《器件封装用户向导》赛灵思产品封装资料
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic pa...
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic pa...
Xilinx Next Generation 28 nm FPGA Technology Overview Xilinx has chosen 28 nm high-κ metal gate (HKMG) highperformance,low-power process tech...
The LogiCORE™ GTP Wizard automates the task of creating HDL wrappers to configure the high-speed serial GTP transceivers in Virtex™-5 LXT ...
The XPS Ethernetlite peripheral does not provide any mechanism to access the Ethernet PHYregisters. These registers are used to configure auto negot...
针对飞行模拟器座舱数据采集的复杂性,设计了一种基于以太网分布式的数据采集控制系统,该系统是RCM5700微处理器模块上的以太网应用。在系统的基础上具体讨论了PoE技术的应用,在传输数据的网线上同时提供电流,提出并实现了一种包括辅助电源在内的完整可靠的PoE供电方案。设计采用美国国家半导体的LM507...