PCB Design Considerations and Guidelines for 0.4mm and 0.5mm WLPs
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit b...
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit b...
C8051FXXX PCB design notes...
多远程二极管温度传感器-Design Considerations for pc thermal management Multiple RDTS (remote diode temperature sensing) provides the most accurate method of sens...
The main objective of this book is to present all the relevant informationrequired for RF and micro-wave power amplifier design includingwell-known ...
RF circuit design theory and application(射频电路设计)...