Thermal considerations for advanced logic families (Futurebus+, ABT and MULTIBYTE)
Thermal characteristics of integrated circuitpackages have been and increasingly will bea ma...
Thermal characteristics of integrated circuitpackages have been and increasingly will bea ma...
TI 430launch pad G2553 之玩转SPI,欢迎大家下载。...
基于Launch_pad自动往返小车报告(程序+原理图+PCB) ,不错的资料,值得学习。谢谢。...
TI TCS2046 Toutch PAD IC Driver for WindowsCE...
焊垫内贯孔(via on pad)检查1. 前言想要smd 焊垫内有贯孔部分,能够显示DRC.2. 说明实体规则中, 焊垫直接连接(Pad/pad direct con...