thermal power
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查看全部 464 份 →Thermal considerations for advanced logic families (Futurebus+, ABT and MULTIBYTE)
Thermal characteristics of integrated circuitpackages have been and increasingly will bea ma...
Thermal transient characterization methodology for single-die and stacked structures
Thermal transient characterization methodology for single-die and stacked structures:High-power semi...
HFAN-08.1: Thermal Considerations of QFN and Other Exposed-Paddle Packages
Abstract: This application note will give a brief introduction to thermal theory and general layout...
Simplified Approach for Predicting Dynamic Thermal Behavior of Switching Electronic Devices
Simplified Approach for Predicting Dynamic Thermal Behavior of Switching Electronic Devices:Abstract...
High Power Class D Audio Power Amplifier using IR2011S
The IRAUDAMP1 is an example of a simple complete class D audio power amplifier design usingthe IR...