a NAME="CompactPCI"></a>CompactPCI Implementation Information
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Table of Contents</h2>
<blockquote><a href="#10">1.0. Introduction</a>
<br><a href="#20">2.0. Guidelines</a>
<blockquote><a href="#21">2.1. Physical Differences</a>
<br><a href="#22">2.2. Interface Differences</a>
<br><a href="#23">2.3. Functional Differences</a>
<br><a href="#24">2.4. Electrical Differences</a></blockquote>
<a href="#30">3.0. Summary</a></blockquote>
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<a href="#CompactPCI">Back to Top</a></h4>
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1.0.<a NAME="10"></a> Introduction</h2>
The Xilinx PCI and PCI-X interfaces support CompactPCI implementations.
CompactPCI is derived from standard PCI and PCI-X interfaces. This
document addresses design issues specific to CompactPCI. If you are
implementing a CompactPCI design, please read this document carefully.
<p>For additional information, please refer to the <i>CompactPCI Specification
PICMG 2.0 R3.0</i> and <i>CompactPCI Hot Swap Specification PICMG 2.1 R2.0</i>.
These documents are published by, and available from, the <a href="http://www.picmg.org">PICMG
special interest group</a>.
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<a href="#CompactPCI">Back to Top</a></h4>
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2.0. <a NAME="20"></a>Guidelines</h2>
The the <i>CompactPCI Specification PICMG 2.0 R3.0</i> and <i>CompactPCI
Hot Swap Specification PICMG 2.1 R2.0 </i>provide guidelines for CompactPCI
implementations. The material presented in this document is intended
for reference only; for complete specifications, please consult the original
documents.
<h3>
2.1. <a NAME="21"></a>Physical Differences</h3>
CompactPCI applications have unique physical and mechanical requirements.
Consult the <i>CompactPCI Specification PICMG 2.0 R3.0</i> for specific
information regarding these requirements. These are beyond the scope
of this document and do not materially impact the implementation of such
an interface using the Xilinx interfaces.
<h3>
2.2. <a NAME="22"></a>Interface Differences</h3>
The logical implementation of a CompactPCI interface, in its basic form
(Non Hot Swap), is no different than a comparable standard PCI implementation.
Some differences do exist in the board level implementation. Note
that the CompactPCI Hot Swap specification defines three levels of Hot
Swap boards, and three levels of Hot Swap systems:
<blockquote><b>Boards</b>:
<br>Non Hot Swap
<br>Basic Hot Swap
<br>Full Hot Swap
<p><b>Systems</b>:
<br>Non Hot Swap
<br>Hot Swap
<br>High Availability</blockquote>
For Hot Swap implementations, the Hot Swap Register Block must be implemented
in user configuration space as a capabilities list item. The Hot
Swap Register Block is discussed in Chapter 7.2 of the <i>CompactPCI Hot
Swap Specification PICMG 2.1 R2.0.</i> After implementing the user
configuration space register and the associated functionality, link the
capability list item into the capabilities list by adjusting the capabilities
pointer and / or the next item pointers of other capabilities list items.
User configuration space and the capabilities pointer are described in
the design guide shipped with the Xilinx interface.
<h3>
2.3. <a NAME="23"></a>Functional Differences</h3>
There are no differences between CompactPCI functionality and standard
PCI functionality.
<h3>
2.4. <a NAME="24"></a>Electrical Differences</h3>
There are no differences between the Non Hot Swap CompactPCI device electrical
specifications and standard PCI electrical specifications. However,
CompactPCI places a number of additional specifications on the actual board
implementation. You <i>must</i> obtain and carefully read the implementation
instructions provided in the relevant PICMG documents to ensure implementation
compliance.
<p>For Hot Swap implementations, the implementation technology must provide
low quiescent leakage current. Silicon requirements are discussed
in Chapter 7.1 of the <i>CompactPCI Hot Swap Specification PICMG 2.1 R2.0.</i>
Most FPGA devices supported by this Xilinx interface support HotSwap implementations.
Consult the relevant FPGA device datasheet for additional information on
leakage current and how to disable the device I/O pullups before and during the FPGA device
configuration process.
<h4>
<a href="#CompactPCI">Back to Top</a></h4>
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3.0. <a NAME="30"></a>Summary</h2>
The Xilinx PCI and PCI-X interfaces support CompactPCI implementations.
However, some extra design work may be required depending on the specific
requirements of your CompactPCI implementation. No modifications
to the standard Xilinx interface are required.
<p>For additional information, please refer to the <i>CompactPCI Specification
PICMG 2.0 R3.0</i> and <i>CompactPCI Hot Swap Specification PICMG 2.1 R2.0</i>.
These documents are published by, and available from, the <a href="http://www.picmg.org">PICMG
special interest group</a>.
<h4>
<a href="#CompactPCI">Back to Top</a></h4>
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