interconn.iml

来自「cadence公司pcb内部培训的资料,并且附带其中的例子程序!比市面上任何一本」· IML 代码 · 共 1,085 行 · 第 1/2 页

IML
1,085 行
字号
12
*Delay Matrix.*Td 0 (n=1)*  6.655900e-009 *Admittance Matrix.*Y 0 (n=1)* 1.300000e-002 *Impedance Matrix.*Z 0 (n=1)*  7.692200e+001 **The Near-End Crosstalk Coefficent of these Transmission**Lines based on Near-End Resistance=50 ohm assumption:*Near-End Crosstalk Coefficent Matrix, Z0*Inv(R+Z0).*  0 (n=1)*  6.060600e-001 .ends STL_1S_1R_9871" )    (KSPICE "DATAPOINTS RLGC STL_1S_1R_9871FREQUENCY=0CMATRIX 8.652800e-011 LMATRIX 5.119900e-007 GMATRIX 0.000000e+000 RMATRIX 7.106900e+000 END RLGC" )    (Frequency 0 ) )   (STL_1S_1R_2593    (IDL ".subckt STL_1S_1R_2593+X1 0+X2 0*EMIinfo Type Bottom MicroStrip*EMIinfo Plane Z=0.000315976*EMIinfo Dielectric Eps=4.5 Thick=0.0001778*EMIinfo Conductor Width=4 TopDist=0.0001778 BotDist=0.000107188*EMIinfo Dielectric Eps=4.5 Thick=0.000107188.layerstack Layerstack1+dielectric( 0.000107188 4.5 0.035 )+dielectric( 0.0001778 4.5 0.035 )+shield( 6.1976e-005 1 0 ).crosssection+rectangle ( 5.959e+007 0 7.62e-005 0.0001016 0.000107188 )+Length=length.rlgc RLGCSTL_1S_1R_2593 ( Length=length N=1 ).C 0+ 9.353300e-011 .L 0+ 4.707800e-007 .G 0+ 0.000000e+000 .R 0+ 5.330100e+000 .endrlgc RLGCSTL_1S_1R_2593 **The Characteristic Modal Delay, Admittance and**Impedance Matrices of these Transmission Lines:*Delay Matrix.*Td 0 (n=1)*  6.635800e-009 *Admittance Matrix.*Y 0 (n=1)* 1.409500e-002 *Impedance Matrix.*Z 0 (n=1)*  7.094600e+001 **The Near-End Crosstalk Coefficent of these Transmission**Lines based on Near-End Resistance=50 ohm assumption:*Near-End Crosstalk Coefficent Matrix, Z0*Inv(R+Z0).*  0 (n=1)*  5.865900e-001 .ends STL_1S_1R_2593" )    (KSPICE "DATAPOINTS RLGC STL_1S_1R_2593FREQUENCY=0CMATRIX 9.353300e-011 LMATRIX 4.707800e-007 GMATRIX 0.000000e+000 RMATRIX 5.330100e+000 END RLGC" )    (Frequency 0 ) )   (STL_1S_1R_9308    (IDL ".subckt STL_1S_1R_9308+X1 0+X2 0*EMIinfo Type Bottom MicroStrip*EMIinfo Plane Z=0.000315976*EMIinfo Dielectric Eps=4.5 Thick=0.0001778*EMIinfo Dielectric Eps=4.5 Thick=0.000107188*EMIinfo Conductor Width=8 TopDist=0.000284988.layerstack Layerstack1+dielectric( 0.000107188 4.5 0.035 )+dielectric( 0.0001778 4.5 0.035 )+shield( 6.1976e-005 1 0 ).crosssection+rectangle ( 5.959e+007 0 -3.0988e-005 0.0002032 0 )+Length=length.rlgc RLGCSTL_1S_1R_9308 ( Length=length N=1 ).C 0+ 7.392800e-011 .L 0+ 4.513100e-007 .G 0+ 0.000000e+000 .R 0+ 2.665100e+000 .endrlgc RLGCSTL_1S_1R_9308 **The Characteristic Modal Delay, Admittance and**Impedance Matrices of these Transmission Lines:*Delay Matrix.*Td 0 (n=1)*  5.776200e-009 *Admittance Matrix.*Y 0 (n=1)* 1.279900e-002 *Impedance Matrix.*Z 0 (n=1)*  7.813300e+001 **The Near-End Crosstalk Coefficent of these Transmission**Lines based on Near-End Resistance=50 ohm assumption:*Near-End Crosstalk Coefficent Matrix, Z0*Inv(R+Z0).*  0 (n=1)*  6.097800e-001 .ends STL_1S_1R_9308" )    (KSPICE "DATAPOINTS RLGC STL_1S_1R_9308FREQUENCY=0CMATRIX 7.392800e-011 LMATRIX 4.513100e-007 GMATRIX 0.000000e+000 RMATRIX 2.665100e+000 END RLGC" )    (Frequency 0 ) )   (STL_1S_1R_8085    (IDL ".subckt STL_1S_1R_8085+X1 0+X2 0*EMIinfo Type Bottom MicroStrip*EMIinfo Plane Z=0.000315976*EMIinfo Dielectric Eps=4.5 Thick=0.0001778*EMIinfo Dielectric Eps=4.5 Thick=0.000107188*EMIinfo Conductor Width=9 TopDist=0.000284988.layerstack Layerstack1+dielectric( 0.000107188 4.5 0.035 )+dielectric( 0.0001778 4.5 0.035 )+shield( 6.1976e-005 1 0 ).crosssection+rectangle ( 5.959e+007 0 -3.0988e-005 0.0002286 0 )+Length=length.rlgc RLGCSTL_1S_1R_8085 ( Length=length N=1 ).C 0+ 7.784400e-011 .L 0+ 4.324800e-007 .G 0+ 0.000000e+000 .R 0+ 2.369000e+000 .endrlgc RLGCSTL_1S_1R_8085 **The Characteristic Modal Delay, Admittance and**Impedance Matrices of these Transmission Lines:*Delay Matrix.*Td 0 (n=1)*  5.802200e-009 *Admittance Matrix.*Y 0 (n=1)* 1.341600e-002 *Impedance Matrix.*Z 0 (n=1)*  7.453700e+001 **The Near-End Crosstalk Coefficent of these Transmission**Lines based on Near-End Resistance=50 ohm assumption:*Near-End Crosstalk Coefficent Matrix, Z0*Inv(R+Z0).*  0 (n=1)*  5.985100e-001 .ends STL_1S_1R_8085" )    (KSPICE "DATAPOINTS RLGC STL_1S_1R_8085FREQUENCY=0CMATRIX 7.784400e-011 LMATRIX 4.324800e-007 GMATRIX 0.000000e+000 RMATRIX 2.369000e+000 END RLGC" )    (Frequency 0 ) )   (STL_1S_1R_7456    (IDL ".subckt STL_1S_1R_7456+X1 0+X2 0*EMIinfo Type Bottom MicroStrip*EMIinfo Plane Z=0.000315976*EMIinfo Dielectric Eps=4.5 Thick=0.0001778*EMIinfo Dielectric Eps=4.5 Thick=0.000107188*EMIinfo Conductor Width=10 TopDist=0.000284988.layerstack Layerstack1+dielectric( 0.000107188 4.5 0.035 )+dielectric( 0.0001778 4.5 0.035 )+shield( 6.1976e-005 1 0 ).crosssection+rectangle ( 5.959e+007 0 -3.0988e-005 0.000254 0 )+Length=length.rlgc RLGCSTL_1S_1R_7456 ( Length=length N=1 ).C 0+ 8.186400e-011 .L 0+ 4.152800e-007 .G 0+ 0.000000e+000 .R 0+ 2.132100e+000 .endrlgc RLGCSTL_1S_1R_7456 **The Characteristic Modal Delay, Admittance and**Impedance Matrices of these Transmission Lines:*Delay Matrix.*Td 0 (n=1)*  5.830700e-009 *Admittance Matrix.*Y 0 (n=1)* 1.404000e-002 *Impedance Matrix.*Z 0 (n=1)*  7.122400e+001 **The Near-End Crosstalk Coefficent of these Transmission**Lines based on Near-End Resistance=50 ohm assumption:*Near-End Crosstalk Coefficent Matrix, Z0*Inv(R+Z0).*  0 (n=1)*  5.875400e-001 .ends STL_1S_1R_7456" )    (KSPICE "DATAPOINTS RLGC STL_1S_1R_7456FREQUENCY=0CMATRIX 8.186400e-011 LMATRIX 4.152800e-007 GMATRIX 0.000000e+000 RMATRIX 2.132100e+000 END RLGC" )    (Frequency 0 ) )   (STL_1S_1R_605    (IDL ".subckt STL_1S_1R_605+X1 0+X2 0*EMIinfo Type Top MicroStrip*EMIinfo Conductor Width=12 BotDist=0.000284988*EMIinfo Dielectric Eps=4.5 Thick=0.000107188*EMIinfo Dielectric Eps=4.5 Thick=0.0001778*EMIinfo Plane Z=0.000770128.layerstack Layerstack3+shield( 6.1976e-005 1 0 )+dielectric( 0.0001778 4.5 0.035 )+dielectric( 0.000107188 4.5 0.035 ).crosssection+rectangle ( 5.959e+007 0 0.000284988 0.0003048 0.000315976 )+Length=length.rlgc RLGCSTL_1S_1R_605 ( Length=length N=1 ).C 0+ 8.961800e-011 .L 0+ 3.856100e-007 .G 0+ 0.000000e+000 .R 0+ 1.776700e+000 .endrlgc RLGCSTL_1S_1R_605 **The Characteristic Modal Delay, Admittance and**Impedance Matrices of these Transmission Lines:*Delay Matrix.*Td 0 (n=1)*  5.878600e-009 *Admittance Matrix.*Y 0 (n=1)* 1.524500e-002 *Impedance Matrix.*Z 0 (n=1)*  6.559600e+001 **The Near-End Crosstalk Coefficent of these Transmission**Lines based on Near-End Resistance=50 ohm assumption:*Near-End Crosstalk Coefficent Matrix, Z0*Inv(R+Z0).*  0 (n=1)*  5.674600e-001 .ends STL_1S_1R_605" )    (KSPICE "DATAPOINTS RLGC STL_1S_1R_605FREQUENCY=0CMATRIX 8.961800e-011 LMATRIX 3.856100e-007 GMATRIX 0.000000e+000 RMATRIX 1.776700e+000 END RLGC" )    (Frequency 0 ) )   (STL_1S_1R_1423    (IDL ".subckt STL_1S_1R_1423+X1 0+X2 0*EMIinfo Type Top MicroStrip*EMIinfo Dielectric Eps=4.5 Thick=0.000107188*EMIinfo Conductor Width=12 TopDist=0.000107188 BotDist=0.0001778*EMIinfo Dielectric Eps=4.5 Thick=0.0001778*EMIinfo Plane Z=0.000770128.layerstack Layerstack3+shield( 6.1976e-005 1 0 )+dielectric( 0.0001778 4.5 0.035 )+dielectric( 0.000107188 4.5 0.035 ).crosssection+rectangle ( 5.959e+007 0 0.0001778 0.0003048 0.000208788 )+Length=length.rlgc RLGCSTL_1S_1R_1423 ( Length=length N=1 ).C 0+ 1.429400e-010 .L 0+ 3.041500e-007 .G 0+ 0.000000e+000 .R 0+ 1.776700e+000 .endrlgc RLGCSTL_1S_1R_1423 **The Characteristic Modal Delay, Admittance and**Impedance Matrices of these Transmission Lines:*Delay Matrix.*Td 0 (n=1)*  6.593600e-009 *Admittance Matrix.*Y 0 (n=1)* 2.167900e-002 *Impedance Matrix.*Z 0 (n=1)*  4.612800e+001 **The Near-End Crosstalk Coefficent of these Transmission**Lines based on Near-End Resistance=50 ohm assumption:*Near-End Crosstalk Coefficent Matrix, Z0*Inv(R+Z0).*  0 (n=1)*  4.798600e-001 .ends STL_1S_1R_1423" )    (KSPICE "DATAPOINTS RLGC STL_1S_1R_1423FREQUENCY=0CMATRIX 1.429400e-010 LMATRIX 3.041500e-007 GMATRIX 0.000000e+000 RMATRIX 1.776700e+000 END RLGC" )    (Frequency 0 ) )   (STL_1S_1R_8396    (IDL ".subckt STL_1S_1R_8396+X1 0+X2 0*EMIinfo Type Bottom MicroStrip*EMIinfo Plane Z=0.000315976*EMIinfo Dielectric Eps=4.5 Thick=0.0001778*EMIinfo Conductor Width=12 TopDist=0.0001778 BotDist=0.000107188*EMIinfo Dielectric Eps=4.5 Thick=0.000107188.layerstack Layerstack1+dielectric( 0.000107188 4.5 0.035 )+dielectric( 0.0001778 4.5 0.035 )+shield( 6.1976e-005 1 0 ).crosssection+rectangle ( 5.959e+007 0 7.62e-005 0.0003048 0.000107188 )+Length=length.rlgc RLGCSTL_1S_1R_8396 ( Length=length N=1 ).C 0+ 1.429400e-010 .L 0+ 3.041500e-007 .G 0+ 0.000000e+000 .R 0+ 1.776700e+000 .endrlgc RLGCSTL_1S_1R_8396 **The Characteristic Modal Delay, Admittance and**Impedance Matrices of these Transmission Lines:*Delay Matrix.*Td 0 (n=1)*  6.593600e-009 *Admittance Matrix.*Y 0 (n=1)* 2.167900e-002 *Impedance Matrix.*Z 0 (n=1)*  4.612800e+001 **The Near-End Crosstalk Coefficent of these Transmission**Lines based on Near-End Resistance=50 ohm assumption:*Near-End Crosstalk Coefficent Matrix, Z0*Inv(R+Z0).*  0 (n=1)*  4.798600e-001 .ends STL_1S_1R_8396" )    (KSPICE "DATAPOINTS RLGC STL_1S_1R_8396FREQUENCY=0CMATRIX 1.429400e-010 LMATRIX 3.041500e-007 GMATRIX 0.000000e+000 RMATRIX 1.776700e+000 END RLGC" )    (Frequency 0 ) )   (STL_1S_1R_3833    (IDL ".subckt STL_1S_1R_3833+X1 0+X2 0*EMIinfo Type Bottom MicroStrip*EMIinfo Plane Z=0.000315976*EMIinfo Dielectric Eps=4.5 Thick=0.0001778*EMIinfo Dielectric Eps=4.5 Thick=0.000107188*EMIinfo Conductor Width=12 TopDist=0.000284988.layerstack Layerstack1+dielectric( 0.000107188 4.5 0.035 )+dielectric( 0.0001778 4.5 0.035 )+shield( 6.1976e-005 1 0 ).crosssection+rectangle ( 5.959e+007 0 -3.0988e-005 0.0003048 0 )+Length=length.rlgc RLGCSTL_1S_1R_3833 ( Length=length N=1 ).C 0+ 8.961800e-011 .L 0+ 3.856100e-007 .G 0+ 0.000000e+000 .R 0+ 1.776700e+000 .endrlgc RLGCSTL_1S_1R_3833 **The Characteristic Modal Delay, Admittance and**Impedance Matrices of these Transmission Lines:*Delay Matrix.*Td 0 (n=1)*  5.878600e-009 *Admittance Matrix.*Y 0 (n=1)* 1.524500e-002 *Impedance Matrix.*Z 0 (n=1)*  6.559600e+001 **The Near-End Crosstalk Coefficent of these Transmission**Lines based on Near-End Resistance=50 ohm assumption:*Near-End Crosstalk Coefficent Matrix, Z0*Inv(R+Z0).*  0 (n=1)*  5.674600e-001 .ends STL_1S_1R_3833" )    (KSPICE "DATAPOINTS RLGC STL_1S_1R_3833FREQUENCY=0CMATRIX 8.961800e-011 LMATRIX 3.856100e-007 GMATRIX 0.000000e+000 RMATRIX 1.776700e+000 END RLGC" )    (Frequency 0 ) )   (STL_1S_1R_2167    (IDL ".subckt STL_1S_1R_2167+X1 0+X2 0*EMIinfo Type Top MicroStrip*EMIinfo Dielectric Eps=4.5 Thick=0.00023368*EMIinfo Conductor Width=50 TopDist=0.00023368 BotDist=0.0002032*EMIinfo Dielectric Eps=4.5 Thick=0.0002032*EMIinfo Plane Z=0.00073152.layerstack Layerstack3+shield( 3.048e-005 1 0 )+dielectric( 0.0002032 4.5 0.035 )+dielectric( 0.00023368 4.5 0.035 ).crosssection+rectangle ( 5.959e+007 0 0.0002032 0.000127 0.00023368 )+Length=length.rlgc RLGCSTL_1S_1R_2167 ( Length=length N=1 ).C 0+ 1.014600e-010 .L 0+ 4.626200e-007 .G 0+ 0.000000e+000 .R 0+ 4.335200e+000 .endrlgc RLGCSTL_1S_1R_2167 **The Characteristic Modal Delay, Admittance and**Impedance Matrices of these Transmission Lines:*Delay Matrix.*Td 0 (n=1)*  6.851100e-009 *Admittance Matrix.*Y 0 (n=1)* 1.480900e-002 *Impedance Matrix.*Z 0 (n=1)*  6.752500e+001 **The Near-End Crosstalk Coefficent of these Transmission**Lines based on Near-End Resistance=50 ohm assumption:*Near-End Crosstalk Coefficent Matrix, Z0*Inv(R+Z0).*  0 (n=1)*  5.745600e-001 .ends STL_1S_1R_2167" )    (KSPICE "DATAPOINTS RLGC STL_1S_1R_2167FREQUENCY=0CMATRIX 1.014600e-010 LMATRIX 4.626200e-007 GMATRIX 0.000000e+000 RMATRIX 4.335200e+000 END RLGC" )    (Frequency 0 ) ) ) )
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interconn.iml - 源码说明

本页面展示了「cadence公司pcb内部培训的资料,并且附带其中的例子程序!比市面上任何一本cadence的书好!」中的 interconn.iml 源码文件，采用 IML 编程语言编写，共 1,085 行代码。您可以在线阅读完整代码内容，也可以返回资源详情页下载完整源码包进行本地学习和开发。

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