die
共 39 篇文章
die 相关的电子技术资料，包括技术文档、应用笔记、电路设计、代码示例等，共 39 篇文章，持续更新中。
K4S641632
深入了解K4S641632这款64Mb K-die SDRAM，从基本架构到高级特性，逐步剖析其工作原理与应用。无论你是初学者还是有经验的开发者，这份文档都能助你掌握关键概念和技术细节，让你在设计和调试中游刃有余。
K4T1G164QQ-HCE6
K4T1G164QQ-HCE6
1Gb Q-die DDR2 SDRAM Specification
60FBGA & 84FBGA with Lead-Free & Halogen-Free
APD换Die时，如果finger没有net，如何做wirebond auto assign
<P>APD 换Die 时，如果 finger 没有net，如何做wirebond auto assign ?<BR>1. 前言<BR>在设计substrate 时，经常遇到客户不断的修
M14C32串行EEPROM管芯简介
PRODUCT M14C32<BR>n WAFER SIZE 152 mm (6 inches)<BR>n DIE IDENTIFICATION M14C32KA_R<BR>n DIE SIZE (X
M14C04 串行EEPROM管芯简介
PRODUCT M14C04<BR>n WAFER SIZE 152 mm (6 inches)<BR>n DIE IDENTIFICATION M14C04KA_R<BR>n DIE SIZE (X
M14C16串行EEPROM管芯简介
PRODUCT M14C16<BR>n WAFER SIZE 152 mm (6 inches)<BR>n DIE IDENTIFICATION M14C16KA_R<BR>n DIE SIZE (X
AT28C16系列并行EEPROM芯片产品的介绍
Atmel Parallel EEPROMs are available in die form. All die products are 100% electrically<BR>tested i
Thermal transient characterization methodology for single-die and stacked structures
Thermal transient characterization methodology for single-die and stacked structures:High-power semi
K4S510432B-UC75.rar
512Mb B-die SDRAM Specification - [ SAMSUNG ] 详细图片规格评论元器件型号: K4S510432B-UC75
中文描述: 512MB的乙芯片内存规格 XK4S510432B-UC75 512MB Samsung
基于51单片机的温室自动灌溉系统设计
<p>目前在温室中使用广泛的灌溉系统多为人工控制灌溉系统,不仅容易造成资源浪费,而且可能因不适量浇灌或停止浇灌不及时导致农作物枯死或溺亡,造成极大的经济损失。针对这一问题,本文设计了一个基于单片机的温室自动灌溉系统。该系统以AT89C51单片机及其外围电路作为控制部分的主机电路,采用YL-69土壤湿度传感器作为检测温室条件下土壤湿度的检测元件,实现高效、节约的自动化灌溉,具有较好的应用价值。</p
LQFP,TQFP,QFP,CQFP封装尺寸表
<p>Low Profile Quad Flat Pack (LQFP) packages provide the same benefit of the metric QFP packages, but are thinner (body thickness of 1.4mm) and have a standard lead-frame footprint (2.0mm lead footpr
IC芯片封装测试工艺流程
<p>Package--封装体：</p><p>>指芯片（Die)和不同类型的框架（L/F）和塑封料（EMC）<br/></p><p>形成的不同外形的封装体。<br/></p><p>>IC Package种类很多，可以按以下标准分类：<br/></p><p>·按封装材料划分为：<br/></p><p>金属封装、陶瓷封装、塑料封装<br/></p><p>·按照和PCB板连接方式分为：PTH
PW4055_2.0.pdf规格书下载
<p>The PW4055 is a complete constant-current /constant-voltage linear charger for single cell lithiumion batteries.Its ThinSOT package and low external component count make the PW4055 ideally<br/>suit
Power Electronics Handbook, 3 Edition
There have been many developments in the field of power electronics since<br />
the publication of the second edition, almost five years ago. Devices have<br />
bec
Snunuiot are flying as far as you send them... and then they die ha ha ha
Snunuiot are flying as far as you send them... and then they die ha ha ha
s3c2440 backlight driver.SAMSUNG s S3C2440A 16/32-bit RISC microprocessor. SAMSUNG鈥檚 S3C2440A is de
s3c2440 backlight driver.SAMSUNG s S3C2440A 16/32-bit RISC microprocessor. SAMSUNG鈥檚 S3C2440A is
designed to provide hand-held devices and general applications with low-power, and high-performance mi
quick die changes
quick die changes
* The functions debug_init() and debug() implement non-RTOS * serial port initialization and a blo
* The functions debug_init() and debug() implement non-RTOS
* serial port initialization and a blocked debug output. The
* debug() function can be used in error message and die
* situations.
Der Aufbau eines kleinen Frequenzzä hers ist dank der heutigen Atmel AVR Controller oder aber au
Der Aufbau eines kleinen Frequenzzä hers ist dank der heutigen Atmel AVR Controller oder aber auch der Mikrochip PIC Controller (um nur zwei zu nennen) relativ schnell und einfach aufzubauen. Dazu
零晶体管IC-IC设计一个新高度
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Abstract: We can apply a BiCMOS integrated circuit with only resistors and no transistors to solve adifficult design problem. The mythically perfect operational amplifier's gain and tempera