《器件封装用户向导》赛灵思产品封装资料
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic pa...
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探索form技术的精髓，这里汇集了307个精选资源，专为电子工程师打造。从基础表单设计到复杂的数据处理，涵盖Web开发、嵌入式系统等多个领域，助力您掌握高效数据收集与处理技能。无论是初学者还是资深开发者，都能在这里找到宝贵的学习资料和技术文档，提升项目开发效率与质量。立即加入，开启您的form技术进阶之旅！
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查看全部307个资源 »Virtex-6 FPGA PCB设计手册
Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the develo...
CPLD库指南
Xilinx is disclosing this user guide, manual, release note, and/or specification (the “Documentation”) to you solely for use in the dev...
HITECH与电脑的通信协议
1 Communication Protocol (Computer as master) The communication protocol describes here allow...
PICMG_COM_0_R2_0COMe规范--原文资料
A Computer-On-Module, or COM, is a Module with all components necessary for a bootable host computer, packaged as a super component. A COM requires a ...
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