XAPP740利用AXI互联设计高性能视频系统
This application note covers the design considerations of a system using the performance features of the LogiCORE™ IP Advanced eXtensible Int...
This application note covers the design considerations of a system using the performance features of the LogiCORE™ IP Advanced eXtensible Int...
XAPP520将符合2.5V和3.3V I/O标准的7系列FPGA高性能I/O Bank进行连接 The I/Os in Xilinx® 7 series FPGAs are classified as either high range (HR) or high per...
Xilinx FPGAs require at least two power supplies: VCCINTfor core circuitry and VCCO for I/O interface. For the latestXilinx FPGAs, includin...
【摘要】本文结合作者多年的印制板设计经验,着重印制板的电气性能,从印制板稳定性、可靠性方面,来讨论多层印制板设计的基本要求。【关键词】印制电路板;表面贴装器件;高密度互连;通孔【Key words】Printed Circuit Board;Surface Mounting Device;High ...
The LogiCORE™ GTP Wizard automates the task of creating HDL wrappers to configure the high-speed serial GTP transceivers in Virtex™-5 LXT ...