系统构架师论文论文 系统构架师论文论文 系统构架师论文论文 系统构架师论文论文系统构架师论文论文https://www.eeworm.com/dl/617/195136.htmlhttps://www.eeworm.com/dl/617/195136.html
上传时间： 2021-10-18
上传用户：陈浩
2.7V to 5.5V input voltage Range Efficiency up to 96% 24V Boost converter with 12A switch current Limit 600KHz fixed Switching Frequency Integrated soft-start Thermal Shutdown Under voltage Lockout Support external LDO auxiliary power supply 8-Pin SOP-PP PackageAPPLICATIONSPortable Audio Amplifier Power SupplyPower BankQC 2.0/Type CWireless ChargerPOS Printer Power SupplySmall Motor Power Supply
标签： XR2981
上传时间： 2021-11-05
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This document provides general hardware and layoutconsiderations and guidelines for hardware engineersimplementing a DDR3 memory subsystem.The rules and recommendations in this document serve as aninitial baseline for board designers to begin their specificimplementations, such as fly-by memory topology.
标签： ddr3
上传时间： 2021-11-21
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STM32L475开发板PDF原理图+AD集成3D封装库+主要器件技术手册，集成封装库型号列表如下：Library Component Count : 44Name Description----------------------------------------------------------------------------------------------------ANT-2.4G ANT,2.4G,PCB天线ATK-TEST-1*4-2.54mm 测试点ATK_MODULE 单排母,1*6,2.54mmBEEP 3.3V有源蜂鸣器BUTTON_DIP3 拨动开关SS-12F44C-0402-SMD C-0603-SMD C-CAP-SMD-220uF/10V C-CEP-220uF/16V D-1N4148 Header-1*3-2.54mm 单排针-2.54mmHeader-2*10-2.54mm 双排针-2.54mmHeader-2*2-2.54mm 双排针-2.54mmHeader-2*3-2.54mm 双排针-2.54mmHeader-2*4-2.54mm 双排座-2.54mmIR-LED 1206红外发射管（侧）IR-LF0038GKLL-1 红外接收管SMDJ-MICRO-USB-5S Micro USB 5.9有柱脚长1.25加长针L-0420-4.7uH 电感,4.7uH,3ALCD-TFT-H13TS38A LCD,TFT,1.3'240*240,禹龙LED-0603-RED 发光二极管-红色LED-RGB-1615-0603 RGB,共阳,1615,0603MIC-6022 MICMotor-SMD 电机,SMDPhone-3-M 耳机座,三节R-0402-SMD 贴片电阻R-0805-SMD 贴片电阻RT9193-3.3S-KEY-SMD-324225 KEY,SMD,324225S8050-SMD SD-MICRO-TF SD,MICRO,TFU-AHT10 Sensor,温湿度传感器U-AP3216C Sensor.光照/距离U-AP6181 WIFI Module,SDIOU-ES8388 AUDIO,2-ch DAC,2-ch ADCU-ICM-20608 三轴陀螺仪/三轴加速度计,U-L9110S 电机驱动,800mAU-RT9013-3.3 LDO,500mAU-STM32F103C8T6 U-STM32L475VET6 MCU,LQFP100,512K FLASH,128K RAMU-W25Q128 SPI FLASH,16MY-12M-SMD 晶振 - 12M贴片Y-3215-32.768K XTAL,3215,32.768KY-3215-8M XTAL,3215,8MHz
上传时间： 2021-12-15
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高通(Qualcomm)蓝牙芯片QCC5151_硬件设计详细指导书（官方内部培训手册）共52页其内容是针对硬件设计、部分重要元器件选择(ESD，Filter）及走线注意事项的详细说明。2 Power management 2.1 SMPS 2.1.1 Components specification 2.1.2 Input power supply selection 2.1.3 Minimize SMPS EMI emissions 2.1.4 Internal LDOs and digital core decoupling 2.1.5 Powering external components 2.2 Charger 2.2.1 Charger connections.2.2.2 General charger operation2.2.3 Temperature measurement during charging 2.3 SYS_CTRL 3 Bluetooth radio3.1 RF PSU component choice 3.2 RF band-pass filter3.3 Layout (天线 走线的注意事项)4 Audio4.1 Audio bypass capacitors 4.2 Earphone speaker output4.3 Line/Mic input 4.4 Headphone output optimizition5 LED pads 5.1 LED driver 5.2 Digital/Button input 5.3 Analog input5.4 Disabled 6 Reset pin (Reset#)7 QSPIinterface 8 USB interfaces 8.1 USB device port8.1.1 USB connections8.1.2 Layout notes8.1.3 USB charger detection
上传时间： 2022-01-24
上传用户：XuVshu
高通蓝牙芯片QCC5051详细规格书共有117页，开发人员必备手册 支持蓝牙标准 5.2 ->Quad-core processor architecture ->High-performance programmable Bluetooth stereo audio Soc ->Low power modes to extend battery life. ->Flexible flash programmable platform. ->For wired/wirelss stereo heradsets/headphones application. ->For Qualcomm TrueWirless stereo earbuds application.主要特点如下
上传时间： 2022-01-24
上传用户：shjgzh
高通qualcommon蓝牙芯片QCC3056详细规格书共有112页，开发人员必备手册 支持蓝牙标准5.2 ->Quad-core processor architecture ->High-performance programmable Bluetooth mono audio Soc ->Low power modes to extend battery life. ->For Qualcomm TrueWirless stereo earbuds application.主要特点如下。
上传时间： 2022-01-24
上传用户：zhanglei193
Demo 程序中，HID 和 Audio 单独运行都不会有问题，把 HID 和 Audio 整合在一起，同进传送数据时，会出现Audio 不能传送数据的情况。
上传时间： 2022-02-22
上传用户：aben
CPCI_E标准规范 CompactPCI® Express SpecificationThe documents in this section may be useful for reference when reading the specification. The revision listed for each document is the latest revision at the time this specification was published. Newer revisions of these documents may exist, so refer to the newest revision. Many of these documents are referenced throughout this specification. Refer to the newest revision of the document unless a specific revision is referenced. • PCI Express Base Specification 3.0. PCI Special Interest Group (PCI-SIG). • PCI Express Card Electromechanical (CEM) Specification 3.0. PCI Special Interest Group (PCI-SIG). • PCI Express to PCI/PCI-X Bridge Specification, Rev. 1.0. PCI Special Interest Group (PCI-SIG). • PCI Express Jitter White Paper. PCI Special Interest Group (PCI-SIG). • PCIe Rj Dj BER White Paper. PCI Special Interest Group (PCI-SIG). • PHY Electrical Test Specification for PCI Express Architecture. PCI Special Interest Group (PCI SIG). • System Management Bus (SMBus) Specification, Version 2.0. Smart Battery System Implementer’
标签： CPCIE
上传时间： 2022-02-23
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SCB10H series pressure elements are high performance absolute pressure sensors. The sensors are based on Murata's proven capacitive 3D-MEMS technology. They enable exceptional possibility for OEM customers to integrate pressure measurement function in an optimal way into their products. SCB10H series elements can be designed to match the application specific pressure range. It is a bare capacitive sensor element that enables optimized application specific package and electronics design.
标签： 传感器
上传时间： 2022-03-03
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