density
共 127 篇文章
density 相关的电子技术资料，包括技术文档、应用笔记、电路设计、代码示例等，共 127 篇文章，持续更新中。
基于FPGA的超声骨密度测量系统的设计.rar
近年来，生活水平的提高，人的寿命的延长，导致人口老龄化日趋明显，从而使骨质疏松症(Osteoporosis，OP)患者日益增多并引起了全社会的关注，骨质疏松症的诊断和治疗也相应地成为了国际学术界和医学界研究的热点。骨密度(BoneMineral Density，BMD)的测量是诊断骨质疏松症的主要依据。目前骨密度的测量方法主要有单光子吸收法(SPA)、双光子吸收法(DPA)、单能X射线吸收法(SX
基于STM单片机的粉尘浓度传感器设计研究
<p>煤矿建设和生产过程中,掘进、采煤、运输等环节都会产生大量的粉尘,损害井下人员健康,同时成为危害煤矿安全生产的一大隐患。利用光散射原理,对基于STM32F103RBT6单片机控制的粉尘浓度传感器硬件和软件进行了设计研究。该传感器具有结构简单、精度良好、可靠性高等特点,完全可满足现场使用需求,应用前景广阔。</p><p>During the process of the mine constru
stm32f103rf.rar
STM32F103xFXL-density performance line ARM-based 32-bit MCU with 768 KB to
1 MB Flash, USB, CAN, 17 timers, 3 ADCs, 13 communication interfaces
基于单片机的管道泄漏检测报警系统的设计与实现
<p>本设计的管道泄漏检测和报警系统以AT89C51单片机为控制核心,采用压力传感器YYYL100实现对管道内的压力的检测,使用MQ-2可燃气体检测传感器检测管道外部的可燃气体浓度,并具有LCD1602液晶显示电路可以显示当前的管道压力值和可燃气体浓度值。同时用户可以通过按键设管道的压力报警和和可燃气体浓度报警值,当检测值超过报警值得时候通过蜂鸣器和LED指示灯进行声光报警。</p><p>The
基于单片机的水产养殖监控系统设计
<p>针对高密度精养水产养殖,设计了水产养殖监控系统。采用STC15F2K60S2单片机作为主控制器,有效的控制水温、水位、流速、含氧量、pH值,有效提高水产养殖成活率,系统可靠性高。</p><p>In view of high-density intensive aquaculture, the aquaculture monitoring system is designed.STC15 F2
QC-LDPC码的研究与FPGA实现
低密度校验码(Low-Density Parity-Check Codes，LDPC)已经被证明是一类纠错性能逼近香农限的渐近好码。由于低密度校验码具有译码复杂度低、错误平层低等诸多优点，它的良好应用前景已经引起学术界和IT业界的高度重视，也使其成为当今信道编码领域最受瞩目的研究热点之一。QC-LDPC(Quasi-CyclicLDPC)码是LDPC码的一个子类，它在构造、编码和译码等方面，具备了
TE 0.6毫米中心距高速CHAMP扩展坞系列连接器
The docking connector series is designed for high density,low profile(3.8mm)shielded applications featuring two rows of contacts on 0.6mm pitch centerlines.Contacts on a 0.6mm centerline can save 30%
AN2586_stm32硬件开发入门
This application note is intended for system designers who require a hardware
implementation overview of the development board features such as the power supply, the
clock management, the reset cont
STM32F103x4/6 产品型号： STM32F103T4 STM32F103R6 STM32F103R4 STM32F103C6 ST
小容量增强型产品：基于ARM核心的32位微控制器，具有16K或32K字节闪存、USB接口、CAN接口、6个定时器、2个ADC模块和6个通信接口<br>
(Low-density performance line, ARM-based 32-bit MCU with 16 or 32 KB Flash,
USB, CAN, 6 timers, 2 ADC
STM32F103xFG 产品型号： STM32F103ZF STM32F103ZG STM32F103RG STM32F103VG
超大容量增强型产品：基于ARM核心的32位微控制器，具有768K至1M字节闪存、USB、CAN、17个定时器、3个ADC模块和13个通信接口<br>
(XL-density performance line ARM-based 32-bit MCU with 768 KB to 1 MB Flash,
USB, CAN, 17 timers, 3 AD
频谱分析仪DPX® 采集技术基础入门手册
泰克实时频谱分析仪(RSA)采用泰克已获专利的数字荧光技术或DPX®，可以揭示传统频谱分析仪和矢量信号分析仪会完全漏掉的信号细节。
全面运动的 DPX 实时 RF频谱画面显示您以前没有见到的信号，用户可以立即查看信息，大大加快发现和诊断问题的速度。
DPX是所有泰克实时频谱分析仪中的标配功能。通过泰克最近推出的实时DPX时域显示技术，泰克实时频谱分析仪现在变成了实时信号分析仪。
STM32F103RCT6寄存器编程手册 1132页完整版
<p>该文件当为STM32F103RCT6寄存器说明手册，英文版，从ST官网下载，方便大家使用。</p><p>This reference manual is addressed to application developers.</p><p> It provides complete information on how to use the STM32F101xx, STM32F1
LQFP,TQFP,QFP,CQFP封装尺寸表
<p>Low Profile Quad Flat Pack (LQFP) packages provide the same benefit of the metric QFP packages, but are thinner (body thickness of 1.4mm) and have a standard lead-frame footprint (2.0mm lead footpr
5GNR信道编码研究.pdf
<p>5GNR信道编码研究，信道编码是 5G 的关键技术之一，描述了 5G 新空口（NR——New Radio Access）的低密度奇偶校验码（LDPCC——Low Density Parity Check Codes）和 极化码（Polar Codes）的关键技术；通过仿真，比较了5G NR的信道编码方案与 4G LTE信道编码方案的性能。另外，还比较了这2代信道编码技术的复杂度和 吞吐量。
Ansoft0MaxwellV12电机瞬态分析教程
<p>This Getting Started Guide is written for Maxwell beginners and experienced users who would like to quickly re familiarize themselves with the capabilities of MaxwelL.<br/>This guide leads you step
8205A8_2.0.pdf规格书下载
<p>The PW8205A8TS is the highest performance trench N-ch MOSFETs with extreme high cell density,<br/>which provide excellent RDSON and gate charge for most of the small power switching and load<br/>sw
PW2301A_2.0.pdf规格书下载
<p>The PW2301A uses advanced trench It utilizes the latest processing techniques to achieve the high<br/>cell density and reduces the on-resistance with high repetitive avalanche rating. These feature
Methane and Hydrogen for Energy Storage
Commercial energy storage has moved from the margins to the mainstream as it<br />
fosters flexibility in our smarter, increasingly integrated energy systems. The<br />
energy density, availability, a
Chemical mechanical polishing
The planarization technology of Chemical-Mechanical-Polishing (CMP), used for the manufacturing of multi-<br />
level metal interconnects for high-density Integrated Circuits (IC), is also readily ada
ESD Protection Development
The goal of this book is to introduce the simulation methods necessary to describe<br />
the behaviour of semiconductor devices during an electrostatic discharge (ESD).<br />
The challenge of this tas