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  • Telecommunication+Circuit+Design+2nd

    The first edition of this book was published in 1992. Nine years later it had become clear that a second edition was required because of the rapidly changing nature of telecommunication. In 1992, the Internet was in existence but it was not the household word that it is in the year 2001. Cellular telephones were also in use but they had not yet achieved the popularity that they enjoy today. In the current edition, Chapter 1 has been revised to include a Section on the Internet. Chapter 10 is new and it covers the facsimile machine; I had overlooked this important tele- communication device in the first edition. Chapter 11 is also new and it describes the pager, the cordless telephone and the cellular telephone system. These are examples of a growing trend in telecommunications to go ‘‘wireless’’.

    标签: Telecommunication Circuit Design 2nd

    上传时间: 2020-06-01

    上传用户:shancjb

  • Wireless Communications 2nd Edition

    n the first part of this book, we give an introduction to the basic applications of wireless com- munications, as well as the technical problems inherent in this communication paradigm. After a brief history of wireless, Chapter 1 describes the different types of wireless services, and works out their fundamental differences. The subsequent Section 1.3 looks at the same problem from a different angle: what data rates, ranges, etc., occur in practical systems, and especially, what combination of performance measures are demanded (e.g., what data rates need to be transmitted over short distances; what data rates are required over long distances?) Chapter 2 then describes the technical challenges of communicating without wires, putting special emphasis on fading and co-channel interference. Chapter 3 describes the most elementary problem of designing a wireless system, namely to set up a link budget in either a noise-limited or an interference-limited system. After studying this part of the book, the reader should have an overview of different types of wireless services, and understand the technical challenges involved in each of them. The solutions to those challenges are described in the later parts of this book.

    标签: Communications Wireless Edition 2nd

    上传时间: 2020-06-01

    上传用户:shancjb

  • Wireless+Networking+Complete

    This chapter provides extensive coverage of existing mobile wireless technologies. Much of the emphasis is on the highly anticipated 3G cellular networks and widely deployed wireless local area networks (LANs), as the next-generation smart phones are likely to offer at least these two types of connectivity. Other wireless technologies that either have already been commercialized or are undergoing active research and standardization are introduced as well. Because standardization plays a crucial role in developing a new technology and a market, throughout the discussion standards organizations and industry forums or consortiums of some technologies are introduced. In addition, the last Section of this chapter presents a list of standards in the wireless arena.

    标签: Networking Wireless Complete

    上传时间: 2020-06-01

    上传用户:shancjb

  • Fundamentals+of+EM+Design+of+Radar

    In the present era, low observability is one of the critical requirements in aerospace sector, especially related to defense. The stealth technology essentially relates to shaping and usage of radar absorbing materials (RAM) or radar absorbing struc- tures (RAS). The performance of such radar cross Section (RCS) reduction tech- niques is limited by the bandwidth constraints, payload requirements, and other structural issues. Moreover, with advancement of materials science, the structure geometry no longer remains key decisive factor toward stealth.

    标签: Fundamentals Design Radar of EM

    上传时间: 2020-06-06

    上传用户:shancjb

  • NIST Framework and Roadmap

    Under the Energy Independence and Security Act of 2007 (EISA), the National Institute of Standards and Technology (NIST) was assigned “primary responsibility to coordinate development of a framework that includes protocols and model standards for information management to achieve interoperability of Smart Grid devices and systems…” [EISA Section 1305]. 35 This responsibility comes at a time when the electric power grid and electric power industry are undergoing the most dramatic transformation in many decades. Very significant investments are being made by industry and the federal government to modernize the power grid. To realize the full benefits of these investments—and the continued investments forecast for the coming decades—there is a continued need to establish effective smart grid 36 standards and protocols for interoperability.

    标签: Framework Roadmap NIST and

    上传时间: 2020-06-06

    上传用户:shancjb

  • TI反激变换器变压器设计相关资料

    This Section covers the design of power transformers used in buck-derived topologies: forward converter, bridge, half-bridge, and full-wave centertap. Flyback transformers (actually coupled inductors) are covered in a later Section. For more specialized applications, the principles discussed herein will generally apply.

    标签: 反激变换器 变压器

    上传时间: 2021-12-16

    上传用户:fliang

  • 电路设计(英)

    CHAPTER 1: THE OP AMP    CHAPTER 2: OTHER LINEAR CIRCUITS    CHAPTER 3: SENSORS     CHAPTER 4: RF/IF CIRCUITS    CHAPTER 5: FUNDAMENTALS OF SAMPLED DATA SYSTEMS    CHAPTER 6: CONVERTERS     CHAPTER 7: DATA CONVERTER SUPPORT CIRCUITS    CHAPTER 8:  ANALOG FILTERS    CHAPTER 9: POWER MANAGEMENT    CHAPTER 10: PASSIVE COMPONENTS    CHAPTER 11: OVERVOLTAGE EFFECTS ON ANALOG INTEGRATED CIRCUITS    CHAPTER 12: PRINTED CIRCUIT BOARD (PCB) DESIGN ISSUES    CHAPTER 13: DESIGN DEVELOPMENT TOOLS

    标签: 运算放大器 转换器 模拟滤波器

    上传时间: 2021-12-21

    上传用户:wangshoupeng199

  • CPCI_E标准规范 CompactPCI® Express Specification

    CPCI_E标准规范 CompactPCI® Express SpecificationThe documents in this Section may be useful for reference when reading the specification. The  revision listed for each document is the latest revision at the time this specification was published.  Newer revisions of these documents may exist, so refer to the newest revision. Many of these  documents are referenced throughout this specification. Refer to the newest revision of the  document unless a specific revision is referenced. • PCI Express Base Specification 3.0. PCI Special Interest Group (PCI-SIG). • PCI Express Card Electromechanical (CEM) Specification 3.0. PCI Special Interest Group  (PCI-SIG). • PCI Express to PCI/PCI-X Bridge Specification, Rev. 1.0. PCI Special Interest Group  (PCI-SIG). • PCI Express Jitter White Paper. PCI Special Interest Group (PCI-SIG). • PCIe Rj Dj BER White Paper. PCI Special Interest Group (PCI-SIG). • PHY Electrical Test Specification for PCI Express Architecture. PCI Special Interest Group  (PCI SIG). • System Management Bus (SMBus) Specification, Version 2.0. Smart Battery System  Implementer’

    标签: CPCIE

    上传时间: 2022-02-23

    上传用户:GGMD

  • STM32F101和STM32F103固件库中文使用手册

      本手册介绍了 32 位基于 ARM 微控制器 STM32F101xx 与 STM32F103xx 的固件函数库。该函数库是一个固件函数包,它由程序、数据结构和宏组成,包括了微控制器所有外设的性能特征。该函数库还包括每一个外设的驱动描述和应用实例。通过使用本固件函数库,无需深入掌握细节,用户也可以轻松应用每一个外设。因此,使用本固态函数库可以大大减少用户的程序编写时间,进而降低开发成本。每个外设驱动都由一组函数组成,这组函数覆盖了该外设所有功能。每个器件的开发都由一个通用 API(application programming interface 应用编程界面)驱动, API 对该驱动程序的结构,函数和参数名称都进行了标准化。  所有的驱动源代码都符合“Strict ANSI-C”标准(项目于范例文件符合扩充 ANSI-C 标准)。我们已经把驱动源代码文档化,他们同时兼容 MISRA-C 2004 标准(根据需要,我们可以提供兼容矩阵)。由于整个固态函数库按照“Strict ANSI-C”标准编写,它不受不同开发环境的影响。仅对话启动文件取决于开发环境。该固态函数库通过校验所有库函数的输入值来实现实时错误检测。该动态校验提高了软件的鲁棒性。实时检测适合于用户应用程序的开发和调试。但这会增加了成本,可以在最终应用程序代码中移去,以优化代码大小和执行速度。想要了解更多细节,请参阅 Section 2.5。  因为该固件库是通用的,并且包括了所有外设的功能,所以应用程序代码的大小和执行速度可能不是最优的。对大多数应用程序来说,用户可以直接使用之,对于那些在代码大小和执行速度方面有严格要求的应用程序,该固件库驱动程序可以作为如何设置外设的一份参考资料,根据实际需求对其进行调整。

    标签: stm32f101 stm32f103

    上传时间: 2022-04-17

    上传用户:hbsun

  • spi协议英文详解

    In this presentation, we will look at what the Serial Peripheral Interface, otherwise known as the SPI, is. and how it is used to communicate data to and from the PICmicro microcontroller.SPl is frequently used when few 1/O lines are available, but communication between two or more devices must be fast and easy to implement.In this presentation, we will discuss the following topics: We will first cover an Overview of SPI This Section of the tutorial will introduce you to SPI and its concepts.Next, we will examine the use of SPI on the PICmicro MCU.The details of how SPI is implemented on a PICmicro device will be examined.Then, a Code Walkthrough will be given.The walkthough will explore code for both an SPI Master and SPI Slave. The example will have the Master generate data for sending to the slave.Finally, there will be a few resources given at the end of the presentation. These resources will allow you to explore in more detail the SPI interface

    标签: spi协议

    上传时间: 2022-06-19

    上传用户:蓝天小雨