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high-performance

  • XAPP105 - CPLD VHDL介绍

    This introduction covers the fundamentals of VHDL as applied to Complex ProgrammableLogic Devices (CPLDs). Specifically included are those design practices that translate soundlyto CPLDs, permitting designers to use the best features of this powerful language to extractoptimum performance for CPLD designs.

    标签: XAPP CPLD VHDL 105

    上传时间: 2013-11-21

    上传用户:gtf1207

  • XAPP1065 - 利用Spartan-6 FPGA设计扩频时钟发生器

      Consumer display applications commonly use high-speed LVDS interfaces to transfer videodata. Spread-spectrum clocking can be used to address electromagnetic compatibility (EMC)issues within these consumer devices. This application note uses Spartan®-6 FPGAs togenerate spread-spectrum clocks using the DCM_CLKGEN primitive.

    标签: Spartan XAPP 1065 FPGA

    上传时间: 2013-11-01

    上传用户:hjkhjk

  • XAPP708 -133MHz PCI-X到128MB DDR小型DIMM存储器桥

      The Virtex-4 features, such as the programmable IDELAY and built-in FIFO support, simplifythe bridging of a high-speed, PCI-X core to large amounts of DDR-SDRAM memory. Onechallenge is meeting the PCI-X target initial latency specification. PCI-X Protocol Addendum tothe PCI Local Bus Specification Revision 2.0a ([Ref 6]) dictates that when a target signals adata transfer, "the target must do so within 16 clocks of the assertion of FRAME#." PCItermination transactions, such as Split Response/Complete, are commonly used to meet thelatency specifications. This method adds complexity to the design, as well as additional systemlatency. Another solution is to increase the ratio of the memory frequency to the PCI-X busfrequency. However, this solution increases the required power and clock resource usage.

    标签: PCI-X XAPP DIMM 708

    上传时间: 2013-11-24

    上传用户:18707733937

  • WP328-FPGA的语音数据融合

      The SDI standards are the predominant standards for uncompressed digital videointerfaces in the broadcast studio and video production center. The first SDI standard,SD-SDI, allowed standard-definition digital video to be transported over the coaxial cableinfrastructure initially installed in studios to carry analog video. Next, HD-SDI wasto support high-definition video. Finally, dual link HD-SDI and 3G-SDIdoubled the bandwidth of HD-SDI to support 1080p (50 Hz and 60 Hz) and other videoformats requiring more bandwidth than HD-SDI provides.

    标签: FPGA 328 WP 语音

    上传时间: 2013-12-08

    上传用户:liansi

  • WP409利用Xilinx FPGA打造出高端比特精度和周期精度浮点DSP算法实现方案

    WP409利用Xilinx FPGA打造出高端比特精度和周期精度浮点DSP算法实现方案: High-Level Implementation of Bit- and Cycle-Accurate Floating-Point DSP Algorithms with Xilinx FPGAs

    标签: Xilinx FPGA 409 DSP

    上传时间: 2013-10-21

    上传用户:huql11633

  • WP369可扩展式处理平台-各种嵌入式系统的理想解决方案

    WP369可扩展式处理平台-各种嵌入式系统的理想解决方案 :Delivering unrivaled levels of system performance,flexibility, scalability, and integration to developers,Xilinx's architecture for a new Extensible Processing Platform is optimized for system power, cost, and size. Based on ARM's dual-core Cortex™-A9 MPCore processors and Xilinx’s 28 nm programmable logic,the Extensible Processing Platform takes a processor-centric approach by defining a comprehensive processor system implemented with standard design methods. This approach provides Software Developers a familiar programming environment within an optimized, full featured,powerful, yet low-cost, low-power processing platform.

    标签: 369 WP 扩展式 处理平台

    上传时间: 2013-10-18

    上传用户:cursor

  • FPGA设计重利用方法(Design Reuse Methodology)

      FPGAs have changed dramatically since Xilinx first introduced them just 15 years ago. In thepast, FPGA were primarily used for prototyping and lower volume applications; custom ASICswere used for high volume, cost sensitive designs. FPGAs had also been too expensive and tooslow for many applications, let alone for System Level Integration (SLI). Plus, the development

    标签: Methodology Design Reuse FPGA

    上传时间: 2013-11-01

    上传用户:shawvi

  • 基于FPGA的光纤光栅解调系统的研究

     波长信号的解调是实现光纤光栅传感网络的关键,基于现有的光纤光栅传感器解调方法,提出一种基于FPGA的双匹配光纤光栅解调方法,此系统是一种高速率、高精度、低成本的解调系统,并且通过引入双匹配光栅有效地克服了双值问题同时扩大了检测范围。分析了光纤光栅的测温原理并给出了该方案软硬件设计,综合考虑系统的解调精度和FPGA的处理速度给出了基于拉格朗日的曲线拟合算法。 Abstract:  Sensor is one of the most important application of the fiber grating. Wavelength signal demodulating is the key techniques to carry out fiber grating sensing network, based on several existing methods of fiber grating sensor demodulation inadequate, a two-match fiber grating demodulation method was presented. This system is a high-speed, high precision, low-cost demodulation system. And by introducing a two-match grating effectively overcomes the problem of double value while expands the scope of testing. This paper analyzes the principle of fiber Bragg grating temperature and gives the software and hardware design of the program. Considering the system of demodulation accuracy and processing speed of FPGA,this paper gives the curve fitting algorithm based on Lagrange.

    标签: FPGA 光纤光栅 解调系统

    上传时间: 2013-10-10

    上传用户:zxc23456789

  • 多层印制板设计基本要领

    【摘要】本文结合作者多年的印制板设计经验,着重印制板的电气性能,从印制板稳定性、可靠性方面,来讨论多层印制板设计的基本要求。【关键词】印制电路板;表面贴装器件;高密度互连;通孔【Key words】Printed Circuit Board;Surface Mounting Device;High Density Interface;Via一.概述印制板(PCB-Printed Circuit Board)也叫印制电路板、印刷电路板。多层印制板,就是指两层以上的印制板,它是由几层绝缘基板上的连接导线和装配焊接电子元件用的焊盘组成,既具有导通各层线路,又具有相互间绝缘的作用。随着SMT(表面安装技术)的不断发展,以及新一代SMD(表面安装器件)的不断推出,如QFP、QFN、CSP、BGA(特别是MBGA),使电子产品更加智能化、小型化,因而推动了PCB工业技术的重大改革和进步。自1991年IBM公司首先成功开发出高密度多层板(SLC)以来,各国各大集团也相继开发出各种各样的高密度互连(HDI)微孔板。这些加工技术的迅猛发展,促使了PCB的设计已逐渐向多层、高密度布线的方向发展。多层印制板以其设计灵活、稳定可靠的电气性能和优越的经济性能,现已广泛应用于电子产品的生产制造中。下面,作者以多年设计印制板的经验,着重印制板的电气性能,结合工艺要求,从印制板稳定性、可靠性方面,来谈谈多层制板设计的基本要领。

    标签: 多层 印制板

    上传时间: 2013-10-08

    上传用户:zhishenglu

  • 高性能覆铜板的发展趋势及对环氧树脂性能的新需求

    讨论、研究高性能覆铜板对它所用的环氧树脂的性能要求,应是立足整个产业链的角度去观察、分析。特别应从HDI多层板发展对高性能CCL有哪些主要性能需求上着手研究。HDI多层板有哪些发展特点,它的发展趋势如何——这都是我们所要研究的高性能CCL发展趋势和重点的基本依据。而HDI多层板的技术发展,又是由它的应用市场——终端电子产品的发展所驱动(见图1)。 图1 在HDI多层板产业链中各类产品对下游产品的性能需求关系图 1.HDI多层板发展特点对高性能覆铜板技术进步的影响1.1 HDI多层板的问世,对传统PCB技术及其基板材料技术是一个严峻挑战20世纪90年代初,出现新一代高密度互连(High Density Interconnection,简称为 HDI)印制电路板——积层法多层板(Build—Up Multiplayer printed board,简称为 BUM)的最早开发成果。它的问世是全世界几十年的印制电路板技术发展历程中的重大事件。积层法多层板即HDI多层板,至今仍是发展HDI的PCB的最好、最普遍的产品形式。在HDI多层板之上,将最新PCB尖端技术体现得淋漓尽致。HDI多层板产品结构具有三大突出的特征:“微孔、细线、薄层化”。其中“微孔”是它的结构特点中核心与灵魂。因此,现又将这类HDI多层板称作为“微孔板”。HDI多层板已经历了十几年的发展历程,但它在技术上仍充满着朝气蓬勃的活力,在市场上仍有着前程广阔的空间。

    标签: 性能 发展趋势 覆铜板 环氧树脂

    上传时间: 2013-11-19

    上传用户:zczc