Via+on+Pad技术资料下载专区，收录500份相关技术文档、开发源码、电路图纸等优质工程师资源，全部免费下载。
资料->【B】电子技术->【B0】电子技术->【0】电子综合->BFR183W_IC-ON-LINE[1][1].CN.pdf
Package on Package （PoP）技术 从2005年开始，很多元器件供应商就已经在元器件内部采用层叠式的 芯片封装形式，如BGA或者CSP，把两到三种线路层叠在同一个芯片 中。
This serial client in JAVA allows sending, reading and writing of SMS via a serial COM port. The tool uses the PDU SMS f...
·Stereo Matching via Disparity Estimation and Surface Modeling [cvpr07]
The Mythical Man-Month: Essays on Software Engineering is a book on software project management by Fred Brooks, whose ce...
Java/J2EE application framework based on [Expert One-on-One J2EE Design and Development] by Rod Johnson. Includes JavaBe...
Audio driver. This audio driver is developed on lpc2368.This used to develop audio system on LPC23xx
fast calculation of image moments based on Fluss and Tuk s method described in "On the Calculation of Moments"