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Pitch 的查询结果
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电子书籍 pitch=CorrelogramPitch(correlogram, width [, sr, lowPitch, highPitch]) computes the pitch of a cor
pitch=CorrelogramPitch(correlogram, width [, sr, lowPitch, highPitch])
computes the pitch of a correlogram sequence by finding the time lag
with the largest correlation energy.
其他 helicopter fuzzy pid control including pitch and yaw
helicopter fuzzy pid control including pitch and yaw
其他 Helicopter PID control including Pitch and yaw
Helicopter PID control including Pitch and yaw
matlab例程 该程序是日本人用matlab写出来的提取pitch的
该程序是日本人用matlab写出来的提取pitch的，效果很好，唯一的缺点是算的太慢
matlab例程 cepstral analisys for pitch and F0 detection
cepstral analisys for pitch and F0 detection
*行业应用 The is used for pitch calculation
The is used for pitch calculation
PCB相关 PCB Design Considerations and Guidelines for 0.4mm and 0.5mm WLPs
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsidera ...
教程资料 《器件封装用户向导》赛灵思产品封装资料
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes a ...
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Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsidera ...
可编程逻辑 《器件封装用户向导》赛灵思产品封装资料
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes a ...