Generate a great circle "trajectory" from [lat1,lon1] to [lat2, lon2]. ％ resulting points will be seperated by approximately delta_ft feet. ％ By default, delta_ft = 100 feet. All lat/lon inputs & outputs are in ％ degrees.
标签： trajectory resulting lat Generate
上传时间： 2014-01-01
上传用户：璇珠官人
VHDL code for a clock divider by 27 circuit with a resulting waveform with 50％ duty cycle..
标签： with resulting waveform circuit
上传时间： 2014-01-04
上传用户：woshini123456
Program to solve for natural frequencies (eigenvalues) and resulting mode shapes (eigenvectors) in simple structures
标签： eigenvectors eigenvalues frequencies resulting
上传时间： 2017-09-11
上传用户：wqxstar
Piezoelectric motors are used in digital cameras for autofocus,zooming and optical image stabilization. Theyare relatively small, lightweight and effi cient, but theyalso require a complicated driving scheme. Traditionally,this challenge has been met with the use ofseparatecircuits, including a step-up converter and an oversizedgeneric full-bridge drive IC. The resulting high componentcount and large board space are especially problematicin the design of cameras for ever shrinking cell phones.The LT®3572 solves these problems by combining astep-up regulator and a dual full-bridge driver in a 4mm× 4mm QFN package. Figure 1 shows a typical LT3572Piezo motor drive circuit. A step-up converter is usedto generate 30V from a low voltage power source suchas a Li-Ion battery or any input power source within thepart’s wide input voltage range of 2.7V to 10V. The highoutput voltage of the step-up converter, adjustable upto 40V, is available for the drivers at the VOUT pin. Thedrivers operate in a full-bridge fashion, where the OUTAand OUTB pins are the same polarity as the PWMA andPWMB pins, respectively, and the OUTA and OUTB pinsare inverted from PWMA and PWMB, respectively. Thestep-up converter and both Piezo drivers have their ownshutdown control. Figure 2 shows a typical layout
上传时间： 2013-11-18
上传用户：hulee
As environmental concerns over traditional lighting increaseand the price of LEDs decreases, high power LEDsare fast becoming a popular lighting solution for offl ineapplications. In order to meet the requirements of offl inelighting—such as high power factor, high effi ciency, isolationand TRIAC dimmer compatibility—prior LED driversused many external discrete components, resulting incumbersome solutions. The LT®3799 solves complexity,space and performance problems by integrating all therequired functions for offl ine LED lighting.
上传时间： 2013-10-13
上传用户：dongqiangqiang
数字控制的交流调速系统所选用的微处理器、功率器件及产生PWM波的方法是影响交流调速系统性能好坏的直接因素。在介绍了正弦脉宽调制(SPWM)技术的基础上，设计了一种以8098单片机作为控制器，以智能功率模块IPM为开关器件的变频调速系统。通过软件编程，产生正弦脉冲宽度调制波形来控制绝缘栅双极晶体管的导通和关断，从而达到控制异步电动机转速的目的。实验结果表明，该系统可调频率调电压，稳定度高，调速范围宽，具有较强的实用价值 Abstract: AC variable speed with digital control systems used microprocessors， power devices and generate PWM wave is the direct factors of affecting the performance AC speed regulation system. On the basis of introducing the sinusoidal pulse width modulation (SPWM) technology，this paper designed variable speed system which used 8098 as a controller， intelligent power module IPM as switching device. Through software programming， resulting in sinusoidal pulse width modulation waveform to control the insulated gate bipolar transistor turn on and off， so as to achieve the purpose of speed control of induction motors. Experimental results show that the system can adjust frequency modulation voltage， high stability， wide speed range， has a strong practical value.
上传时间： 2013-11-14
上传用户：ynwbosss
Luminary Micro provides an analog-to-digital converter (ADC) module on some members of theStellaris microcontroller family. The hardware resolution of the ADC is 10 bits; however, due to noiseand other accuracy-diminishing factors, the true accuracy is less than 10 bits. This application noteprovides a software-based oversampling technique, resulting in an improved Effective Number OfBits (ENOB) in the conversion result. This document describes methods of oversampling an inputsignal, and the impact on precision and overall system performance.
标签： Oversampling Techniques ADC fo
上传时间： 2013-12-17
上传用户：zhyiroy
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-10-22
上传用户：ztj182002
The information in this specification is subject to change without notice.Use of this specification for product design requires an executed license agreement from the CompactFlashAssociation.The CompactFlash Association shall not be liable for technical or editorial errors or omissions contained herein; norfor incidental or consequential damages resulting from the furnishing, performance, or use of this material.All parts of the CompactFlash Specification are protected by copyright law and all rights are reserved. Thisdocumentation may not, in whole or in part, be copied, photocopied, reproduced, translated, or reduced to anyelectronic medium or machine readable form without prior consent, in writing, from the CompactFlash Association.The CFA logo is a trademark of the CompactFlash Association.Product names mentioned herein are for identification purposes only and may be trademarks and/or registeredtrademarks of their respective companies.© 1998-99, CompactFlash Association. All rights reserved.
标签： 技术资料
上传时间： 2013-10-07
上传用户：stewart·
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-11-20
上传用户：不懂夜的黑
