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通讯/手机编程 CDMA 2000第三层协议标准 Upper Layer (Layer 3) Signaling Standard for cdma2000 Standards for Spread Spect
CDMA 2000第三层协议标准
Upper Layer (Layer 3) Signaling
Standard for cdma2000 Standards
for Spread Spectrum Systems
单片机开发 Program-controlled switching technology, introduced on the 7th and signaling technology exchange pro
Program-controlled switching technology, introduced on the 7th and signaling technology exchange program
系统设计方案 In 揚erformance of multi-carrier DS CDMA Systems?we apply a multi-carrier signaling technique to a di
In 揚erformance of multi-carrier DS CDMA Systems?we apply a multi-carrier signaling technique to a direct-sequence CDMA system, where a data sequence multiplied by a spreading sequence modulates multiple carriers, rather than a single carrier. The receiver provides a correlator for each carrier, and ...
其他书籍 DSSS Signaling for Range Estimation
DSSS Signaling for Range Estimation
学术论文 基于FPGA的数字射频存储器设计
数字射频存储器(Digital Radio FreqlJencyr：Memory DRFM)具有对射频信号和微波信号的存储、处理及传输能力，已成为现代雷达系统的重要部件。现代雷达普遍采用了诸如脉冲压缩、相位编码等更为复杂的信号处理技术，DRFM由于具有处理这些相干波形的能力，被越来越广泛地应用于电子对抗领域作为射频频率源。目前，国内外对DRFM ...
单片机编程 3-V TO 5.5-V MULTICHANNEL RS-2
The MAX3243E device consists of three line drivers, five line receivers, and a dual charge-pump circuit with±15-kV ESD (HBM and IEC61000-4-2, Air-Gap Discharge) and ±8-kV ESD (IEC61000-4-2, Contact Discharge)protection on serial-port connection pins. The device meets the requirements of TIA/EIA-23 ...
嵌入式综合 PICMG_COM_0_R2_0COMe规范--原文资料
A Computer-On-Module, or COM, is a Module with all components necessary for a bootable host computer, packaged as a super component. A COM requires a Carrier Board to bring out I/O and to power up. COMs are used to build single board computer solutions and offer OEMs fast time-to-market with reduced ...
其他书籍 The Cyclone® III PCI development board provides a hardware platform for developing and prototypi
The Cyclone&reg III PCI development board provides a hardware platform for developing and
prototyping low-power, high-performance, logic-intensive PCI-based designs. The board provides a
high-density of the memory to facilitate the design and development of FPGA designs which need
huge memory storag ...
USB编程 High volume USB 2.0 devices will be designed using ASIC technology with embedded USB 2.0 support. F
High volume USB 2.0 devices will be designed using ASIC technology with embedded USB 2.0 support.
For full-speed USB devices the operating frequency was low enough to allow data recovery to be handled
in a vendors VHDL code, with the ASIC vendor providing only a simple level translator to meet the U ...
VHDL/FPGA/Verilog High volume USB 2.0 devices will be designed using ASIC technology with embedded USB 2.0 support. F
High volume USB 2.0 devices will be designed using ASIC technology with embedded USB 2.0 support.
For full-speed USB devices the operating frequency was low enough to allow data recovery to be handled
in a vendors VHDL code, with the ASIC vendor providing only a simple level translator to meet the U ...