The MAX2691 low-noise amplifier (LNA) is designed forGPS L2 applications. Designed in Maxim’s advancedSiGe process, the device achieves high gain andlow noise figure while maximizing the input-referred 1dBcompression point and the 3rd-order intercept point. TheMAX2691 provides a high gain of 17.5dB and sub 1dBnoise figure.
标签： Amplifier Low-Noise 2691 Band
上传时间： 2014-12-04
上传用户：zaocan888
Sensors for pressure, load, temperature, acceleration andmany other physical quantities often take the form of aWheatstone bridge. These sensors can be extremely linearand stable over time and temperature. However, mostthings in nature are only linear if you don’t bend them toomuch. In the case of a load cell, Hooke’s law states that thestrain in a material is proportional to the applied stress—as long as the stress is nowhere near the material’s yieldpoint (the “point of no return” where the material ispermanently deformed).
上传时间： 2013-11-13
上传用户：墙角有棵树
PCB LAYOUT 術語解釋(TERMS)1. COMPONENT SIDE(零件面、正面)︰大多數零件放置之面。2. SOLDER SIDE(焊錫面、反面)。3. SOLDER MASK(止焊膜面)︰通常指Solder Mask Open 之意。4. TOP PAD︰在零件面上所設計之零件腳PAD，不管是否鑽孔、電鍍。5. BOTTOM PAD：在銲錫面上所設計之零件腳PAD，不管是否鑽孔、電鍍。6. POSITIVE LAYER：單、雙層板之各層線路；多層板之上、下兩層線路及內層走線皆屬之。7. NEGATIVE LAYER：通常指多層板之電源層。8. INNER PAD：多層板之POSITIVE LAYER 內層PAD。9. ANTI-PAD：多層板之NEGATIVE LAYER 上所使用之絕緣範圍，不與零件腳相接。10. THERMAL PAD：多層板內NEGATIVE LAYER 上必須零件腳時所使用之PAD，一般稱為散熱孔或導通孔。11. PAD (銲墊)：除了SMD PAD 外，其他PAD 之TOP PAD、BOTTOM PAD 及INNER PAD 之形狀大小皆應相同。12. Moat : 不同信號的 Power& GND plane 之間的分隔線13. Grid : 佈線時的走線格點2. Test Point : ATE 測試點供工廠ICT 測試治具使用ICT 測試點 LAYOUT 注意事項:PCB 的每條TRACE 都要有一個作為測試用之TEST PAD(測試點)，其原則如下：1. 一般測試點大小均為30-35mil，元件分布較密時，測試點最小可至30mil.測試點與元件PAD 的距離最小為40mil。2. 測試點與測試點間的間距最小為50-75mil，一般使用75mil。密度高時可使用50mil,3. 測試點必須均勻分佈於PCB 上，避免測試時造成板面受力不均。4. 多層板必須透過貫穿孔(VIA)將測試點留於錫爐著錫面上(Solder Side)。5. 測試點必需放至於Bottom Layer6. 輸出test point report(.asc 檔案powerpcb v3.5)供廠商分析可測率7. 測試點設置處:Setuppadsstacks
上传时间： 2013-10-22
上传用户：pei5
LAYOUT REPORT .............. 1 目錄.................. 1 1. PCB LAYOUT 術語解釋(TERMS)......... 2 2. Test Point : ATE 測試點供工廠ICT 測試治具使用............ 2 3. 基準點 (光學點) -for SMD:........... 4 4. 標記 (LABEL ING)......... 5 5. VIA HOLE PAD................. 5 6. PCB Layer 排列方式...... 5 7.零件佈置注意事項 (PLACEMENT NOTES)............... 5 8. PCB LAYOUT 設計............ 6 9. Transmission Line ( 傳輸線 )..... 8 10.General Guidelines – 跨Plane.. 8 11. General Guidelines – 繞線....... 9 12. General Guidelines – Damping Resistor. 10 13. General Guidelines - RJ45 to Transformer................. 10 14. Clock Routing Guideline........... 12 15. OSC & CRYSTAL Guideline........... 12 16. CPU
上传时间： 2013-12-20
上传用户：康郎
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
上传时间： 2013-11-10
上传用户：1595690
G5177为致新科技为移动电源领域量身打造的2A输出同步升压IC,效率高达90%以上，价格便宜，周边电子元件少，省肖特基和关断MOS,整体成本大大降低，是移动电源和移动电源+WIFI方案的首选。 我们还有1A同步升压产品可以P2P选择。
上传时间： 2013-10-12
上传用户：tb_6877751
两节锂电充电IC-ASC8512 ASC8512 为开关型两节锂聚合物电池充电管理芯片，非常适合于便携式设备的充电管理应用。ASC8512 集内置功率MOSFET、高精度电压和电流调节器、预充、充电状态指示和充电截止等功能于一体，采用TSSOP-14、SSOP-14两种封装形式。ASC8512对电池充电分为三个阶段：预充（Pre-charge）、恒流（CC／Constant Current）、恒压（CV／Constant Voltage）过程，恒流充电电流通过外部电阻决定，最大充电电流为2A.ASC8512 集成电流限制、短路保护，确保充电芯片安全工作。ASC8512 集成NTC 热敏电阻接口，可以采集、处理电池的温度信息，保证充电电池的安全工作温度。 两节锂电池充电IC ASC8512特点： 1.充2节锂离子和锂聚合物电池 2.开关频率达400K 3.充电电流最大可做2A 4.输入电压9V到18V 5.电池状态检测 6.恒压充电电压值可通过外接电阻微调 7.千分之五的充电电压控制精度 5.防反向保护电路可防止电池电流倒灌 6.NTC 热敏接口监测电池温度 7.LED充电状态指示 8.工作环境温度范围：-20℃～70℃ 9.TSSOP-14 应用领域：应用 ●手持设备，包括医疗手持设备 ●Portable-DVD，PDA，移动蜂窝电话及智能手机 ●上网本、平板电脑、MID ●自充电电池组
上传时间： 2013-11-06
上传用户：chfanjiang
ASC8511 是开关式、单节锂电池充电管理芯片,采用峰值电流模控制的BUCK 拓扑结构，最大充电电流可达2.5A. ASC8511 通过恒压控制环（CV）和恒流控制环（CC）来调整锂电池充电电压和恒流充电电流.ASC8511 集成电池过温保护、充电时间限制、输出短路等保护功能，通过NTC 检测电池温度，可以实现电池过热保护功能，两个LED 指示灯指示电池充电状态.ASC8511 采用16 脚T-SSOP 封装. 特点 ● 充电电压精度0.5% ● 最大充电电流2.5A ● 自耗电小于5uA ● 电阻可编程调节恒流充电电流 ● 开关频率500KHZ ● 适用于单节锂电池充电 ● 软启动 ● 电池过温保护 ● 芯片过热保护 ● 状态指示 ● 环境温度范围: -20℃～70℃ ● 16 脚T-SSOP 封装 应用 ● 手持设备、POS机 ● MID、数码产品 ● 移动DVD ● 笔记本、对讲机
上传时间： 2013-11-22
上传用户：13788529953
精确度0.05%满刻度±1位数（Accuracy 0.05%F.S.±1digit） 可测量交直流电流/交直流电压/电位计/传送器/Pt-100/荷重元/电阻等信号（Measuring DCA/DCV/ACA/ACV/Potentiometer/Transmitter/Pt-100/Load Cell/Resistor/etc……） 显示范围0-19999可任意规划（Programmable rate 0 to 1999 digit） 小数点可任意规划（Decimal point can be modified） 尺寸小，稳定性高（Dimension small & High stability）
上传时间： 2014-01-25
上传用户：RQB123
The LTC®3414 offers a compact and efficient voltage regulatorsolution for point of load conversion in electronicsystems that require low output voltages (down to 0.8V)from a 2.5V to 5V power bus. Internal power MOSFETswitches, with only 67mW on-resistance, allow theLTC3414 to deliver up to 4A of output current with efficiencyas high as 94%. The LTC3414 saves space by operatingwith switching frequencies as high as 4MHz, enabling theuse of tiny inductors and capacitors.
上传时间： 2014-01-03
上传用户：dongbaobao
